| Specification |
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Communication;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Kevis;
Products Name: 94V0 Fr4 PCB Circuit Board;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Alumina;
Base Material: Al2O3;
Insulation Materials: Metal Composite Materials;
Processing Technology: Electrolytic Foil;
Application: LED Lighting;
Mechanical Rigid: Rigid;
Material: Ceramics;
Board Layer: 1 L;
Copper Thickness: 1 Oz;
Board Thickness: 0.8mm;
Solder Mask: White;
Silkscreen: Black;
Surface Finsihed: Enig;
Test: 100%Test;
MOQ: None;
Lead Time: 10-12 Days;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Alumina;
Base Material: Al2O3;
Insulation Materials: Metal Composite Materials;
Processing Technology: Electrolytic Foil;
Application: LED Lighting;
Mechanical Rigid: Rigid;
Material: Ceramics;
Board Layer: 1 L;
Copper Thickness: 1 Oz;
Board Thickness: 0.8mm;
Solder Mask: White;
Silkscreen: Black;
Surface Finsihed: Enig;
Test: 100%Test;
MOQ: None;
Lead Time: 10-12 Days;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Alumina;
Base Material: Al2O3;
Insulation Materials: Metal Composite Materials;
Processing Technology: Electrolytic Foil;
Application: LED Lighting;
Mechanical Rigid: Rigid;
Material: Ceramics;
Board Layer: 1 L;
Copper Thickness: 1 Oz;
Board Thickness: 0.8mm;
Solder Mask: White;
Silkscreen: Black;
Surface Finsihed: Enig;
Test: 100%Test;
MOQ: None;
Lead Time: 10-12 Days;
|
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Alumina;
Base Material: Al2O3;
Insulation Materials: Metal Composite Materials;
Processing Technology: Electrolytic Foil;
Application: LED Lighting;
Mechanical Rigid: Rigid;
Material: Ceramics;
Board Layer: 1 L;
Copper Thickness: 1 Oz;
Board Thickness: 0.8mm;
Solder Mask: White;
Silkscreen: Black;
Surface Finsihed: Enig;
Test: 100%Test;
MOQ: None;
Lead Time: 10-12 Days;
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