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      FPC
      US$0.10-1.00 / Piece
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      What is Multi-Port FPC Electronic Rigid-Flex Printed Circuit Boards Provide One-Stop Shop Custom Flexible Printed Circuits FPC

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-99 Pieces US$1.00

      100-499 Pieces US$0.50

      500+ Pieces US$0.10

      Sepcifications

      • Structure Multilayer FPC
      • Material Polyimide
      • Combination Mode Adhesive Flexible Plate
      • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
      • Conductive Adhesive Conductive Silver Paste
      • Flame Retardant Properties V0
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Organic Resin
      • Brand Kevis
      • Transport Package Individual Packaging
      • Specification 25*20*1
      • Trademark KAIVESIN
      • Origin Guangzhou
      • Products Name PCBA Assembly PCB Electronic Motherboard Board
      • Layer Single / Double Sided / Multilayer
      • Service PCB/PCBA/PCB Assembly/Electronic Parts
      • Other Service Layout Design,Engineering Support,Testing
      • Specialised Medical,Industrial,Communication,Controlboard,LED
      • PCBA QC X-ray, Aoi Test, Function Test(100% Test),40X Om
      • Certificate ISO9001,ISO14001,ISO13485,Ts-16949,etc
      • Surface Finishing HASL, Enig, OSP, Lmmersion Au, AG,Sn
      • Copper Thickness 0.5oz/1oz/2oz/3oz/4oz
      • Min.Hole Size 0.1mm (4 Mil)
      • Board Thickness 0.2mm-7mm
      • Min.Line Spacing 0.1mm (4 Mil)
      • Solder Color Green, Red, White, Black,Yellow,Blue
      • SMT Assembly Line 10 Lines
      • Delivery PCB: 1-5 Days; PCB Assembly: 1-10 Days

      Product Description

      Title Multi-Port FPC Electronic Rigid-Flex Printed Circuit Boards Provide One-Stop Shop Custom Flexible Printed Circuits FPC Product Parameters ltem Value Product name Kevis Manufacturer OEM PCB Circuit Board SMT PCB Assembly Model Number Printed Circuit Board , Development Board , ...

      Learn More

      FPC Comparison
      Transaction Info
      Price US$0.10-1.00 / Piece US$2.00 / Piece US$2.00 / Piece US$0.68-2.27 / pieces US$0.68-2.27 / pieces
      Min Order 1 Piece 2 Pieces 2 Pieces 5 pieces 5 pieces
      Payment Terms T/T LC, T/T, D/P, Western Union, PayPal, Small-amount payment LC, T/T, D/P, Western Union, PayPal, Small-amount payment T/T, D/P, PayPal, Western Union, Small-amount payment T/T, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Product Certification ISO9001,ISO14001,ISO13485,Ts-16949,etc - - - -
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Eastern Europe, Southeast Asia, Western Europe Southeast Asia/ Mideast Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
      Annual Export Revenue - - - - -
      Business Model - Own Brand Own Brand Own Brand, ODM, OEM Own Brand, ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Kevis;
      Products Name: PCBA Assembly PCB Electronic Motherboard Board;
      Layer: Single / Double Sided / Multilayer;
      Service: PCB/PCBA/PCB Assembly/Electronic Parts;
      Other Service: Layout Design,Engineering Support,Testing;
      Specialised: Medical,Industrial,Communication,Controlboard,LED;
      PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
      Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
      Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
      Min.Hole Size: 0.1mm (4 Mil);
      Board Thickness: 0.2mm-7mm;
      Min.Line Spacing: 0.1mm (4 Mil);
      Solder Color: Green, Red, White, Black,Yellow,Blue;
      SMT Assembly Line: 10 Lines;
      Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
      Structure: Multilayer FPC;
      Material: Pi;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Cry;
      Structure: Multilayer FPC;
      Material: Pi;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Cry;
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Delay Pressure Foil;
      Base Material: Picopper and Ni/Au;
      Insulation Materials: Organic Resin;
      Brand: Smart;
      Supplier Type: Manufacturer;
      Copper Thickness: 0.5oz;
      Min. Hole Size: 0.15mm;
      Min.Line Spacing: 0.075mm;
      Min. Line Width: 0.075mm;
      Stiffener: Without, Top, Bot, Both Sides;
      Solder Mask(Coverlay): Yellow, White, Black;
      Surface Finishing: Enig, Immersion Silver, OSP;
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Delay Pressure Foil;
      Base Material: Picopper and Ni/Au;
      Insulation Materials: Organic Resin;
      Brand: Smart;
      Supplier Type: Manufacturer;
      Copper Thickness: 0.5oz;
      Min. Hole Size: 0.15mm;
      Min.Line Spacing: 0.075mm;
      Min. Line Width: 0.075mm;
      Stiffener: Without, Top, Bot, Both Sides;
      Solder Mask(Coverlay): Yellow, White, Black;
      Surface Finishing: Enig, Immersion Silver, OSP;
      Supplier Name

      Guangzhou Kevis Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Chengruyuan Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Chengruyuan Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Smart Electronics Co., Ltd

      Diamond Member Audited Supplier

      Shenzhen Smart Electronics Co., Ltd

      Diamond Member Audited Supplier

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