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      Custom PCB Assembly Board PCB for Automotive Electronics with Robust Design PCB Board Assembly

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$0.10-1.00 / Piece

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Immersion Gold
      • Base Material Fr4
      • Insulation Materials Epoxy Resin
      • Transport Package Box
      • Trademark hemeixin
      • Origin China
      • Copper Thickness 3oz -105oz
      • Surface Finish Gold Finger
      • Special Teck Metal Edging
      • Special 1 Blind Hole
      • Special 2 Buried Vias
      • Special 3 Flex-Rigid PCB

      Product Description

      Product Description This PCB are 6mm thickness Metal edging Copper thickness is 8oz Our advantages 1)Thickness copper PCB Max Single side PCB copper thickness is 8.0mm/0.035=228oz (Quantity produces) Max Double side pcb copper thickness is 3.0mm/0.035=85oz (Quantity produces) 2) ...

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      Multilayer PCB Comparison
      Transaction Info
      Price US$0.10-1.00 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms T/T, PayPal, Western Union, Small-amount payment T/T, Western Union T/T, Western Union T/T, Western Union T/T, Western Union
      Quality Control
      Management System Certification - ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others
      Trade Capacity
      Export Markets South America, Eastern Europe, Southeast Asia, Mid East, Eastern Asia, Western Europe Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic
      Annual Export Revenue - - - - -
      Business Model - Own Brand, ODM Own Brand, ODM Own Brand, ODM Own Brand, ODM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Immersion Gold;
      Base Material: Fr4;
      Insulation Materials: Epoxy Resin;
      Copper Thickness: 3oz -105oz;
      Surface Finish: Gold Finger;
      Special Teck: Metal Edging;
      Special 1: Blind Hole;
      Special 2: Buried Vias;
      Special 3: Flex-Rigid PCB;
      Type: Combining Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Model: PCB;
      Brand: Hongyu;
      Board Thickness: 0.8mm;
      Metal Core PCB: T2 High Conductivity Copper(0.8mm);
      Thermal Conductivity: 398W/M·K (Dielectric Layer);
      Copper Foil: 35/35μm;
      Tg: 150°C;
      Type: Combining Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Model: PCB;
      Brand: Hongyu;
      Board Thickness: 0.8mm;
      Metal Core PCB: T2 High Conductivity Copper(0.8mm);
      Thermal Conductivity: 398W/M·K (Dielectric Layer);
      Copper Foil: 35/35μm;
      Tg: 150°C;
      Type: Combining Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Model: PCB;
      Brand: Hongyu;
      Board Thickness: 0.8mm;
      Metal Core PCB: T2 High Conductivity Copper(0.8mm);
      Thermal Conductivity: 398W/M·K (Dielectric Layer);
      Copper Foil: 35/35μm;
      Tg: 150°C;
      Type: Combining Rigid Circuit Board;
      Dielectric: MCPCB\Fr4\Bt;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid;
      Processing Technology: Delay Pressure Foil;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Model: PCB;
      Brand: Hongyu;
      Board Thickness: 0.8mm;
      Metal Core PCB: T2 High Conductivity Copper(0.8mm);
      Thermal Conductivity: 398W/M·K (Dielectric Layer);
      Copper Foil: 35/35μm;
      Tg: 150°C;
      Supplier Name

      Shenzhen Hemeixin Electronic Co., Limited

      Gold Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier