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      Educational Robot PCB Assembly PCB Solutions PCBA for Stem Education Institutions

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$2.00 / Piece

      Sepcifications

      • Metal Coating Copper
      • Mode of Production DIP
      • Layers Double-Layer
      • Base Material Fr4, FR-4
      • Certification RoHS, ISO
      • Customized Customized
      • Condition New
      • Transport Package Box
      • Trademark hemeixin
      • Origin China
      • Type Rigid Circuit Board
      • Dielectric Fr-4
      • Material Fiberglass Epoxy
      • Application Consumer Electronics
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Insulation Materials Epoxy Resin
      • Processing Technology Immersion Gold
      • Copper Thickness 3oz -105oz
      • Surface Finish Gold Finger
      • Special Teck Metal Edging
      • Special 1 Blind Hole
      • Special 2 Buried Vias
      • Special 3 Flex-Rigid PCB
      • Surface Finish 1 Immersion Gold Immersion Tin Hal Lead Free

      Product Description

      Product Description This PCB are 6mm thickness Metal edging Copper thickness is 8oz Our advantages 1)Thickness copper PCB Max Single side PCB copper thickness is 8.0mm/0.035=228oz (Quantity produces) Max Double side pcb copper thickness is 3.0mm/0.035=85oz (Quantity produces) 2) ...

      Learn More

      PCB Assembly Comparison
      Transaction Info
      Price US$2.00 / Piece US$2.20-3.00 / Piece US$2.20-3.00 / Piece US$2.20-3.00 / Piece US$0.10-10.00 / Piece
      Min Order 1 Piece 100 Pieces 100 Pieces 100 Pieces 1 Piece
      Payment Terms T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union T/T, PayPal, Western Union T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
      Quality Control
      Product Certification RoHS, ISO RoHS, CCC, ISO RoHS, CCC, ISO RoHS, CCC, ISO RoHS, ISO
      Management System Certification - - - - -
      Trade Capacity
      Export Markets South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model - - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Metal Coating: Copper;
      Mode of Production: DIP;
      Layers: Double-Layer;
      Base Material: Fr4, FR-4;
      Customized: Customized;
      Condition: New;
      Type: Rigid Circuit Board;
      Dielectric: Fr-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Insulation Materials: Epoxy Resin;
      Processing Technology: Immersion Gold;
      Copper Thickness: 3oz -105oz;
      Surface Finish: Gold Finger;
      Special Teck: Metal Edging;
      Special 1: Blind Hole;
      Special 2: Buried Vias;
      Special 3: Flex-Rigid PCB;
      Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Single-Layer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Model Number: Hw-Xc303 Microwave Module;
      Sensor Object: Microwave Induction Moving Object;
      Input Vcc: DC-3.3V -3.7V/ 300mA;
      Working Current V/a: <15mA;
      Output Vout: H/3.3V;
      Induction Method: Doppler Motion Detection;
      Induction Time: 2s-120s;
      Induction Distance: 0.5m-10m;
      Transmit Power: <0.3W;
      Angle: 90-360;
      Photosensitive: 5p-1/ 3p-1;
      Dimensions: L31 X M22 X;
      Port 1 Default: Pj-2.54-3p Default Port;
      Function: Detect Movements;
      Feature: High Light Efficient;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Single-Layer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Model Number: Hw-Xc303 Microwave Module;
      Sensor Object: Microwave Induction Moving Object;
      Input Vcc: DC-3.3V -3.7V/ 300mA;
      Working Current V/a: <15mA;
      Output Vout: H/3.3V;
      Induction Method: Doppler Motion Detection;
      Induction Time: 2s-120s;
      Induction Distance: 0.5m-10m;
      Transmit Power: <0.3W;
      Angle: 90-360;
      Photosensitive: 5p-1/ 3p-1;
      Dimensions: L31 X M22 X;
      Port 1 Default: Pj-2.54-3p Default Port;
      Function: Detect Movements;
      Feature: High Light Efficient;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Single-Layer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Model Number: Hw-Xc303 Microwave Module;
      Sensor Object: Microwave Induction Moving Object;
      Input Vcc: DC-3.3V -3.7V/ 300mA;
      Working Current V/a: <15mA;
      Output Vout: H/3.3V;
      Induction Method: Doppler Motion Detection;
      Induction Time: 2s-120s;
      Induction Distance: 0.5m-10m;
      Transmit Power: <0.3W;
      Angle: 90-360;
      Photosensitive: 5p-1/ 3p-1;
      Dimensions: L31 X M22 X;
      Port 1 Default: Pj-2.54-3p Default Port;
      Function: Detect Movements;
      Feature: High Light Efficient;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Supplier Name

      Shenzhen Hemeixin Electronic Co., Limited

      Gold Member Audited Supplier

      HW INDUSTRIAL CO., LTD

      Gold Member Audited Supplier

      HW INDUSTRIAL CO., LTD

      Gold Member Audited Supplier

      HW INDUSTRIAL CO., LTD

      Gold Member Audited Supplier

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

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