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      FPC
      US$0.10-1.00 / Piece
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      What is FPC Electronic Circuit Board Flexible PCB Printed Circuit Board Software Hardware Solution Development Manufacturer

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-99 Pieces US$1.00

      100-499 Pieces US$0.50

      500+ Pieces US$0.10

      Sepcifications

      • Structure Multilayer FPC
      • Material Polyimide
      • Combination Mode Adhesive Flexible Plate
      • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
      • Conductive Adhesive Conductive Silver Paste
      • Flame Retardant Properties V0
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Organic Resin
      • Brand Kevis
      • Transport Package Individual Packaging
      • Specification 25*20*1
      • Trademark KAIVESIN
      • Origin Guangzhou
      • Products Name PCBA Assembly PCB Electronic Motherboard Board
      • Layer Single / Double Sided / Multilayer
      • Service PCB/PCBA/PCB Assembly/Electronic Parts
      • Other Service Layout Design,Engineering Support,Testing
      • Specialised Medical,Industrial,Communication,Controlboard,LED
      • PCBA QC X-ray, Aoi Test, Function Test(100% Test),40X Om
      • Certificate ISO9001,ISO14001,ISO13485,Ts-16949,etc
      • Surface Finishing HASL, Enig, OSP, Lmmersion Au, AG,Sn
      • Copper Thickness 0.5oz/1oz/2oz/3oz/4oz
      • Min.Hole Size 0.1mm (4 Mil)
      • Board Thickness 0.2mm-7mm
      • Min.Line Spacing 0.1mm (4 Mil)
      • Solder Color Green, Red, White, Black,Yellow,Blue
      • SMT Assembly Line 10 Lines
      • Delivery PCB: 1-5 Days; PCB Assembly: 1-10 Days

      Product Description

      Title FPC Electronic Circuit Board Flexible PCB Printed Circuit Board Software Hardware Solution Development Manufacturer Product Parameters ltem Value Product name Kevis Manufacturer OEM PCB Circuit Board SMT PCB Assembly Model Number Printed Circuit Board , Development Board , ...

      Learn More

      FPC Comparison
      Transaction Info
      Price US$0.10-1.00 / Piece US$0.01-150.00 / Piece US$0.01-150.00 / Piece US$0.01-10.00 / Piece US$0.01-10.00 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms T/T LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
      Quality Control
      Product Certification ISO9001,ISO14001,ISO13485,Ts-16949,etc - - - -
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model - - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Kevis;
      Products Name: PCBA Assembly PCB Electronic Motherboard Board;
      Layer: Single / Double Sided / Multilayer;
      Service: PCB/PCBA/PCB Assembly/Electronic Parts;
      Other Service: Layout Design,Engineering Support,Testing;
      Specialised: Medical,Industrial,Communication,Controlboard,LED;
      PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
      Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
      Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
      Min.Hole Size: 0.1mm (4 Mil);
      Board Thickness: 0.2mm-7mm;
      Min.Line Spacing: 0.1mm (4 Mil);
      Solder Color: Green, Red, White, Black,Yellow,Blue;
      SMT Assembly Line: 10 Lines;
      Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: N/a;
      Board Thickness: 0.15mm;
      PCB Material: Pi;
      Solder Mask: Yellow;
      Silk: White;
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Polymind;
      Insulation Materials: Epoxy Resin;
      Brand: N/a;
      Thickness: 0.15mm;
      Surface: Immersion Gold/ Immersion Silver;
      Copper: 1oz;
      Adhesive: Customised;
      Structure: Double-Sided FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Conductive Adhesive: Anisotropic Conductive Adhesive;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Abis;
      Layer: 2layer;
      Board Thickness: 0.2;
      Surface Finish: Enig;
      Copper Thickness: 35um;
      Structure: Double-Sided FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Abis;
      Board Thickness: 0.1mm;
      Layers: 2;
      Surface Finish: Enig;
      Copper Thickness: 35um;
      Raw Material: Pi;
      Supplier Name

      Guangzhou Kevis Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

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