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      Printed Circuit Board Assembly
      US$0.76-5.00 / Piece

      PCB Manufacture Mobile Phone Circuit Board OEM Circuit Board 2 Layer Fr4 Assembled PCBA Video

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      10-999 Pieces US$5.00

      1,000-4,999 Pieces US$2.10

      5,000+ Pieces US$0.76

      Sepcifications

      • Dielectric FR-4
      • Material Aluminum Covered Copper Foil Layer
      • Application Consumer Electronics
      • Flame Retardant Properties V0
      • Base Material Aluminum
      • Insulation Materials Organic Resin
      • Brand OEM/ODM
      • Transport Package Antistatic Package+Plastic Box and Carton Box
      • Specification Customized
      • Trademark Customized
      • Origin Shenzhen China
      • PCBA-Testing X-ray, Aoi
      • Processing Electrolytic Foil
      • SMT Capacity >2 Million Points/Day
      • DIP Capacity >100K Parts/Day
      • Certification RoHS, CCC, ISO
      • Min. Space of BGA +/- 0.3mm
      • Min.Pin Space of IC 0.3mm
      • Max.Precision of IC Assembly 0.03mm
      • Surface Finishing Lead-Free HASL
      • Number of Layers 4-10 Layer
      • Board Thickness 1.6mm

      Product Description

      PCB Manufacture Mobile Phone Circuit Board Oem Circuit Board 2 Layer Fr4 Assembled PCBA Files and Requirment for PCB,PCBA quotation: A BOM (Bill of Materials) with reference designators: component description, manufacturer's name and part number. PCB Gerber files. A PCB fabrication drawing and ...

      Learn More

      Printed Circuit Board Assembly Comparison
      Transaction Info
      Price US$0.76-5.00 / Piece US$0.08-0.10 / PCS US$2.00-9.00 / Piece US$1.25-2.34 / Piece US$0.50-3.60 / Piece
      Min Order 10 Pieces 1 PCS 1 Piece 10 Pieces 1 Piece
      Payment Terms T/T LC, T/T, D/P, PayPal, Western Union LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram
      Quality Control
      Product Certification RoHS, CCC, ISO ISO,UL,RoHS - ISO9001/ISO14001/CE/RoHS -
      Management System Certification ISO9001:2015 - Others Others Others
      Trade Capacity
      Export Markets Domestic North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe
      Annual Export Revenue - - - - -
      Business Model ODM, OEM - Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM
      Average Lead Time Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Dielectric: FR-4;
      Material: Aluminum Covered Copper Foil Layer;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Base Material: Aluminum;
      Insulation Materials: Organic Resin;
      Brand: OEM/ODM;
      PCBA-Testing: X-ray, Aoi;
      Processing: Electrolytic Foil;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Min. Space of BGA: +/- 0.3mm;
      Min.Pin Space of IC: 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      Surface Finishing: Lead-Free HASL;
      Number of Layers: 4-10 Layer;
      Board Thickness: 1.6mm;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Aerospace;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Immersional Gold;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Ucreate PCB;
      Board Thickness: 1.2~2.0mm;
      Surface Finihsing: Immersional Gold;
      Lead Time: 6-8 Working Days;
      PCB Testing: E-Testing; Flying Probe Testing;
      Mask Ink Color: White/Black/Green/Red/Yellow/Blue;
      Color: Green Blue Red;
      Number of Layers: Multilayer;
      Copper Thickness: 2oz;
      Condition: Original Made;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Jingxin;
      Type: Combining Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Aluminum Covered Copper Foil Layer;
      Application: Consumer Electronics;
      Flame Retardant Properties: V1;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Metal Composite Materials;
      Brand: Jxpcba;
      Product Type: Custom HDI PCBA;
      Service: One-Stop Turnkey;
      Applicational: Electronics Device/Home Appliances;
      Testing Service: Aoi X-ray Function Test;
      Raw Material: Fr4/Cem-1/Cem-3/Fr1/Aluminum;
      Board Thickness: 0.2mm-7.0mm;
      Layer: 1-32 Layers;
      Solder Mask Color: Blue.Green.Red.Black.White.etc;
      Surface Finishing: HASL\OSP\Immersion Gold;
      Component Packing: Tary, Tube, Tape;
      Maximum Board Size: 640mm*1100mm;
      PCBA Test: Static Test, Power-on Function Test, Power-on Agin;
      PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
      PCB Silkscreen Color: Black, White, Yellow;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Jingxin;
      Supplier Name

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier

      Ucreate PCB Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Jingxin Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Jingxin Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Jingxin Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

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