| Specification |
Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Communication;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Kevis;
Products Name: 94V0 Fr4 PCB Circuit Board;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: Aluminum Base Board;
Base Material: Aluminum;
Insulation Materials: Metal Composite Materials;
Processing Technology: Electrolytic Foil;
Application: LED PCB;
Mechanical Rigid: Rigid;
Material: Aluminum;
Brand: Abis;
Thermal Conductivity: 0.8-3W/M.K;
Copper Thickness: 1-6oz;
Board Thickness: 0.3-5mm;
Raw Material: Aluminum Base, Copper Base;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V1;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Organic Resin;
Processing Technology: Electrolytic Foil;
Application: Consumer Electronics;
Mechanical Rigid: Rigid;
Material: Paper Phenolic Copper Foil Substrate;
Brand: Abis;
Layer: 1 Layer;
Raw Material: Fr-4,Cu Base,High Tg Fr-4,PTFE,Rogers,Teflon etc.;
Board Outline Tolerance: +0.10mm;
Impedance Control Tolerance: +/-10%;
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Type: Rigid Circuit Board;
Flame Retardant Properties: V0;
Dielectric: FR-4;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: Aerospace;
Mechanical Rigid: Rigid;
Material: Copper-Based;
Brand: Wangling;
Surface Finish: Immersion Gold;
Layer Count: Single Layer;
Copper Weight: 1oz, 2oz;
Solder Mask: Green, Black, Blue, Yellow, Red etc.;
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Type: Rigid Circuit Board;
Flame Retardant Properties: HB;
Dielectric: CEM-1;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Processing Technology: Electrolytic Foil;
Application: Uchida Series Paper Counting Machine;
Mechanical Rigid: Rigid;
Material: Complex;
Brand: Erqi;
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