Besi Datacon 8800 FC Quantum Advx Die Bonding Machine Manufacture Die Bonder pictures & photos

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What is Besi Datacon 8800 FC Quantum Advx Die Bonding Machine Manufacture Die Bonder

Name: Besi Datacon 8800 FC Quantum Advx Die Bonding Machine Manufacture Die Bonder
Uploaded: 2026-01-06T14:23:21+08:00
Description: BESI Die Bonding Machine Product Description Product name BESI Die Bonding Machine Condition Used Usage Die Bonding Quality Tested Package Carton Box or wooden case Part number Datacon 8800 CHAMEO a

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Price

Min. Order Reference FOB Price

1 Piece US$19,999.00-69,999.00 / Piece

Sepcifications

After-sales Service 24 Hrs Online
Condition Used
Speed High Speed
Precision High Precision
Certification RoHS, ISO, CE
Warranty 6 Months
Automatic Grade Automatic
Type Die Bonding Machine
Transport Package Carton Packing or Wooden Case
Specification One piece per package
Trademark BESI
Origin USA
Characteristics Used
Product Number Datacon 8800 FC Quantum Advx
Quality Tested
Types Besi Die Bond Machine
Usage Die Bond Machine
Industry Chip Industry
Supply Ability 2000 PCS
Price Good

Product Description

BESI Die Bonding Machine Product Description Product name BESI Die Bonding Machine Condition Used Usage Die Bonding Quality Tested Package Carton Box or wooden case Part number Datacon 8800 CHAMEO advanced Payment Paypal, Western Union, TT, L/C and etc. Delivery UPS, DHL, FedEx, ...

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Guangdong Xinling Industrial Co., Ltd

Diamond Member Since 2021

Audited Supplier

Rating & Reviews: 5.0/5.0

(1 Reviews)

Business Type Manufacturer/Factory & Trading Company
Main Products SMT Printers, Placement Machines, AOI, SPI, Reflow Soldering, Wave Soldering, Plug-in ...
Year of Establishment 2021-01-28
Number of Employees 11
Address Chuangzhi Park, Congxinqiao 107, No. 18 Shangliao Industrial Road, Shangnan Shangliao Community, Xinqiao Street, Shenzhen, Guangdong, China

Die Bonding Machine Comparison

	Besi Datacon 8800 FC Quantum Advx Die Bonding Machine Manufacture Die Bonder Contact Now	Quick View SMD Machine FUJI SMT Machine Pick Place Machine Solder Reflow Machine Solder Paste Printer Machine Spi Machines Aoi Inspection Machine in SMT Line Contact Now	Quick View SMT Panasonic Nozzle 1002n for Npm Pick and Place Machine Contact Now	KOH Young Zenith 2 3D Aoi SMT Machine Aoi Inspection Automated Optical Inspection SMT 3D Aoi SMT Aoi Machine Aoi Machine in SMT Contact Now	KOH Young Zenith Alpha 3D Aoi SMT Machine Aoi Inspection Automated Optical Inspection SMT 3D Aoi SMT Aoi Machine Aoi Machine in SMT Contact Now

Transaction Info
	Besi Datacon 8800 FC Quantum Advx Die Bonding Machine Manufacture Die Bonder Contact Now	Quick View SMD Machine FUJI SMT Machine Pick Place Machine Solder Reflow Machine Solder Paste Printer Machine Spi Machines Aoi Inspection Machine in SMT Line Contact Now	Quick View SMT Panasonic Nozzle 1002n for Npm Pick and Place Machine Contact Now	KOH Young Zenith 2 3D Aoi SMT Machine Aoi Inspection Automated Optical Inspection SMT 3D Aoi SMT Aoi Machine Aoi Machine in SMT Contact Now	KOH Young Zenith Alpha 3D Aoi SMT Machine Aoi Inspection Automated Optical Inspection SMT 3D Aoi SMT Aoi Machine Aoi Machine in SMT Contact Now
Price	US$19,999.00-69,999.00 / Piece	US$15,000.00-200,000.00 / Piece	US$16.90-20.00 / Piece	US$110,000.00-125,000.00 / Piece	US$75,000.00-79,000.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	T/T	T/T, PayPal, Western Union, Small-amount payment, Money Gram	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	T/T, PayPal, Western Union, Small-amount payment, Money Gram	T/T, PayPal, Western Union, Small-amount payment, Money Gram
Quality Control
Product Certification	RoHS, ISO, CE	CE	CCC, PSE, ISO, CE	-	-
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	Europe, Domestic, South Asia	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	Domestic	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	Own Brand, ODM, OEM	-	ODM, OEM	-	-
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays, one month Off Season Lead Time: within 15 workdays, one month	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays
Product Attributes
Specification	After-sales Service: 24 Hrs Online; Condition: Used; Speed: High Speed; Precision: High Precision; Warranty: 6 Months; Automatic Grade: Automatic; Type: Die Bonding Machine; Characteristics: Used; Product Number: Datacon 8800 FC Quantum Advx; Quality: Tested; Types: Besi Die Bond Machine; Usage: Die Bond Machine; Industry: Chip Industry; Supply Ability: 2000 PCS; Price: Good;	After-sales Service: SMT Line; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; PCB Size(Lxwxt)(Mini.): 50X50X0.4mm; PCB Size(Lxwxt)(Single Lane): 410X460X5.0mm/680X460X5.0mm(Option); PCB Size(Lxwxt)(Dual Lane): 410X250X5.0mm/680X250X5.0mm(Option); Component Height: 10mm; Performance Optimal Condtion: 42, 000cph(0.086sec/Chip; Maxi. Number of Tape Feeders (8mm): 80ea(40X2); Machine Size (Wxdxh): 1, 200X1, 900X1, 500mm; Weight: Approx 1, 550kg;	After-sales Service: Technical Support; Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 6 Months; Automatic Grade: Automatic; Type: High-speed Chip Mounter; Quality: 100% Tested; Delivery: by Air/Sea/Land; Express: DHL/TNT/UPS/FedEx; Lead Time: 3 Days;	Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Board Size(1): 50X50W-510X510lmm; Board Size(2): 50X50W-510X580lmm; Board Size(3): 50X50W-510X320mm; Board Thickness 2: 0.4mm - 5.0mm; Board Thickness 3: 0.4mm - 8.0mm; Height Resolution: 15um-20um; Fov Size: 42X43mm/56X56mm/61X46mm; Max. Measurement Height: 25mm; Bottom Clearance: 50 mm (2.0 in); Weight: Approx.750kg; Dimension W X D X H: 1,000X1,530X1,805mm;	Condition: New; Speed: High Speed; Precision: High Precision; Warranty: 12 Months; Automatic Grade: Automatic; Board Size(1): 50X50W-490X510lmm; Board Size(2): 50X50W-490X580lmm; Board Size(3): 50X50W-490X320mm; Board Thickness 2: 0.4mm - 5.0mm; Board Thickness 3: 0.4mm - 8.0mm; Height Resolution: 10um-20um; Fov Size: 42X43mm/28X28mm/51X51mm/61X46mm; Max. Measurement Height: 3-25mm; Bottom Clearance: 50mm(1.97 in); Weight: Approx.600kg; Dimension W X D X H: 1,000X1,295X1,627mm;
Supplier Name	Guangdong Xinling Industrial Co., Ltd	MERAIF LIMITED	Shenzhen Tuoxing Electromechanical Equipment Co., Ltd.	MERAIF LIMITED	MERAIF LIMITED
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