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      PCB Assembly
      US$0.065-0.21 / Piece
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      What is Manufacturer PCB Circuit Board Reverse Engineering, Decryption Urgent Sample Making, Batch Production, PCBA Solution Develoment Accute Mouse PCB

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-999 Pieces US$0.21

      1,000-4,999 Pieces US$0.12

      5,000-99,999 Pieces US$0.09

      100,000+ Pieces US$0.065

      Sepcifications

      • Type Rigid Circuit Board
      • Flame Retardant Properties V2
      • Dielectric FR-4
      • Base Material Fr4
      • Insulation Materials Organic Resin
      • Processing Technology Electrolytic Foil
      • Application Aerospace
      • Mechanical Rigid Rigid
      • Material Fiberglass Epoxy
      • Brand Fastline
      • Transport Package Vacuum+Carton Packing
      • Specification RoHS, ISO9001, UL, SGS
      • Trademark Fastline
      • Origin Shenzhen, China
      • Board Thickness 1.6mm
      • Copper Thickness 1oz
      • Material Type Fr4
      • Surface Treatment HASL Lead Free
      • Solder Mask Green, Red, Blue, Black
      • Silk Screen Color White
      • Board Layer 1 Layer
      • Shipping Type DHL, UPS, TNT, EMS, FedEx etc
      • Packing Type Carton + Vacuum
      • Lead Time 5-7 Days

      Product Description

      Manufacturer PCB Circuit Board Reverse Engineering, Decryption Urgent Sample Making, Batch Production, PCBA Solution Develoment Accute mouse pcb Fastline could produce 1-26 layers PCB board for electronic products.providing PCB design, PCB fabrication,PCB clone and PCB assembly services. and we ...

      Learn More

      PCB Assembly Comparison
      Transaction Info
      Price US$0.065-0.21 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece US$0.80-2.60 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, Western Union T/T, Western Union T/T, Western Union T/T, Western Union
      Quality Control
      Management System Certification - ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others ISO14001, ISO9001:2015, ISO45001:2018, Others
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic Southeast Asia/ Mideast, Domestic
      Annual Export Revenue - - - - -
      Business Model - Own Brand, ODM Own Brand, ODM Own Brand, ODM Own Brand, ODM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Flame Retardant Properties: V2;
      Dielectric: FR-4;
      Base Material: Fr4;
      Insulation Materials: Organic Resin;
      Processing Technology: Electrolytic Foil;
      Application: Aerospace;
      Mechanical Rigid: Rigid;
      Material: Fiberglass Epoxy;
      Brand: Fastline;
      Board Thickness: 1.6mm;
      Copper Thickness: 1oz;
      Material Type: Fr4;
      Surface Treatment: HASL Lead Free;
      Solder Mask: Green, Red, Blue, Black;
      Silk Screen Color: White;
      Board Layer: 1 Layer;
      Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
      Packing Type: Carton + Vacuum;
      Lead Time: 5-7 Days;
      Type: Combining Rigid Circuit Board;
      Flame Retardant Properties: Customized;
      Dielectric: MCPCB\Fr4\Bt;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Processing Technology: Delay Pressure Foil;
      Application: New Energy Vehicle Electronic Control Board;
      Mechanical Rigid: Rigid;
      Material: Copper-Based;
      Brand: Hongyu;
      Board Thickness: 1.5mm;
      Metal Core PCB: Oxygen-Free Copper(OFC) 1.5mm;
      Thermal Conductivity: 398W/M·K (Dielectric Layer);
      Copper Foil: 70μm;
      Tg: 150°C;
      Type: Combining Rigid Circuit Board;
      Flame Retardant Properties: Customized;
      Dielectric: MCPCB\Fr4\Bt;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Processing Technology: Delay Pressure Foil;
      Application: New Energy Vehicle Electronic Control Board;
      Mechanical Rigid: Rigid;
      Material: Copper-Based;
      Brand: Hongyu;
      Board Thickness: 1.5mm;
      Metal Core PCB: Oxygen-Free Copper(OFC) 1.5mm;
      Thermal Conductivity: 398W/M·K (Dielectric Layer);
      Copper Foil: 70μm;
      Tg: 150°C;
      Type: Combining Rigid Circuit Board;
      Flame Retardant Properties: Customized;
      Dielectric: MCPCB\Fr4\Bt;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Processing Technology: Delay Pressure Foil;
      Application: New Energy Vehicle Electronic Control Board;
      Mechanical Rigid: Rigid;
      Material: Copper-Based;
      Brand: Hongyu;
      Board Thickness: 1.5mm;
      Metal Core PCB: Oxygen-Free Copper(OFC) 1.5mm;
      Thermal Conductivity: 398W/M·K (Dielectric Layer);
      Copper Foil: 70μm;
      Tg: 150°C;
      Type: Combining Rigid Circuit Board;
      Flame Retardant Properties: Customized;
      Dielectric: MCPCB\Fr4\Bt;
      Base Material: Double-Sided/Multilayer Aluminum/Copper;
      Insulation Materials: Customized;
      Processing Technology: Delay Pressure Foil;
      Application: New Energy Vehicle Electronic Control Board;
      Mechanical Rigid: Rigid;
      Material: Copper-Based;
      Brand: Hongyu;
      Board Thickness: 1.5mm;
      Metal Core PCB: Oxygen-Free Copper(OFC) 1.5mm;
      Thermal Conductivity: 398W/M·K (Dielectric Layer);
      Copper Foil: 70μm;
      Tg: 150°C;
      Supplier Name

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

      Jiangxi Hongyu Circuit Technology Co., Ltd.

      Diamond Member Audited Supplier

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