| Specification |
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Delay Pressure Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: FR-4;
Board Thickness: 1.6mm;
Board Layer: 4 Layers;
Copper Thickness: 2 Oz;
Solder Mask: Green;
Silksreen: White;
Surface Finihsing: Enig;
Lead Time: 6-8 Working Days;
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Type: Combining Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Xinguanghui;
Weight: 250kg;
Power: AC220V;
Maximum Machining Size: 640*640mm;
Minimum Machining Size: 50*50mm;
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Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Paper Phenolic Copper Foil Substrate;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Brand: Xjy;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Surface Finishing: OSP;
Solder Mask Type: Green;
Silkscreen: White;
Min. Hole Size: 0.3mm;
Min. Line Width: 0.2mm;
Min. Line Spacing: 0.2mm;
Certificates: UL, RoHS, SGS, ISO9001;
Shipping: DHL, UPS, TNT, FedEx, etc;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Model: PCB;
Solder Mask: White, Green, Black, Red;
Silkscreen: White, Green, Black, Red;
PCB Material Thickness: 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm, 3.2mm;
Surface Finishing: HASL, Lf-Hal, Immerion Tin, Immerion Gold, OSP;
Copper Thickness: 1oz;
Min Hole Size: 0.2mm;
Min Line Width: 0.1mm;
Min Line Spacing: 0.1mm;
Shipping: UPS, FedEx, DHL, Ect;
|
Type: Rigid Circuit Board;
Dielectric: FR-4;
Material: Fiberglass Epoxy;
Flame Retardant Properties: V0;
Mechanical Rigid: Rigid;
Processing Technology: Electrolytic Foil;
Base Material: Copper;
Insulation Materials: Epoxy Resin;
Model: PCB;
Brand: Mzh;
Board Thickness: 1.0mm, 1.6mm, 2.0mm, 2.4mm, 3.2mm;
Max Copper: 12 Oz;
Min Laser Holes: 0.1 mm;
Service: PCB+PCBA+Components+Reverse Engineer;
Surface Finishing: Lf Hal, OSP, Enig, Enepig, Immersion Silver;
Min Trace/Space: 3/3 Mil;
Solder Resist Color: Green, Blue, Red, Yellow, Black, White, Orange;
Inspection Standard: Ipc-II, Ipc-III, Ppap;
Fastest Delivery Time: 24 Hours (Sample);
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