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US$0.10-1.50 / Piece

FC Printed Circuit Board PCB Assembly Manufacturing Design Service Other Multilayer PCB pictures & photos

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What is FC Printed Circuit Board PCB Assembly Manufacturing Design Service Other Multilayer PCB

Name: FC Printed Circuit Board PCB Assembly Manufacturing Design Service Other Multilayer PCB
Uploaded: 2025-12-23T17:54:04+08:00
Description: Fc Printed Circuit Board Pcb Assembly Manufacturing Design Service Other Multilayer Pcb About Us Our Advantage Factory 18+Years Pcb/Pcba Manufacturing Experience,4500 Workshop Areas,10 Automatic Produ

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Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$1.50

100-499 Pieces US$1.00

500-999 Pieces US$0.50

1,000+ Pieces US$0.10

Sepcifications

Type Rigid Circuit Board
Flame Retardant Properties V0
Dielectric FR-4
Base Material Copper
Insulation Materials Organic Resin
Processing Technology Electrolytic Foil
Application Consumer Electronics
Mechanical Rigid Rigid
Material Paper Phenolic Copper Foil Substrate
Brand Kevis
Transport Package Individual Packaging
Specification 20*18*1
Origin Guangzhou
Layer 1-64 Layers
Board Thickness 0.2mm-7.0mm
Min. Line Width 0.075mm/0.075mm(3mil/3mil)
Min. Hole Size 0.15mm
Surface Treatment Flash Gold, Enig, Enepig, Gold Fingers Hard Gold
Solder Mask Color Green, Blue, Yellow, White, Black

Product Description

Fc Printed Circuit Board Pcb Assembly Manufacturing Design Service Other Multilayer Pcb About Us Our Advantage Factory 18+Years Pcb/Pcba Manufacturing Experience,4500 Workshop Areas,10 Automatic Production Lines. Advanced equipment and strong productivity make each PCB board more accurate ...

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Guangzhou Kevis Electronic Technology Co., Ltd.

Diamond Member Since 2024

Audited Supplier

Main Products Yes
Address Room 601-3, Building D No. 7 Caipin Road, Science City, Huangpu District, Guangzhou, Guangdong, China
Main Markets North America, South America, Eastern Europe, Southeast Asia, Western Europe
International Commercial Terms(Incoterms) FOB, EXW, FCA
Terms of Payment T/T
Average Lead Time Peak Season Lead Time: within 15 workdays
Off Season Lead Time: within 15 workdays

PCB Comparison

	FC Printed Circuit Board PCB Assembly Manufacturing Design Service Other Multilayer PCB Contact Now	Quick View Durable 1.6mm MCPCB for Automotive LED Applications PCB with RoHS Compliance Contact Now	Quick View Premium Automotive LED PCB with 35um Copper for High Thermal Efficiency Contact Now	Quick View RoHS Compliant LED Thermal PCB Board for High Efficiency Automotive Lighting Contact Now	Quick View IATF16949 Certified 1.6mm Thermal PCB Board for Efficient Car Lighting Contact Now

Transaction Info
	FC Printed Circuit Board PCB Assembly Manufacturing Design Service Other Multilayer PCB Contact Now	Quick View Durable 1.6mm MCPCB for Automotive LED Applications PCB with RoHS Compliance Contact Now	Quick View Premium Automotive LED PCB with 35um Copper for High Thermal Efficiency Contact Now	Quick View RoHS Compliant LED Thermal PCB Board for High Efficiency Automotive Lighting Contact Now	Quick View IATF16949 Certified 1.6mm Thermal PCB Board for Efficient Car Lighting Contact Now
Price	US$0.10-1.50 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	T/T	T/T, Western Union	T/T, Western Union	T/T, Western Union	T/T, Western Union
Quality Control
Management System Certification	-	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others
Trade Capacity
Export Markets	North America, South America, Eastern Europe, Southeast Asia, Western Europe	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	-	Own Brand, ODM	Own Brand, ODM	Own Brand, ODM	Own Brand, ODM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Flame Retardant Properties: V0; Dielectric: FR-4; Base Material: Copper; Insulation Materials: Organic Resin; Processing Technology: Electrolytic Foil; Application: Consumer Electronics; Mechanical Rigid: Rigid; Material: Paper Phenolic Copper Foil Substrate; Brand: Kevis; Layer: 1-64 Layers; Board Thickness: 0.2mm-7.0mm; Min. Line Width: 0.075mm/0.075mm(3mil/3mil); Min. Hole Size: 0.15mm; Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold; Solder Mask Color: Green, Blue, Yellow, White, Black;	Type: Combining Rigid Circuit Board; Flame Retardant Properties: Customized; Dielectric: MCPCB\Fr4\Bt; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Processing Technology: Delay Pressure Foil; Application: New Energy Vehicle Electronic Control Board; Mechanical Rigid: Rigid; Material: Aluminum; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: Aluminum 1060 Core (1.4mm); Thermal Conductivity: 3W/M·K (Dielectric Layer); Copper Foil: 35μm; Tg: 130°C;	Type: Combining Rigid Circuit Board; Flame Retardant Properties: Customized; Dielectric: MCPCB\Fr4\Bt; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Processing Technology: Delay Pressure Foil; Application: New Energy Vehicle Electronic Control Board; Mechanical Rigid: Rigid; Material: Aluminum; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: Aluminum 1060 Core (1.4mm); Thermal Conductivity: 3W/M·K (Dielectric Layer); Copper Foil: 35μm; Tg: 130°C;	Type: Combining Rigid Circuit Board; Flame Retardant Properties: Customized; Dielectric: MCPCB\Fr4\Bt; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Processing Technology: Delay Pressure Foil; Application: New Energy Vehicle Electronic Control Board; Mechanical Rigid: Rigid; Material: Aluminum; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: Aluminum 1060 Core (1.4mm); Thermal Conductivity: 3W/M·K (Dielectric Layer); Copper Foil: 35μm; Tg: 130°c;	Type: Combining Rigid Circuit Board; Flame Retardant Properties: Customized; Dielectric: MCPCB\Fr4\Bt; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Processing Technology: Delay Pressure Foil; Application: New Energy Vehicle Electronic Control Board; Mechanical Rigid: Rigid; Material: Aluminum; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: Aluminum 1060 Core (1.4mm); Thermal Conductivity: 3W/M·K (Dielectric Layer); Copper Foil: 35μm; Tg: 130°c;
Supplier Name	Guangzhou Kevis Electronic Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.
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