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US$0.10-1.50 / Piece

Gerber Bom PCBA Reverse Engineering Clone Service Single-Sided PCB Assembly pictures & photos

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What is Gerber Bom PCBA Reverse Engineering Clone Service Single-Sided PCB Assembly

Name: Gerber Bom PCBA Reverse Engineering Clone Service Single-Sided PCB Assembly
Uploaded: 2026-01-12T02:39:04+08:00
Description: Gerber Bom PCBA Reverse Engineering Clone Service Single-Sided PCB Assembly About Us Our Advantage Factory 18+Years Pcb/Pcba Manufacturing Experience,4500 Workshop Areas,10 Automatic Production Line

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Price

Purchase Qty. Reference FOB Price

1-99 Pieces US$1.50

100-499 Pieces US$1.00

500-999 Pieces US$0.50

1,000+ Pieces US$0.10

Sepcifications

Type Rigid Circuit Board
Flame Retardant Properties V0
Dielectric FR-4
Base Material Copper
Insulation Materials Organic Resin
Processing Technology Electrolytic Foil
Application Consumer Electronics
Mechanical Rigid Rigid
Material Paper Phenolic Copper Foil Substrate
Brand Kevis
Transport Package Individual Packaging
Specification 20*18*1
Origin Guangzhou
Layer 1-64 Layers
Board Thickness 0.2mm-7.0mm
Min. Line Width 0.075mm/0.075mm(3mil/3mil)
Min. Hole Size 0.15mm
Surface Treatment Flash Gold, Enig, Enepig, Gold Fingers Hard Gold
Solder Mask Color Green, Blue, Yellow, White, Black

Product Description

Gerber Bom PCBA Reverse Engineering Clone Service Single-Sided PCB Assembly About Us Our Advantage Factory 18+Years Pcb/Pcba Manufacturing Experience,4500 Workshop Areas,10 Automatic Production Lines. Advanced equipment and strong productivity make each PCB board more accurate and ...

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Guangzhou Kevis Electronic Technology Co., Ltd.

Diamond Member Since 2024

Audited Supplier

Business Type Manufacturer/Factory & Trading Company
Main Products Yes
Management System Certification ISO9001:2015, ISO14001, Others
Address Room 601-3, Building D No. 7 Caipin Road, Science City, Huangpu District, Guangzhou, Guangdong, China
Main Markets North America, South America, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)
Number of Foreign Trading Staff 6

PCB Comparison

	Gerber Bom PCBA Reverse Engineering Clone Service Single-Sided PCB Assembly Contact Now	Quick View Automotive-Grade COB LED PCB - 5052 Material 1.6mm Turnkey Service Contact Now	Quick View Custom 5052 LED PCB IATF16949 Compliant PCB Factory Contact Now	Quick View ISO9001 Certified LED PCB - 2W/M· K 5052 Alloy Substrate Contact Now	Quick View Ipc-6012 Class 3 Thermoelectric PCB for Superior Lighting Contact Now

Transaction Info
	Gerber Bom PCBA Reverse Engineering Clone Service Single-Sided PCB Assembly Contact Now	Quick View Automotive-Grade COB LED PCB - 5052 Material 1.6mm Turnkey Service Contact Now	Quick View Custom 5052 LED PCB IATF16949 Compliant PCB Factory Contact Now	Quick View ISO9001 Certified LED PCB - 2W/M· K 5052 Alloy Substrate Contact Now	Quick View Ipc-6012 Class 3 Thermoelectric PCB for Superior Lighting Contact Now
Price	US$0.10-1.50 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece	US$0.80-2.60 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	T/T	T/T, Western Union	T/T, Western Union	T/T, Western Union	T/T, Western Union
Quality Control
Management System Certification	ISO9001:2015, ISO14001, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others	ISO14001, ISO9001:2015, ISO45001:2018, Others
Trade Capacity
Export Markets	North America, South America, Southeast Asia/ Mideast, East Asia(Japan/ South Korea)	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic	Southeast Asia/ Mideast, Domestic
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand, ODM, OEM	Own Brand, ODM	Own Brand, ODM	Own Brand, ODM	Own Brand, ODM
Average Lead Time	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Flame Retardant Properties: V0; Dielectric: FR-4; Base Material: Copper; Insulation Materials: Organic Resin; Processing Technology: Electrolytic Foil; Application: Consumer Electronics; Mechanical Rigid: Rigid; Material: Paper Phenolic Copper Foil Substrate; Brand: Kevis; Layer: 1-64 Layers; Board Thickness: 0.2mm-7.0mm; Min. Line Width: 0.075mm/0.075mm(3mil/3mil); Min. Hole Size: 0.15mm; Surface Treatment: Flash Gold, Enig, Enepig, Gold Fingers Hard Gold; Solder Mask Color: Green, Blue, Yellow, White, Black;	Type: Rigid Circuit Board; Flame Retardant Properties: Customized; Dielectric: MCPCB\Fr4\Bt; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Processing Technology: Delay Pressure Foil; Application: New Energy Vehicle Electronic Control Board; Mechanical Rigid: Rigid; Material: Aluminum; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: Aluminum 5052 Core (1.4mm); Thermal Conductivity: 2W/M·K (Dielectric Layer); Copper Foil: 35μm; Tg: 130°C;	Type: Rigid Circuit Board; Flame Retardant Properties: Customized; Dielectric: MCPCB\Fr4\Bt; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Processing Technology: Delay Pressure Foil; Application: New Energy Vehicle Electronic Control Board; Mechanical Rigid: Rigid; Material: Aluminum; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: Aluminum 5052 Core (1.4mm); Thermal Conductivity: 2W/M·K (Dielectric Layer); Copper Foil: 35μm; Tg: 130°C;	Type: Rigid Circuit Board; Flame Retardant Properties: Customized; Dielectric: MCPCB\Fr4\Bt; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Processing Technology: Delay Pressure Foil; Application: New Energy Vehicle Electronic Control Board; Mechanical Rigid: Rigid; Material: Aluminum; Brand: Hongyu; Board Thickness: 1.6mm; Metal Core PCB: Aluminum 5052 Core (1.4mm); Thermal Conductivity: 2W/M·K (Dielectric Layer); Copper Foil: 35μm; Tg: 130°C;	Type: Combining Rigid Circuit Board; Flame Retardant Properties: Customized; Dielectric: MCPCB\Fr4\Bt; Base Material: Double-Sided/Multilayer Aluminum/Copper; Insulation Materials: Customized; Processing Technology: Delay Pressure Foil; Application: New Energy Vehicle Electronic Control Board; Mechanical Rigid: Rigid; Material: Copper-Based; Brand: Hongyu; Board Thickness: 1.5mm; Metal Core PCB: T2 High Conductivity Copper(1.5mm); Thermal Conductivity: 398W/M·K (Dielectric Layer); Copper Foil: 70/70μm; Tg: 150°C;
Supplier Name	Guangzhou Kevis Electronic Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.	Jiangxi Hongyu Circuit Technology Co., Ltd.
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