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      PCB Assembly
      US$0.10-5.00 / Piece
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      What is New Design Multilayer PCB Flex-Rigid PCB for Compact Gadgets

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$0.10-5.00 / Piece

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Application Consumer Electronics
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Immersion Gold
      • Base Material Fr4
      • Insulation Materials Epoxy Resin
      • Transport Package Box
      • Trademark hemeixin
      • Origin China
      • Copper Thickness 3oz -105oz
      • Surface Finish Gold Finger
      • Special Teck Metal Edging
      • Special 1 Blind Hole
      • Special 2 Buried Vias
      • Special 3 Flex-Rigid PCB

      Product Description

      Product Description This PCB are 6mm thickness Metal edging Copper thickness is 8oz Our advantages 1)Thickness copper PCB Max Single side PCB copper thickness is 8.0mm/0.035=228oz (Quantity produces) Max Double side pcb copper thickness is 3.0mm/0.035=85oz (Quantity produces) 2) ...

      Learn More

      PCB Assembly Comparison
      Transaction Info
      Price US$0.10-5.00 / Piece US$0.50-5.00 / Piece US$0.10-3.00 / Piece US$0.50-3.00 / Piece US$1.05-2.34 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 10 Pieces
      Payment Terms T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union T/T, PayPal, Western Union T/T, PayPal, Western Union LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram
      Quality Control
      Product Certification - - - - ISO9001/ISO14001/CE/RoHS
      Management System Certification - - - - Others
      Trade Capacity
      Export Markets South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, Eastern Europe, Africa, Mid East, Western Europe
      Annual Export Revenue - - - - -
      Business Model - ODM, OEM ODM, OEM ODM, OEM Own Brand, ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Immersion Gold;
      Base Material: Fr4;
      Insulation Materials: Epoxy Resin;
      Copper Thickness: 3oz -105oz;
      Surface Finish: Gold Finger;
      Special Teck: Metal Edging;
      Special 1: Blind Hole;
      Special 2: Buried Vias;
      Special 3: Flex-Rigid PCB;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Consumer Electronics;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: New Chip;
      Capacity: 1000000;
      OEM/ODM: Available;
      Sample: Available;
      Surface Treatment: OSP, Enig, HASL, AG Immersion;
      Certificate Gurantee: Yes;
      Test: 100%E-Testing;
      Min Bonding Pad Diameter: 10mil;
      Min Thickness of Soldermask: 10um;
      Color of Silk-Screen: White, Yellow, Black;
      Data File Format: Gerber File and Drilling File, Protel Series, ...;
      Material for PCB: Fr-4, High Tg Fr$, Halogen Free, Rogers, Cem-1, Ari;
      Layer Count: 1-20 Layers;
      Shipping: DHL/UPS/FedEx/Air/Sea;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Consumer Electronics;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: New Chip;
      Capacity: 1000000;
      OEM/ODM: Available;
      Sample: Available;
      Surface Treatment: OSP, Enig, HASL, AG Immersion;
      Certificate Gurantee: Yes;
      Test: 100%E-Testing;
      Min Bonding Pad Diameter: 10mil;
      Min Thickness of Soldermask: 10um;
      Color of Silk-Screen: White, Yellow, Black;
      Data File Format: Gerber File and Drilling File, Protel Series, ...;
      Material for PCB: Fr-4, High Tg Fr$, Halogen Free, Rogers, Cem-1, Ari;
      Layer Count: 1-20 Layers;
      Shipping: DHL/UPS/FedEx/Air/Sea;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Consumer Electronics;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: New Chip;
      Capacity: 1000000;
      OEM/ODM: Available;
      Sample: Available;
      Surface Treatment: OSP, Enig, HASL, AG Immersion;
      Certificate Gurantee: Yes;
      Test: 100%E-Testing;
      Min Bonding Pad Diameter: 10mil;
      Min Thickness of Soldermask: 10um;
      Color of Silk-Screen: White, Yellow, Black;
      Data File Format: Gerber File and Drilling File, Protel Series, ...;
      Material for PCB: Fr-4, High Tg Fr$, Halogen Free, Rogers, Cem-1, Ari;
      Layer Count: 1-20 Layers;
      Shipping: DHL/UPS/FedEx/Air/Sea;
      Type: Combining Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Aluminum Covered Copper Foil Layer;
      Application: Consumer Electronics;
      Flame Retardant Properties: V1;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Metal Composite Materials;
      Brand: Jxpcba;
      Product Type: Custom HDI PCBA;
      Service: One-Stop Turnkey;
      Applicational: Electronics Device/Home Appliances;
      Testing Service: Aoi X-ray Function Test;
      Raw Material: Fr4/Cem-1/Cem-3/Fr1/Aluminum;
      Board Thickness: 0.2mm-7.0mm;
      Layer: 1-32 Layers;
      Solder Mask Color: Blue.Green.Red.Black.White.etc;
      Surface Finishing: HASL\OSP\Immersion Gold;
      Supplier Name

      Shenzhen Hemeixin Electronic Co., Limited

      Gold Member Audited Supplier

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

      Shenzhen Jingxin Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

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