| Specification |
Dielectric: SIC;
Application: Electric Control System;
Material: Aluminum;
Insulation Material: Organic Resin;
Layers: Multilayer;
|
Dielectric: Aln, Ausn, Ni, Cu;
Material: Alumina Nitride;
Metal Material: Au, Sn, Ni, Cu and So on;
Package: Plastic Box;
Thermal Conductivity: High;
Encapsulation: CPU/GPU;
|
Dielectric: Aln , Ausn, Ni, Cu;
Material: Alumina Nitride;
Metal Material: Au, Sn, Ni, Cu and So on;
Package: Plastic Box;
Thermal Conductivity: High;
Encapsulation: CPU/GPU;
|
Dielectric: Aln , Ausn, Ni, Cu;
Material: Alumina Nitride;
Metal Material: Au, Sn, Ni, Cu and So on;
Package: Plastic Box;
Thermal Conductivity: High;
Encapsulation: CPU/GPU;
|
Dielectric: Aln , Ausn, Ni, Cu;
Material: Alumina Nitride;
Metal Material: Au, Sn, Ni, Cu and So on;
Package: Plastic Box;
Thermal Conductivity: High;
Encapsulation: CPU/GPU;
|