| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersion Gold;
Base Material: Fr4;
Insulation Materials: Epoxy Resin;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Teck: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: FR-4;
Brand: Okey;
Service: Turnkey Assembly PCB Service;
Shape: Rectangular, Round, Slots, Cutouts, Complex, Irregular;
Board Thickness: 0.4-5.0mm;
Surface Finishing: HASL, Lf HASL, Enig, OSP, Carbon Oil, Immersion Tin;
Layer: 1-60 Layers;
Copper Thickness: 0.5-10 Oz;
Solder Mask Color: Green, White, Black, Blue, Yellow, Red, Purple;
Silkscreen Color: Green, White, Black, Blue, Yellow;
Board Material: Fr4, H-Tg, It-180A, Cem, Aluminum, Copper Base, Teflon;
Order Qty: Not Limited;
PCB Testing: E-Test, Fly Probe Test, Visual Checking;
Customized: Customizable;
Min. SMD Size: 01005;
PCBA Testing: Aoi, Ict, Fct, Burn-in, Vibration Test;
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Type: Flexible Circuit Board;
Dielectric: CEM-3;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
PCBA Material: Fr4, High Tg, Halogen-Free, High Frequency;
Surface Treatment: HASL/Immersion Gold/Immersion Silver/Immersion Tin;
PCB Solder Mask: White, Black, Yellow, Green, Red, Blue;
Component Packing: Tary, Tube, Tape;
Number of Floors: 1-32;
Minimum Line Width/Spacing: 3.0mil;
Maximum Plate Thickness Aperture Ratio: 30:1;
Minimum Mechanical Drilling Aperture: 6mil;
Board Thickness: 0.2mm~6.0mm;
Maximum Board Size: 640mm*1100mm;
PCBA Test: Static Test, Power-on Function Test, Power-on Agin;
PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
PCBA Testing Service: Aoi, Ict, X-ray, Flying Probe Test;
Product Application: Consumer Electronics/Home Appliances/Medical Equip;
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Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
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Type: Combining Rigid Circuit Board;
Dielectric: CEM-3;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Customer's Brand;
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