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      Custom Circuit Board PCBA for Wearable Devices with Compact Size Raspberry Pi PCB

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$0.30-2.00 / Piece

      Sepcifications

      • Metal Coating Copper
      • Mode of Production DIP
      • Layers Multilayer
      • Base Material FR-4
      • Certification RoHS, ISO
      • Customized Customized
      • Condition New
      • Transport Package Box
      • Trademark hemeixin
      • Origin China
      • Type Rigid Circuit Board
      • Dielectric Fr-4
      • Material Fiberglass Epoxy
      • Application Consumer Electronics
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Insulation Materials Epoxy Resin
      • Processing Technology Immersion Gold
      • Copper Thickness 3oz -105oz
      • Surface Finish Gold Finger
      • Special Technology Metal Edging
      • Special 1 Blind Hole
      • Special 2 Buried Vias
      • Special 3 Flex-Rigid PCB
      • Surface Finish 1 Immersion Gold Immersion Tin Hal Lead Free

      Product Description

      Product Description This PCB are 6mm thickness Metal edging Copper thickness is 8oz Our advantages 1)Thickness copper PCB Max Single side PCB copper thickness is 8.0mm/0.035=228oz (Quantity produces) Max Double side pcb copper thickness is 3.0mm/0.035=85oz (Quantity produces) 2) ...

      Learn More

      PCB Assembly Comparison
      Transaction Info
      Price US$0.30-2.00 / Piece US$0.50-1.00 / Piece US$0.50-1.00 / Piece US$0.10-1.00 / Piece US$0.10-1.00 / Piece
      Min Order 1 Piece 10 Pieces 10 Pieces 1 Piece 1 Piece
      Payment Terms T/T, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T T/T
      Quality Control
      Product Certification RoHS, ISO RoHS, CCC, ISO RoHS, CCC, ISO ISO9001, ISO14001, ISO13485, Ts-16949, etc ISO9001, ISO14001, ISO13485, Ts-16949, etc
      Management System Certification - - - ISO9001:2015, ISO14001, Others ISO9001:2015, ISO14001, Others
      Trade Capacity
      Export Markets South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, South America, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, South America, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)
      Annual Export Revenue - - - - -
      Business Model - - - Own Brand, ODM, OEM Own Brand, ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Metal Coating: Copper;
      Mode of Production: DIP;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Type: Rigid Circuit Board;
      Dielectric: Fr-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Insulation Materials: Epoxy Resin;
      Processing Technology: Immersion Gold;
      Copper Thickness: 3oz -105oz;
      Surface Finish: Gold Finger;
      Special Technology: Metal Edging;
      Special 1: Blind Hole;
      Special 2: Buried Vias;
      Special 3: Flex-Rigid PCB;
      Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Shape: DIP;
      Conductive Type: Bipolar Integrated Circuit;
      Integration: Gsi;
      Technics: Semiconductor IC;
      D/C: Standard;
      Warranty: 2 Years;
      Mounting Type: Standard, SMT, DIP;
      Cross Reference: Standard;
      Memory Type: Standard;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Shape: DIP;
      Conductive Type: Bipolar Integrated Circuit;
      Integration: Gsi;
      Technics: Semiconductor IC;
      D/C: Standard;
      Warranty: 2 Years;
      Mounting Type: Standard, SMT, DIP;
      Cross Reference: Standard;
      Memory Type: Standard;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Type: Rigid Circuit Board;
      Flame Retardant Properties: V0;
      Dielectric: Fr-4;
      Insulation Materials: Organic Resin;
      Processing Technology: Electrolytic Foil;
      Application: Communication;
      Mechanical Rigid: Rigid;
      Material: Paper Phenolic Copper Foil Substrate;
      Brand: Kevis;
      Products Name: 94V0 Fr4 PCB Circuit Board;
      Layer: Single / Double Sided / Multilayer;
      Service: PCB/PCBA/PCB Assembly/Electronic Parts;
      Other Service: Layout Design, Engineering Support, Testing;
      PCBA QC: X-ray, Aoi Test, Function Test(100% Test), 40X Om;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Products Name: 94V0 Fr4 PCB Circuit Board;
      Layer: Single / Double Sided / Multilayer;
      Service: PCB/PCBA/PCB Assembly/Electronic Parts;
      Other Service: Layout Design, Engineering Support, Testing;
      Specialised: Medical, Industrial, Communication;
      PCBA QC: X-ray, Aoi Test, Function Test(100% Test), 40X Om;
      Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG, Sn;
      Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
      Min.Hole Size: 0.1mm (4 Mil);
      Board Thickness: 0.2mm-7mm;
      Min.Line Spacing: 0.1mm (4 Mil);
      Solder Color: Green, Red, White, Black, Yellow, Blue;
      SMT Assembly Line: 10 Lines;
      Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
      Supplier Name

      Shenzhen Hemeixin Electronic Co., Limited

      Gold Member Audited Supplier

      Mu Star (shenzhen) Industry Co., Ltd.

      Diamond Member Audited Supplier

      Mu Star (shenzhen) Industry Co., Ltd.

      Diamond Member Audited Supplier

      Guangzhou Kevis Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Guangzhou Kevis Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

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