^{<thead id="gpwd1"></thead>}

^{<blockquote id="gpwd1"></blockquote>}

Multi-Layer PCB Print

US$0.01-0.09 / Piece

Direct Sales From The Manufacturer. Double-Sided and Multi-Layer PCB Circuit Boards, Fr4 Tin-Sprayed Circuit Boards. PCB Printed Circuit Board Design. PCB Print pictures & photos

Direct Sales From The Manufacturer. Double-Sided and Multi-Layer PCB Circuit Boards, Fr4 Tin-Sprayed Circuit Boards. PCB Printed Circuit Board Design. PCB Print Video

Name: Direct Sales From The Manufacturer. Double-Sided and Multi-Layer PCB Circuit Boards, Fr4 Tin-Sprayed Circuit Boards. PCB Printed Circuit Board Design. PCB Print
Uploaded: 2025-12-22T00:54:30+08:00
Description: Batch FR4 processing, PCB processing, fiberglass processing 1.6 mm plate thickness Welcome to our selection of Multilayer PCBs, featuring advanced PCB technology and customized circuit boards for your

Contact Now

Get Latest Price

About this Item

Price

Min. Order Reference FOB Price

1 Piece US$0.01-0.09 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Aerospace
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Aluminum
Insulation Materials Organic Resin
Brand Hemeil
Transport Package Vacuum Packaging
Specification 20*20
Trademark hemeil
Origin Dongguan

Product Description

Batch FR4 processing, PCB processing, fiberglass processing 1.6 mm plate thickness Welcome to our selection of Multilayer PCBs, featuring advanced PCB technology and customized circuit boards for your specific needs. Our high-density interconnect boards offer complex PCB layouts and ASIC design ...

Learn More

Shenzhen Hemeilin Technology Co., Ltd.

Gold Member Since 2025

Audited Supplier

Business Type Trading Company
Main Products PCB, PCBA
Year of Establishment 2020-12-18
Address Room A5018, Fortune Commercial Building, Xixiang Street, Baoan, Shenzhen, Guangdong, China

Multi-Layer PCB Print Comparison

	Direct Sales From The Manufacturer. Double-Sided and Multi-Layer PCB Circuit Boards, Fr4 Tin-Sprayed Circuit Boards. PCB Printed Circuit Board Design. PCB Print Contact Now	Quick View Multilayer PCB Printed Circuit Board with Matt Green Soldermask and Immersion Gold Contact Now	Quick View 2 U" Enig 6 Layer Printed Circuit Board, OEM ODM Mobile Phone Multilayer PCB Printed Circuit Board Contact Now	Quick View Inter Multi Layer PCB Printed Circuit Main Boards with Hard Gold Plating and Gold Finger Contact Now	Quick View PCB Production with Immersion Gold Surface Finish Shenzhen 2 Factory Manufacturer with SGS, UL and RoHS Certifications. Contact Now

Transaction Info
	Direct Sales From The Manufacturer. Double-Sided and Multi-Layer PCB Circuit Boards, Fr4 Tin-Sprayed Circuit Boards. PCB Printed Circuit Board Design. PCB Print Contact Now	Quick View Multilayer PCB Printed Circuit Board with Matt Green Soldermask and Immersion Gold Contact Now	Quick View 2 U" Enig 6 Layer Printed Circuit Board, OEM ODM Mobile Phone Multilayer PCB Printed Circuit Board Contact Now	Quick View Inter Multi Layer PCB Printed Circuit Main Boards with Hard Gold Plating and Gold Finger Contact Now	Quick View PCB Production with Immersion Gold Surface Finish Shenzhen 2 Factory Manufacturer with SGS, UL and RoHS Certifications. Contact Now
Price	US$0.01-0.09 / Piece	US$0.10-100.00 / piece	US$0.10-100.00 / piece	US$0.10-100.00 / piece	US$0.10-10.00 / piece
Min Order	1 Piece	1 piece	1 piece	1 piece	1 piece
Payment Terms	T/T, LC, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union
Quality Control
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	East Asia(Japan/ South Korea), Domestic	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	ODM, OEM	-	-	-	-
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Aerospace; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Aluminum; Insulation Materials: Organic Resin; Brand: Hemeil;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Board Thickness: 1.6mm; Copper Thickness: 70um; Solder Mask: Matt Green; Legend: White; Surface Finish: Enig;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Board Thickness: 1.6mm; Copper Thickness: 35um; Surface Finish: Immersion Gold; Solder Mask: Blue; Legend: White; Mini Hole Size: 0.15mm; Mini Space Trace: 0.15mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Board Thickness: 1.6mm; Copper Thickness: 35um; Surface Finish: Enig; Solder Mask: Blue; Legend: White;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Consumer Electronics; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Abis; Board Thickness: 1.6mm; Copper Thickness: 35um; Surface Finish: Enig; Solder Mask: Blue; Legend: White;
Supplier Name	Shenzhen Hemeilin Technology Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.
Select All

Contact Now

Hot Search