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      FPC
      US$0.10-1.00 / Piece
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      What is PCB Professional Custom Circuit Board PCB Assembly Other PCBA FPC One Stop Turnkey Gerber File Bom List PCBA Manufacturer

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-99 Pieces US$1.00

      100-499 Pieces US$0.50

      500+ Pieces US$0.10

      Sepcifications

      • Structure Multilayer FPC
      • Material Polyimide
      • Combination Mode Adhesive Flexible Plate
      • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
      • Conductive Adhesive Conductive Silver Paste
      • Flame Retardant Properties V0
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Organic Resin
      • Brand Kevis
      • Transport Package Vacuum Packing/Blister/Plastic /Carton Box
      • Specification 20*18*1
      • Trademark KAIVESIN
      • Origin Guangzhou
      • Products Name Flexible FPC Electronics Board
      • Layer Single / Double Sided / Multilayer
      • Service PCB/PCBA/PCB Assembly/Electronic Parts
      • Other Service Layout Design,Engineering Support,Testing
      • Specialised Medical,Industrial,Communication,Controlboard,LED
      • PCBA QC X-ray, Aoi Test, Function Test(100% Test),40X Om
      • Certificate ISO9001,ISO14001,ISO13485,Ts-16949,etc
      • Surface Finishing HASL, Enig, OSP, Lmmersion Au, AG,Sn
      • Copper Thickness 0.5oz/1oz/2oz/3oz/4oz
      • Min.Hole Size 0.1mm (4 Mil)
      • Board Thickness 0.2mm-7mm
      • Min.Line Spacing 0.1mm (4 Mil)
      • Solder Color Green, Red, White, Black,Yellow,Blue
      • SMT Assembly Line 10 Lines
      • Delivery PCB: 1-5 Days; PCB Assembly: 1-10 Days

      Product Description

      Title PCB Professional Custom Circuit Board PCB Assembly Other PCBA FPC One Stop Turnkey Gerber File Bom List PCBA Manufacturer Product Parameters ltem Value Product name Kevis Manufacturer OEM PCB Circuit Board SMT PCB Assembly Flexible FPC Electronics Board Model Number Printed Circuit ...

      Learn More

      FPC Comparison
      Transaction Info
      Price US$0.10-1.00 / Piece US$0.56-5.39 / Piece US$0.56-5.39 / Piece US$0.50-0.69 / Piece US$0.56-5.39 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms T/T LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Product Certification ISO9001,ISO14001,ISO13485,Ts-16949,etc - - - -
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast
      Annual Export Revenue - - - - -
      Business Model - - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Kevis;
      Products Name: Flexible FPC Electronics Board;
      Layer: Single / Double Sided / Multilayer;
      Service: PCB/PCBA/PCB Assembly/Electronic Parts;
      Other Service: Layout Design,Engineering Support,Testing;
      Specialised: Medical,Industrial,Communication,Controlboard,LED;
      PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
      Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
      Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
      Min.Hole Size: 0.1mm (4 Mil);
      Board Thickness: 0.2mm-7mm;
      Min.Line Spacing: 0.1mm (4 Mil);
      Solder Color: Green, Red, White, Black,Yellow,Blue;
      SMT Assembly Line: 10 Lines;
      Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Board Material: Polyimide;
      Copper Thickness: 1oz;
      Board Thickness: 0.8mm;
      Min. Hole Size: 0.2mm;
      Min. Line Width: 01mm;
      Min. Line Spacing: 0.09mm;
      Surface Finishing: Enig;
      Is_Customized: Yes;
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Without Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Board Material: Polyimide;
      Board Thickness: 1.6 Mm;
      Copper Thickness: 1 Oz (35um);
      Surface Treatment: HASL Lead Free;
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Without Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: HB;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Fastline;
      Board Material: Polyimide;
      Board Thickness: 1.6 Mm;
      Copper Thickness: 1 Oz (35um);
      Surface Treatment: HASL Lead Free;
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Without Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: HB;
      Processing Technology: Electrolytic Foil;
      Base Material: Aluminum;
      Insulation Materials: Organic Resin;
      Brand: Fastline;
      Board Material: Polyimide;
      Board Thickness: 1.6 Mm;
      Copper Thickness: 1 Oz (35um);
      Surface Treatment: HASL Lead Free;
      Supplier Name

      Guangzhou Kevis Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

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