| Specification |
Structure: Multilayer FPC;
Material: Pen Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Pen Film;
Insulation Materials: Epoxy/Silicon Resin;
Brand: Hjh;
Pen Film Thickness: 25um, 50um, 75um, 100um, 125um, Others;
Copper Thickness (Edhd/Ra): 18um, 35um, 70um, Others;
Copper Side: Single / Double;
Adhesive: with / Without;
Roll Width: 500mm, 250mm, Others;
Roll Length: 100m;
Flammability: UL94V0;
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Structure: Double-Sided FPC;
Material: Polyester Film;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Aviation and Aerospace, Heathy Products;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V2;
Processing Technology: Silk Screen Print;
Base Material: Polyester Film;
Insulation Materials: Organic Resin;
Brand: Longstart;
Circuit Type: Flexible Printed Press Sensor;
Base: Polyester Film;
Ink: Press Sensor Ink;
Working Method.: Resistance Change;
Thickness: 0.125mm or as Per Request;
Pressure Range: 5kg;
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Structure: Multilayer FPC;
Material: Pi;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
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Structure: Multilayer FPC;
Material: Pi;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
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Structure: Multilayer FPC;
Material: Pi;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Cry;
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