| Specification |
Structure: Single-Sided Rigid PCB;
Dielectric: Xpc;
Material: Phenolic Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: HB;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Phenolic Paper;
Insulation Materials: Phenolic Resin;
Brand: Hjh;
Sheet Thckness: 0.8-1.6mm;
Copper Thickness: 18um, 25um, 35um, Others;
Color: Brown;
Market: Euro, Asia, Central and South America;
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Structure: Multilayer Rigid PCB;
Dielectric: Ad255c;
Material: Glass-Reinforced, PTFE Based Composites;
Application: Antennas;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Surface Finish: Immersion Silver, Immersion Gold, etc.;
Laminate Thickness: 20mil 30mil 40mil 60mil;
Layer Count: Double Sided PCB, Multilayer PCB, Hybrid PCB;
Solder Mask: Green, Black, Blue, Yellow, Red etc.;
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Structure: Double-Sided Rigid PCB;
Dielectric: RO4835;
Material: Hydrocarbon Ceramic Laminates;
Application: 5g, Radar, and Aerospace;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Surface Finish: Immersion Gold;
Laminate Thickness: 60mil;
Layer Count: Double Sided PCB;
Final Foil External: 1.0 Oz;
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Structure: Double-Sided Rigid PCB;
Dielectric: Diclad 880;
Material: Woven Fiberglass Reinforced, PTFE-Based Composites;
Application: Antennas Radar;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Surface Finish: Immersion Gold;
Laminate Thickness: 20mil;
Layer Count: Double Sided PCB;
Solder Mask: No;
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Structure: Double-Sided Rigid PCB;
Dielectric: Tc600;
Material: Ceramic Filled PTFE/Woven Fiberglass;
Application: Antennas;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Rogers;
Surface Finish: Immersion Silver;
Laminate Thickness: 50mil;
Layer Count: Double Sided PCB;
Solder Mask: Black;
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