Next-Generation PCB Manufacturing for Telecommunications Infrastructure with LED PCB Technology pictures & photos

Next-Generation PCB Manufacturing for Telecommunications Infrastructure with LED PCB Technology

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Price

Min. Order Reference FOB Price

1 Piece US$0.10-0.50 / Piece

Sepcifications

Type Aluminum
Flame Retardant Properties V0
Base Material Aluminum LED
Insulation Materials Metal Composite Materials
Processing Technology HASL Lead Free
Application Consumer Electronics
Mechanical Rigid Rigid
Material Aluminum
Transport Package Box
Trademark hemeixin
Origin China
Copper Thickness 3oz -105oz
Surface Finish Gold Finger
Special Teck Metal Edging
Special 1 Blind Hole
Special 2 Buried Vias
Special 3 Flex-Rigid PCB

Product Description

Product Description Hemeixin led PCB advantages Long LED lighting PCB ( AL PCB ) 1200mm 1500mm PCB LED PCB board LED PCBs, also known as Light-Emitting Diode Printed Circuit Boards, are indispensable components in LED lighting systems, providing essential functions such as electrical ...

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Shenzhen Hemeixin Electronic Co., Limited

Gold Member Since 2024

Audited Supplier

Rating & Reviews: 5.0/5.0

(3 Reviews)

Main Products PCB, All Kinds Cables, PCBA, Electronic Components, Relay, IC Chips, Sensors, Connectors
Address 503 Zonghe Building Da Wangshan Shajing Baoan, Shenzhen, Guangdong, China
Main Markets South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe
International Commercial Terms(Incoterms) FOB, EXW, CIF, DAP
Terms of Payment T/T, PayPal, Western Union, Small-amount payment
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Assembly Comparison

	Next-Generation PCB Manufacturing for Telecommunications Infrastructure with LED PCB Technology Contact Now	Quick View 398W/M· K Thermal Conductive PCB - 5052 Base for Liquid-Cooled Miners Contact Now	Quick View IATF16949 Compliant Copper PCB - High-Reliability Ai Edge Computing Contact Now	Quick View Low Impedance Copper Core PCB - 70μ M Thick Layer for TPU Power Modules Contact Now	Quick View High-Efficiency Copper PCB - 5052 Core for Ai Training Farms Contact Now

Transaction Info
	Next-Generation PCB Manufacturing for Telecommunications Infrastructure with LED PCB Technology Contact Now	Quick View 398W/M· K Thermal Conductive PCB - 5052 Base for Liquid-Cooled Miners Contact Now	Quick View IATF16949 Compliant Copper PCB - High-Reliability Ai Edge Computing Contact Now	Quick View Low Impedance Copper Core PCB - 70μ M Thick Layer for TPU Power Modules Contact Now	Quick View High-Efficiency Copper PCB - 5052 Core for Ai Training Farms Contact Now
Price	US$0.10-0.50 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	T/T, PayPal, Western Union, Small-amount payment	T/T, Western Union	T/T, Western Union	T/T, Western Union	T/T, Western Union
Quality Control
Management System Certification	-	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others
Trade Capacity
Export Markets	South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	-	Own Brand, ODM	Own Brand, ODM	Own Brand, ODM	Own Brand, ODM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Aluminum; Flame Retardant Properties: V0; Base Material: Aluminum LED; Insulation Materials: Metal Composite Materials; Processing Technology: HASL Lead Free; Application: Consumer Electronics; Mechanical Rigid: Rigid; Material: Aluminum; Copper Thickness: 3oz -105oz; Surface Finish: Gold Finger; Special Teck: Metal Edging; Special 1: Blind Hole; Special 2: Buried Vias; Special 3: Flex-Rigid PCB;	Type: Combining Rigid Circuit Board; Flame Retardant Properties: Customized; Dielectric: MCPCB\Fr4\Bt; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Processing Technology: Delay Pressure Foil; Application: New Energy Vehicle Electronic Control Board; Mechanical Rigid: Rigid; Material: Copper-Based; Brand: Hongyu; Board Thickness: 2.0mm; Metal Core PCB: Aluminum 5052 Core (2.0mm); Thermal Conductivity: 398W/M·K (Dielectric Layer); Copper Foil: 70μm; Tg: 150°C;	Type: Combining Rigid Circuit Board; Flame Retardant Properties: Customized; Dielectric: MCPCB\Fr4\Bt; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Processing Technology: Delay Pressure Foil; Application: New Energy Vehicle Electronic Control Board; Mechanical Rigid: Rigid; Material: Copper-Based; Brand: Hongyu; Board Thickness: 2.0mm; Metal Core PCB: Aluminum 5052 Core (2.0mm); Thermal Conductivity: 398W/M·K (Dielectric Layer); Copper Foil: 70μm; Tg: 150°C;	Type: Combining Rigid Circuit Board; Flame Retardant Properties: Customized; Dielectric: MCPCB\Fr4\Bt; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Processing Technology: Delay Pressure Foil; Application: New Energy Vehicle Electronic Control Board; Mechanical Rigid: Rigid; Material: Copper-Based; Brand: Hongyu; Board Thickness: 2.0mm; Metal Core PCB: Aluminum 5052 Core (2.0mm); Thermal Conductivity: 398W/M·K (Dielectric Layer); Copper Foil: 70μm; Tg: 150°C;	Type: Combining Rigid Circuit Board; Flame Retardant Properties: Customized; Dielectric: MCPCB\Fr4\Bt; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Processing Technology: Delay Pressure Foil; Application: New Energy Vehicle Electronic Control Board; Mechanical Rigid: Rigid; Material: Copper-Based; Brand: Hongyu; Board Thickness: 2.0mm; Metal Core PCB: Aluminum 5052 Core (2.0mm); Thermal Conductivity: 398W/M·K (Dielectric Layer); Copper Foil: 70μm; Tg: 150°C;
Supplier Name	Shenzhen Hemeixin Electronic Co., Limited	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.
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