| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Complex;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Metal Composite Materials;
Model: PCB;
Brand: Kevis;
Products Name: PCBA Assembly PCB Electronic Motherboard;
Layer: Single / Double Sided / Multilayer;
Service: PCB/PCBA/PCB Assembly/Electronic Parts;
Other Service: Layout Design,Engineering Support,Testing;
Specialised: Medical,Industrial,Communication,Controlboard,LED;
PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
Min.Hole Size: 0.1mm (4 Mil);
Board Thickness: 0.2mm-7mm;
Min.Line Spacing: 0.1mm (4 Mil);
Solder Color: Green, Red, White, Black,Yellow,Blue;
SMT Assembly Line: 10 Lines;
Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
|
Type: Combining Rigid Circuit Board;
Dielectric: Ceramic;
Material: Alumina Ceramic;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Alumina Ceramic;
Insulation Materials: Metal Composite Materials;
Model: PCB;
Brand: Ry;
Max Working Temperature: 1600c;
Rycolor: White, Ivory, Pink;
Special: Thin Film Alumina Ceramic;
Product: Alumina Parts;
Name: Machine Alumina Ceramic Substrate;
Raw Material: 60-99.7% Alumina Ceramic;
Item: Alumina Ceramics Dbc Substrate;
|
Type: Combining Rigid Circuit Board;
Dielectric: Ceramic;
Material: Alumina Ceramic;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Alumina Ceramic;
Insulation Materials: Metal Composite Materials;
Model: PCB;
Brand: Ry;
Max Working Temperature: 1600c;
Rycolor: White, Ivory, Pink;
Special: Thin Film Alumina Ceramic;
Product: Alumina Parts;
Name: Machine Alumina Ceramic Substrate;
Raw Material: 60-99.7% Alumina Ceramic;
Item: Alumina Ceramics Dbc Substrate;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Immersional Gold;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Board Thickness: 1.2~2.0mm;
Surface Finihsing: Immersional Gold;
Lead Time: 6-8 Working Days;
PCB Testing: E-Testing; Flying Probe Testing;
Mask Ink Color: White/Black/Green/Red/Yellow/Blue;
Color: Green Blue Red;
Number of Layers: Multilayer;
Copper Thickness: 1oz;
Condition: Original Made;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Ucreate PCB;
Min. Hold Size: 0.2mm;
Min. Line Width: 0.075mm;
Surface Finishing: Immersion Gold, OSP, HASL Lf;
Soldermask Color: Green, Blue, Red, White, Yellow;
Certificates: RoHS, ISO, Ts, UL;
Board Thinckness: 0.2-5.0mm;
|