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      PCBA
      US$0.10-1.50 / Piece
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      What is Electronics Multilayer Printed Circuit Board Assembly PCBA Manufacturer Production PCBA

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-99 Pieces US$1.50

      100-499 Pieces US$1.00

      500-999 Pieces US$0.50

      1,000+ Pieces US$0.10

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Application Consumer Electronics
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Organic Resin
      • Brand Kevis
      • Transport Package Individual Packaging
      • Specification 20*18*1
      • Origin Guangzhou
      • Layer 1-64 Layers
      • Board Thickness 0.2mm-7.0mm
      • Min. Line Width 0.075mm/0.075mm(3mil/3mil)
      • Min. Hole Size 0.15mm
      • Surface Treatment Flash Gold, Enig, Enepig, Gold Fingers Hard Gold
      • Solder Mask Color Green, Blue, Yellow, White, Black

      Product Description

      Electronics Multilayer Printed Circuit Board assembly PCBA Manufacturer Production PCBA About Us Our Advantage Factory 18+Years Pcb/Pcba Manufacturing Experience,4500 Workshop Areas,10 Automatic Production Lines. Advanced equipment and strong productivity make each PCB board more accurate ...

      Learn More

      PCBA Comparison
      Transaction Info
      Price US$0.10-1.50 / Piece US$99.00 / Piece US$6.00-10.00 / Piece US$6.00-10.00 / Piece US$6.00-10.00 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms T/T Small-amount payment, Western Union, PayPal, D/P, T/T, LC LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Management System Certification ISO9001:2015, ISO14001, Others - ISO9001:2015 ISO9001:2015 ISO9001:2015
      Trade Capacity
      Export Markets North America, South America, Southeast Asia/ Mideast, East Asia(Japan/ South Korea) North America, South America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic North America, Europe, Southeast Asia/ Mideast, East Asia(Japan/ South Korea), Australia, Domestic
      Annual Export Revenue - - - - -
      Business Model Own Brand, ODM, OEM ODM, OEM ODM, OEM ODM, OEM ODM, OEM
      Average Lead Time Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays, one month
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Kevis;
      Layer: 1-64 Layers;
      Board Thickness: 0.2mm-7.0mm;
      Min. Line Width: 0.075mm/0.075mm(3mil/3mil);
      Min. Hole Size: 0.15mm;
      Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold;
      Solder Mask Color: Green, Blue, Yellow, White, Black;
      Type: Rigid Laminate;
      Dielectric: RO3003;
      Material: RO3003;
      Application: 5g Infrastructure;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Bare Copper,Electrodeposited Copper;
      Base Material: RO3003;
      Insulation Materials: PTFE;
      Brand: Rogers;
      Board Types: Rigid Laminate;
      Test: 100% Electrical Test Prior Shipment;
      Type of Artwork to Be Supplied: Email File, Gerber RS-274-X, PCB.Doc etc;
      Service Area: Worldwide, Globally;
      Type: Combining Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Consumer Electronics;
      Flame Retardant Properties: V1;
      Mechanical Rigid: Fexible;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Yuande;
      Detection: Aoi & Spi Detection;
      The Size of PCB: L50mm *W50mm-L510mm*W460mm;
      The Thickness of PCB: 0.3mm~ 8mm;
      The Ability to Patch: 104300 Points/H;
      Type: Combining Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Consumer Electronics;
      Flame Retardant Properties: V1;
      Mechanical Rigid: Fexible;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Yuande;
      Detection: Aoi & Spi Detection;
      The Size of PCB: L50mm *W50mm-L510mm*W460mm;
      The Thickness of PCB: 0.3mm~ 8mm;
      The Dimensions of Components: 01005 (Imperal)/0402 (Metric);
      The Spacing of Components: The Minimum Spacing for IC Is 0.25mm, The Minimum;
      The Minimum Spacing for IC Is 0.25mm, Th: up to 30mm;
      Accuracy of The Patch: Chip: ±25μm, IC: Class ±30μm;
      The Ability to Patch: 104300 Points/H;
      PCBA Equipment: First Article Inspection;
      Automated Optical Inspection: Solder Paste Inspection;
      Automatic Screen Printer: Laser Marking Machine;
      Laser Cutting Machine: Nitrogen Reflow Welding Furnace;
      Available Components: Connector;
      Active Components: Passive Components;
      Discretes: Memory Chip;
      Type: Combining Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Consumer Electronics;
      Flame Retardant Properties: V1;
      Mechanical Rigid: Fexible;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Yuande;
      Detection: Aoi & Spi Detection;
      The Size of PCB: L50mm *W50mm-L510mm*W460mm;
      The Thickness of PCB: 0.3mm~ 8mm;
      The Ability to Patch: 104300 Points/H;
      PCBA Chip Processing: Massive Components in Stock;
      High-Speed Bom Order: Selection & Optimization for Material;
      Intelligent Counting of Materials: Intelligent Feeding;
      Reserve Materials in Advance: Rapid Sampling;
      SMT Panasonic High-Speed Patch Machine: DIP Welding & PCB Punching;
      Aoi & Spi Detection: Aoi & Spi Detection;
      Bulk Delivery Within 3-5 Days: Fast Logistics & Safety Acceptance;
      Miniature Waterproof: Massive Component Inventory, Super Cost-Effective;
      Wire Harness Processing: Customization of Design Scheme;
      Components Selections: SMT Component Installation;
      Contract for Labor and Materials of PCBA: Bom Order Allocation;
      Supplier Name

      Guangzhou Kevis Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Bicheng Electronic Technology Co., Ltd

      Gold Member Audited Supplier

      Beijing Jingbei Components Co., Ltd.

      Diamond Member Audited Supplier

      Beijing Jingbei Components Co., Ltd.

      Diamond Member Audited Supplier

      Beijing Jingbei Components Co., Ltd.

      Diamond Member Audited Supplier

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