Mechanically Circuit Board Multilayer PCB for Industrial Control Video

Name: Mechanically Circuit Board Multilayer PCB for Industrial Control
Uploaded: 2025-12-20T12:50:22+08:00
Description: Batch FR4 processing, PCB processing, fiberglass processing 1.6 mm plate thickness Welcome to our selection of Multilayer PCBs, featuring advanced PCB technology and customized circuit boards for your

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Price

Min. Order Reference FOB Price

1 Piece US$0.01-0.08 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Aerospace
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Aluminum
Insulation Materials Organic Resin
Brand Hemeil
Transport Package Vacuum Packaging
Specification 20*20
Trademark hemeil
Origin Dongguan

Product Description

Batch FR4 processing, PCB processing, fiberglass processing 1.6 mm plate thickness Welcome to our selection of Multilayer PCBs, featuring advanced PCB technology and customized circuit boards for your specific needs. Our high-density interconnect boards offer complex PCB layouts and ASIC design ...

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Shenzhen Hemeilin Technology Co., Ltd.

Gold Member Since 2025

Audited Supplier

Business Type Trading Company
Main Products PCB, PCBA
Year of Establishment 2020-12-18
Address Room A5018, Fortune Commercial Building, Xixiang Street, Baoan, Shenzhen, Guangdong, China

Industrial Control PCB Comparison

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Transaction Info
	Mechanically Circuit Board Multilayer PCB for Industrial Control Contact Now	Quick View Factory Customized Wholesale Fully Automatic Washing Machine PCB Printed Circuit Board Ultra HD PCB for Action Camera Contact Now	Quick View Electronic Manufacturing Service PCBA OEM Assembly Manufacturer PCB PCBA Contact Now	Quick View China OEM PCBA Intelligent Manufacturing Circuit Board Double-Sided PCB Board Contact Now	Quick View Electronic Component PCBA Chip Processing SMT Component Installation Contract for Labor Contact Now
Price	US$0.01-0.08 / Piece	US$0.10-1.00 / Piece	US$0.10-1.00 / Piece	US$6.00-10.00 / Piece	US$6.00-10.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	T/T, LC, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, Western Union, PayPal, Small-amount payment	LC, T/T, D/P, Western Union, PayPal, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Management System Certification	-	-	-	ISO9001:2015	ISO9001:2015
Trade Capacity
Export Markets	East Asia(Japan/ South Korea), Domestic	Southeast Asia/ Mideast	Southeast Asia/ Mideast	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic	North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	Own Brand	Own Brand	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Hemeil;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper Substrate PCB; Insulation Materials: Organic Resin; Brand: Cry; Base Material 1: MCPCB; Base Material Thickness: 0.8mm-4.0mm; Min. Hole Diameter: 0.25mm; Min. Line Spacing: 0.2mm; Testing Service: 100% Aoi Testing; Color: Red Blue Green Black White; Surface Finishing: Enig, HASL, OSP; MOQ: 1PCS; Product Type: Metal Core PCB;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper Substrate PCB; Insulation Materials: Organic Resin; Brand: Cry; Base Material 1: MCPCB; Base Material Thickness: 0.8mm-4.0mm; Min. Hole Diameter: 0.25mm; Min. Line Spacing: 0.2mm; Testing Service: 100% Aoi Testing; Color: Red Blue Green Black White; Surface Finishing: Enig, HASL, OSP; MOQ: 1PCS; Product Type: Metal Core PCB;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V1; Mechanical Rigid: Fexible; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Yuande; Detection: Aoi & Spi Detection; The Size of PCB: L50mm W50mm-L510mmW460mm; The Thickness of PCB: 0.3mm~ 8mm; The Ability to Patch: 104300 Points/H;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V1; Mechanical Rigid: Fexible; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Yuande; Detection: Aoi & Spi Detection; The Size of PCB: L50mm W50mm-L510mmW460mm; The Thickness of PCB: 0.3mm~ 8mm; The Dimensions of Components: 01005 (Imperal)/0402 (Metric); The Spacing of Components: The Minimum Spacing for IC Is 0.25mm, The Minimum; The Minimum Spacing for IC Is 0.25mm, Th: up to 30mm; Accuracy of The Patch: Chip: ±25μm, IC: Class ±30μm; The Ability to Patch: 104300 Points/H; PCBA Equipment: First Article Inspection; Automated Optical Inspection: Solder Paste Inspection; Automatic Screen Printer: Laser Marking Machine; Laser Cutting Machine: Nitrogen Reflow Welding Furnace; Available Components: Connector; Active Components: Passive Components; Discretes: Memory Chip;
Supplier Name	Shenzhen Hemeilin Technology Co., Ltd.	Shenzhen Chengruyuan Technology Co., Ltd.	Shenzhen Chengruyuan Technology Co., Ltd.	Beijing Jingbei Components Co., Ltd.	Beijing Jingbei Components Co., Ltd.
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