| Specification |
Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Kevis;
Products Name: Flexible FPC Electronics Board;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
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Structure: Double-Sided FPC;
Material: Fiberglass;
Combination Mode: Without Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V0;
Processing Technology: Delay Pressure Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ry;
Type: Insulation Film;
Chemistry: Organic Insulation;
Classification: Organic Insulating Material;
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Structure: Multilayer FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
Conductive Adhesive: Conductive Silver Paste;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Brand: Xtz;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Emerson;
Item Name: 3051 PA Bus Display and Circuit Board;
Warranty: 1 Year;
MOQ: 1PC;
Place of Origin: China, Singapore, Germany;
Customized Support: OEM, ODM;
Brand Name: Emerson;
Model Number: 3051;
Support Protocol: Hart, Fondation Field Bus;
Measuring Range: -50~300℃ Optional;
Voltage Supply: 24(V);
Max Rate: 115kbs;
Single Gross Weight: 1.000 Kg;
Selling Units: Single Item;
Single Package Size: 5*5*5 Cm;
Industry: Petrochemical Industry;
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Structure: Double-Sided FPC;
Material: Polyimide;
Combination Mode: Adhesive Flexible Plate;
Application: Digital Products;
Conductive Adhesive: Anisotropic Conductive Adhesive;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Brand: Emerson;
Item Name: 8732e Electromagnetic Flow Meter Circuit Board;
Warranty: 1 Year;
MOQ: 1PC;
Place of Origin: China, Singapore, Germany;
Customized Support: OEM, ODM;
Brand Name: Emerson;
Model Number: 8732e;
Support Protocol: Hart, Fondation Field Bus;
Measuring Range: -50~300℃ Optional;
Voltage Supply: 24(V);
Max Rate: 115kbs;
Single Gross Weight: 2.000 Kg;
Selling Units: Single Item;
Single Package Size: 7*7*7 Cm;
Industry: Petrochemical Industry;
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