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      PCB Board
      US$7.59-7.61 / Piece
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      What is Custom Multilayer PCB Manufacturing

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-9,999 Pieces US$7.61

      10,000+ Pieces US$7.59

      Sepcifications

      • Structure Double-Sided Rigid PCB
      • Dielectric FR-3
      • Material Phenolic Paper Laminate
      • Application Computer
      • Flame Retardant Properties V0
      • Processing Technology Electrolytic Foil
      • Production Process Semi-Additive Process
      • Base Material Fr4
      • Insulation Materials Organic Resin
      • Brand Fastline
      • Transport Package Vacuum Packing
      • Specification IP class -2
      • Trademark Fastline
      • Origin Shenzhen, China
      • Board Material Fr4
      • Layers 1 to 30 Layers
      • Board Thickness 1.6mm
      • Copper Thickness 1oz
      • Solder Mask Green
      • Silk Screen White
      • Surface Treatment HASL Lead Free
      • Test 100%
      • Lead Time 6-8 Working Days
      • Min. Line Width 0.075mm

      Product Description

      Custom Multilayer PCB Manufacturing Product Description Fastline PCB's aim Customer Satisfaction is Always Our First Priority! *Quality Policy *Top Quality and high efficiency ...

      Learn More

      PCB Board Comparison
      Transaction Info
      Price US$7.59-7.61 / Piece US$0.98-1.68 / Piece US$0.68-1.68 / Piece US$0.01-1.00 / Piece US$0.10-10.00 / Piece
      Min Order 1 Piece 10 Pieces 10 Pieces 1 Piece 1 Piece
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
      Quality Control
      Product Certification - ISO9001/ISO14001/CE/RoHS ISO9001/ISO14001/CE/RoHS - -
      Management System Certification - Others Others - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model - Own Brand, ODM, OEM Own Brand, ODM, OEM - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Structure: Double-Sided Rigid PCB;
      Dielectric: FR-3;
      Material: Phenolic Paper Laminate;
      Application: Computer;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Semi-Additive Process;
      Base Material: Fr4;
      Insulation Materials: Organic Resin;
      Brand: Fastline;
      Board Material: Fr4;
      Layers: 1 to 30 Layers;
      Board Thickness: 1.6mm;
      Copper Thickness: 1oz;
      Solder Mask: Green;
      Silk Screen: White;
      Surface Treatment: HASL Lead Free;
      Test: 100%;
      Lead Time: 6-8 Working Days;
      Min. Line Width: 0.075mm;
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Phenolic Paper Laminate;
      Application: Communication;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Additive Process;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Jxpcba;
      PCBA Material: Fr4, High Tg, Halogen-Free, High Frequency;
      Surface Treatment: HASL/Immersion Gold/Immersion Silver/Immersion Tin;
      PCB Solder Mask: White, Black, Yellow, Green, Red, Blue;
      Component Packing: Tary, Tube, Tape;
      Number of Floors: 1-32;
      Minimum Line Width/Spacing: 3.0mil;
      Maximum Plate Thickness Aperture Ratio: 30:1;
      Minimum Mechanical Drilling Aperture: 6mil;
      Board Thickness: 0.2mm~6.0mm;
      Maximum Board Size: 640mm*1100mm;
      PCBA Test: Static Test, Power-on Function Test, Power-on Agin;
      PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
      PCBA Testing Service: Aoi, Ict, X-ray, Flying Probe Test;
      Product Application: Consumer Electronics/Home Appliances/Medical Equip;
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Phenolic Paper Laminate;
      Application: Communication;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Additive Process;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Jxpcba;
      PCBA Material: FR4, High TG, Halogen-Free, High Frequency;
      Surface Treatment: HASL/Immersion Gold/Immersion Silver/Immersion Tin;
      PCB Solder Mask: White, Black, Yellow, Green, Red, Blue;
      Component Packing: Tary, Tube, Tape;
      Number of Floors: 1-32;
      Minimum Line Width/Spacing: 3.0mil;
      Maximum Plate Thickness Aperture Ratio: 30:1;
      Minimum Mechanical Drilling Aperture: 6mil;
      Board Thickness: 0.2mm~6.0mm;
      Maximum Board Size: 640mm*1100mm;
      PCBA Test: Static Test, Power-on Function Test, Power-on Agin;
      PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
      PCBA Testing Service: Aoi, Ict, X-ray, Flying Probe Test;
      Product Application: Consumer Electronics/Home Appliances/Medical Equip;
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Fr4;
      Insulation Materials: Epoxy Resin;
      Brand: Abis;
      Copper Thickness: 1 Oz;
      Board Layer: 1-20 Layers;
      Board Thickness: 1.6mm;
      Surface Finish: Gold Plating, Enig;
      Solder Mask: Green/Custom;
      Legend: White;
      Structure: Double-Sided Rigid PCB;
      Dielectric: FR-4;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Fr4;
      Insulation Materials: Epoxy Resin;
      Brand: Abis;
      Copper Thickness: 1 Oz;
      Board Layer: 2 Layer;
      Board Thickness: 1.6mm;
      Surface Finish: Gold Plating, Enig;
      Solder Mask: Green/Custom;
      Legend: White;
      Supplier Name

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Shenzhen Jingxin Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Jingxin Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

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