| Specification |
Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Products Name: Embedded Industrial Control PCBA Assembly PCB;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
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Metal Coating: Silver;
Mode of Production: DIP;
Layers: Single-Layer;
Base Material: FR-4;
Customized: Non-Customized;
Condition: New;
Application: Electrical & Electronics Industry;
Platform Number: 2;
Control Mode: Teach Pendant;
Solder Wire: 0.6~1.2mm Solder Wire;
Repeate Accuracy: +-0.02mm;
Driving Mode: Step Motor;
Air Pressure: 4.5~6kg/Cm2;
Weight: Approx:65kg;
Power Supply: AC:220 +-10%,50/60Hz;
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Metal Coating: Stainless Steel;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-4;
Customized: Non-Customized;
Condition: New;
Modle: Mr-700;
Max Stencil Size: L1000*W700*H1730(mm);
Liquid Tank: 40L;
Clean Time: 2-5min;
Dry Time: 2-5min;
Compressed Air Pressure: 0.5~0.7MPa;
Air Flow Rate: 400~600L/Min;
Clean Method: 360°rotation Spray Clean + Compressed Air Blow;
Filter System: 20um/10um/5um, 3 Level;
Machine Weight: 230kg;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Single-Layer;
Base Material: Aluminum Substrate;
Customized: Customized;
Condition: New;
Voltage: AC85V-265V;
Luminous Efficacy(Lm/W): 100lm-160lm/W;
PCB Board Thickness: 1mm/1.2mm/1.6mm;
Surge: 2kv/3kv/4kv/6kv;
Power Factor: 0.6/0.9;
Supplier Type: Customized, OEM/ODM;
Application: LED Lighting;
Type: Rigid Circuit Board;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Shape: DIP;
Conductive Type: Bipolar Integrated Circuit;
Integration: Gsi;
Technics: Semiconductor IC;
D/C: Standard;
Warranty: 2 Years;
Mounting Type: Standard, SMT, DIP;
Cross Reference: Standard;
Memory Type: Standard;
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