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PCB Assembly

US$0.20-10.00 / Piece

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What is Customized Medical Equipment PCBA Manufacturing PCB Assembly OEM Electronics Board

Name: Customized Medical Equipment PCBA Manufacturing PCB Assembly OEM Electronics Board
Uploaded: 2026-01-05T03:08:43+08:00
Description: Customized Medical Equipment PCBA Manufacturing PCB Assembly OEM Electronics Board Product Description PCB capability and services: 1. Single-sided, double side & multi-layer PCB. FPC. Flex Rigid

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About this Item

Price

Min. Order Reference FOB Price

10 Pieces US$0.20-10.00 / Piece

Sepcifications

Metal Coating Copper
Mode of Production SMT
Layers Multilayer
Base Material FR-6
Certification RoHS, CCC, ISO
Customized Customized
Condition New
Transport Package Antistatic Package+Plastic Box and Carton Box
Specification Customized
Trademark Customized
Origin Shenzhen China
PCBA-Testing X-ray, Aoi
Processing Electrolytic Foil
SMT Capacity >2 Million Points/Day
DIP Capacity >100K Parts/Day
Min. Space of BGA +/- 0.3mm
Min.Pin Space of IC 0.3mm
Max.Precision of IC Assembly 0.03mm
Surface Finishing Lead-Free HASL
Number of Layers 4-10 Layer
Board Thickness 1.6mm

Product Description

Customized Medical Equipment PCBA Manufacturing PCB Assembly OEM Electronics Board Product Description PCB capability and services: 1. Single-sided, double side &multi-layer PCB. FPC. Flex Rigid PCB with competitive price, good quality and excellent service. 2. CEM-1, CEM-3 FR-4, ...

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Shenzhen Hongzhou Smart Technology Co., Ltd.

Diamond Member Since 2020

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Self Service KIOSK
Management System Certification ISO9001:2015
Address 1/F & 7/F, Phenix Technology Building, Phenix?Community, Baoan District, 518103, Shenzhen, Guangdong, China
ODM Service Available Yes
OEM Service Available Yes

PCB Assembly Comparison

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Transaction Info
	Customized Medical Equipment PCBA Manufacturing PCB Assembly OEM Electronics Board Contact Now	Quick View Fs300r17ke3/Agdr-61c for a/B/B Insulating Pad IGBT Module and Drive Atomation IGBT Contact Now	Quick View Fs300r12ke3/Agdr-62c for a/B/B High-Performance Power Electronics Atomation IGBT Contact Now	Quick View Advanced Automatic Desktop Soldering Robot for Precision Electronics Contact Now	Quick View Reliable Electronic Circuit Boards for Farming Drone Components Contact Now
Price	US$0.20-10.00 / Piece	US$624.00 / Piece	US$624.00 / Piece	US$4,500.00-10,000.00 / Piece	US$0.50-1.00 / Piece
Min Order	10 Pieces	1 Piece	1 Piece	1 Piece	10 Pieces
Payment Terms	T/T	LC, T/T, PayPal, Western Union, Small-amount payment	LC, T/T, PayPal, Western Union, Small-amount payment	-	LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO	RoHS, CCC, ISO, CE	RoHS, CCC, ISO
Management System Certification	ISO9001:2015	-	-	-	-
Trade Capacity
Export Markets	Domestic	Domestic	Domestic	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	ODM	ODM	Own Brand, ODM, OEM	-
Average Lead Time	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: one month	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Metal Coating: Copper; Mode of Production: SMT; Layers: Multilayer; Base Material: FR-6; Customized: Customized; Condition: New; PCBA-Testing: X-ray, Aoi; Processing: Electrolytic Foil; SMT Capacity: >2 Million Points/Day; DIP Capacity: >100K Parts/Day; Min. Space of BGA: +/- 0.3mm; Min.Pin Space of IC: 0.3mm; Max.Precision of IC Assembly: 0.03mm; Surface Finishing: Lead-Free HASL; Number of Layers: 4-10 Layer; Board Thickness: 1.6mm;	Metal Coating: Copper; Mode of Production: DIP; Layers: Single-Layer; Base Material: G-10; Customized: Customized; Condition: Used;	Metal Coating: Copper; Mode of Production: DIP; Layers: Single-Layer; Base Material: G-10; Customized: Customized; Condition: Used;	Metal Coating: Silver; Mode of Production: DIP; Layers: Single-Layer; Base Material: FR-4; Customized: Non-Customized; Condition: New; Application: Electrical & Electronics Industry; Platform Number: 1; Max Move Speed: Y :600-800mm/S. Z:400 mm/S. R :300°; Solder Feeding Speed: 1~50mm/S; Control Mode: Teach Pendant; Max. PCB Size(mm): X500/Y300/Z100mm; Solder Wire: 0.6~1.2mm Solder Wire; Repeate Accuracy: +-0.02mm; Temperature Range: 0-500℃; Driving Mode: Step Motor; Air Pressure: 4.5~6kg/Cm2; Weight: Approx:65kg; Power Supply: AC:220 +-10%,50/60Hz;	Metal Coating: Copper; Mode of Production: SMT; Layers: Multilayer; Base Material: FR-4; Customized: Customized; Condition: New; Shape: DIP; Conductive Type: Bipolar Integrated Circuit; Integration: Gsi; Technics: Semiconductor IC; D/C: Standard; Warranty: 2 Years; Mounting Type: Standard, SMT, DIP; Cross Reference: Standard; Memory Type: Standard;
Supplier Name	Shenzhen Hongzhou Smart Technology Co., Ltd.	Shenzhen Kernal Intelligent Technology Co., Ltd.	Shenzhen Kernal Intelligent Technology Co., Ltd.	Dongguan Mingrui Technology Co., Ltd.	Mu Star (shenzhen) Industry Co., Ltd.
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