| Specification |
Metal Coating: Gold;
Mode of Production: SMT;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Service: One-Stop Turnkey Service;
Model Number: Tandard;
Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg;
Material: Fr-4, High Frequency PTFE, Aluminum, Copper, Thick;
Copper Thickness: 1-10oz;
Solder Mask Color: Green, Yellow, White, Blue, Black, Red...;
Place of Origin: China;
Type: Channel Digital Amplifier;
Assembly Details: 6 SMT + 4 DIP (Dust and Anti-Static Lines);
Description: Printed Circuit Board Assembly;
Testing Service: Aoi, 100% E-Test;
Best Price: Please Contact Us;
Shipping by: DHL\UPS\FedEx\EMS\TNT\Aramex;
Lead Time: Lead Time;
Payment: Paypal\Tt\Western Union\ Trade Assurance;
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Metal Coating: Copper;
Mode of Production: SMT;
Layers: Double-Layer;
Base Material: FR-2;
Customized: Customized;
Condition: New;
Rated Power: 6000W;
Surger Power: 12000W;
Battery Charging: Include;
Keywords: Inverter Charger Circuit Board;
Waveform: Pure Sine Wave;
Input Voltage: 24V/48V;
Output Voltage: 220V/230V/240V;
Frequency: 50Hz/60Hz;
Communication: RS485(Optional);
LCD Display: Optional;
Total Harmonic Distortion: Thd≤3%;
No Load Current: 26V: 660mA/53V: 700mA;
Charging Current: 24V: 20A 48V: 10A;
Remote Control: Optional;
Protections: Multi-Layer Protection;
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Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
|
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
|
Metal Coating: Copper;
Mode of Production: DIP;
Layers: Multilayer;
Base Material: FR-4;
Customized: Customized;
Condition: New;
Type: Rigid Circuit Board;
Dielectric: Fr-4;
Material: Fiberglass Epoxy;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Insulation Materials: Epoxy Resin;
Processing Technology: Immersion Gold;
Copper Thickness: 3oz -105oz;
Surface Finish: Gold Finger;
Special Technology: Metal Edging;
Special 1: Blind Hole;
Special 2: Buried Vias;
Special 3: Flex-Rigid PCB;
Surface Finish 1: Immersion Gold Immersion Tin Hal Lead Free;
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