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      Die Bonding
      US$100,000.00-1,000,000.00 / Piece
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      What is Automatic LED/IC Flip Chip Die Bonding Machine

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$100,000.00-1,000,000.00 / Piece

      Sepcifications

      • After-sales Service 7*24 Hours
      • Condition New
      • Speed Super High Speed
      • Precision Precision
      • Certification CCC, CE
      • Warranty 12 Months
      • Automatic Grade Automatic
      • Type High-speed Chip Mounter
      • Transport Package Wooden Package
      • Specification Customized
      • Trademark Himalaya
      • Origin China
      • Process Monitoring System (Optional) Can Be Record
      • Gripper Pickup Tool Head Customized
      • Suction Nozzle Customized
      • Fixed Feeding Method Gel-Pack,Tray,Waferpack etc,
      • Access Requirements 220 Power 10A0.5 MPa Compressed Air
      • Applications LED, IC Packaging
      • Operating Range 200*300mm
      • Mount Device Size Range 0.03-40mm

      Product Description

      HMLA-S platform is an off-line automatic micro assembly system developed by the company, which can be equipped with nozzle heating module, material tray/wafer placing plate, ultrasonic module, laser heating module, UV dispensing and curing module, hot nitrogen and formic acid process protection gas ...

      Learn More

      Die Bonding Comparison
      Transaction Info
      Price US$100,000.00-1,000,000.00 / Piece US$72,000.00-89,000.00 / Piece US$74,000.00-100,000.00 / Set US$26,000.00 / set US$74,000.00 / Set
      Min Order 1 Piece 1 Piece 1 Set 1 set 1 Set
      Payment Terms LC, T/T, PayPal, Western Union LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Product Certification CCC, CE CCC, PSE, FDA, RoHS, ISO, CE CCC, FDA, ISO, CE, FCC, VDE, CCS, Lr CCC, FDA, ISO, CE, FCC, VDE, CCS, Lr CCC, FDA, ISO, CE, FCC, VDE, CCS, Lr
      Management System Certification - - - - -
      Trade Capacity
      Export Markets Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
      Annual Export Revenue - - - - -
      Business Model ODM, OEM - - - -
      Average Lead Time Peak Season Lead Time: 3-6 months
      Off Season Lead Time: 1-3 months
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Product Attributes
      Specification
      After-sales Service: 7*24 Hours;
      Condition: New;
      Speed: Super High Speed;
      Precision: Precision;
      Warranty: 12 Months;
      Automatic Grade: Automatic;
      Type: High-speed Chip Mounter;
      Process Monitoring System (Optional): Can Be Record;
      Gripper Pickup Tool Head: Customized;
      Suction Nozzle: Customized;
      Fixed Feeding Method: Gel-Pack,Tray,Waferpack etc,;
      Access Requirements: 220 Power 10A0.5 MPa Compressed Air;
      Applications: LED, IC Packaging;
      Operating Range: 200*300mm;
      Mount Device Size Range: 0.03-40mm;
      Condition: New;
      Speed: Super High Speed;
      Precision: High Precision;
      Warranty: 12 Months;
      Automatic Grade: Automatic;
      Type: Ultra High-speed Chip Mounter;
      Name: LED Pick and Place Machine;
      Conveyor Direction: Left to Right or Right to Left;
      Component Height: 6-12mm;
      Placement Speed: 32000cph;
      Placement Accuracy: +-0.05mm;
      Feeder Inputs: Max.40 in Case of 8mm Tape;
      Max. PCB Size: 1,500mm×360mm;
      Component Size: 0603(0201) ~ 33.5mm;
      Min. PCB Size: 650mm*360mm;
      Usage: SMT LED SMD;
      Condition: New;
      Speed: Super High Speed;
      Precision: High Precision;
      Warranty: 18 Months;
      Automatic Grade: Automatic;
      Type: High-speed Chip Mounter;
      Product Name: YAMAHA Pick and Place Machine;
      Placement Speed: 46000 Cph;
      Usage: SMT, SMD, LED, PCB, PCBA;
      Applicable Components: 03015-W 55 X L 100mm (Divided Recognition for Over;
      Mounting Accuracy: +-0.035 mm;
      Number of Component Types: Setting Plate : Max 96 Types (8mm Width Tape Feede;
      Power Supply: 3-Phase AC 200/208/220/240/380/400/416 V+-10%;
      Air Supply Source: 0.45MPa or More, Clean and Dry State;
      External Dimension: L 1,254 X W 1,440 X H 1,445mm (Excluding Protrusio;
      Weight: 1,270kg;
      Condition: New;
      Speed: Super High Speed;
      Precision: High Precision;
      Warranty: 12 Months;
      Automatic Grade: Automatic;
      Type: High-speed Chip Mounter;
      Product Name: LED Pick and Place Machine;
      Placement Speed: 38000cph;
      Usage: SMT, SMD, LED, PCB, PCBA;
      Power Supply: 2phase,AC200 ~ 415 V 50/60Hz;
      Air Consumption: 0.5 ~ 0.7MPa(5 ~ 7kgf/Cm2);
      Dimension(L*W*H): 2000X1100X1500mm;
      Weight: 1000kg;
      Feeder: 20PCS;
      Max.PCB Size: 1200X360mm(1200X460 Option);
      Head Number: 1;
      Condition: New;
      Speed: Super High Speed;
      Precision: High Precision;
      Warranty: 18 Months;
      Automatic Grade: Automatic;
      Type: High-speed Chip Mounter;
      Product Name: Samsung Pick and Place Machine 482 Plus;
      Placement Speed: 30000cph;
      Usage: SMT, SMD, LED, PCB, PCBA;
      Power Supply: AC220V 50Hz / AC110V 60Hz;
      Air Consumption: 0.5 ~ 0.7MPa(5 ~ 7kgf/Cm2);
      Dimension: 1650(L)*1680(D)*1530(H);
      Weight: 1600kg;
      Feeder: 120 Pieces;
      PCB Thickness: 0.38-4.2mm;
      Max. Component Height: 15mm;
      Supplier Name

      Jiangsu Himalaya Semiconductor Co., Ltd.

      Gold Member Audited Supplier

      Dongguan ICT Technology Co.,Ltd.

      Diamond Member Audited Supplier

      Dongguan ICT Technology Co.,Ltd.

      Diamond Member Audited Supplier

      Dongguan ICT Technology Co.,Ltd.

      Diamond Member Audited Supplier

      Dongguan ICT Technology Co.,Ltd.

      Diamond Member Audited Supplier

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