Min. Order Reference FOB Price
1 Piece US$70,000.00-100,000.00 / Piece
Product Description
High Speed Automatic Double Dispensing Die Bonder Semiconductor Bonding Equipment Product Description Equipment Specifications DIE BONDER SHD8120 Loading method Wafer stacking and tray Bonding method Epoxy Bonding precision X/Y≤±25um,θ 75um Substrate size ...