Flexible PCB

US$0.36-0.78 / Piece

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What is PCB Material Flexible PCB Stiffener Flexible PCB Circuit Board

Name: PCB Material Flexible PCB Stiffener Flexible PCB Circuit Board
Uploaded: 2025-12-22T22:53:27+08:00
Description: Pi Material Flexible PCB Stiffener Flexible PCB circuit Board Fastline could produce 1-26 layers PCB board for electronic products, providing PCB design, PCB fabrication, PCB clone, and PCB assembly

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Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$0.78

1,000-4,999 Pieces US$0.56

5,000-9,999 Pieces US$0.46

10,000+ Pieces US$0.36

Sepcifications

Structure Multilayer FPC
Material Fiberglass Epoxy, Polyester Film
Combination Mode Adhesive Flexible Plate
Application Aviation and Aerospace, Consumer Electronics
Conductive Adhesive Conductive Silver Paste
Flame Retardant Properties V2, V0
Processing Technology Delay Pressure Foil, Electrolytic Foil
Base Material Copper
Insulation Materials Epoxy Resin
Transport Package Vacuum+Carton Packing
Specification RoHS, ISO9001, UL, SGS
Trademark FL
Origin Shenzhen, China
Type Rigid Circuit Board
Mechanical Rigid Rigid
Dielectric Fr4 and Polyimide, Fr-4
Board Material Fr2 and Polyimide
Board Layer 2 Layer Rigide and 2 Layer Flex
Copper Thickness 1 Oz
Min. Line Space 0.05mm (2mil)
Min Conductor Width 0.05mm(2mil)
Min.Hole Size 0.075mm (3mil)
Solder Mask Any Color
Silkscreen Any Color
Surface Finishing Enig, Immersion Tin, Immersion Gold. OSP
Lead Time 5-6 Working Days
PCB Design Customer Provided
Board Thickness 0.1mm
Min Pad +/-0.1mm (4mil)
Outline Machining Accuracy +/-0.1mm (4mil)
MOQ 1 PCS

Product Description

Pi Material Flexible PCB Stiffener Flexible PCB circuit Board Fastline could produce 1-26 layers PCB board for electronic products, providing PCB design, PCB fabrication, PCB clone, and PCB assembly services. and we have got the UL, ISO, SGS certifications. Please see our PCB catalog below: ...

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Fastline Circuits Co., Limited

Diamond Member Since 2013

Audited Supplier

Main Products Print Circuit Board, Aluminum PCB, Flexible PCB, Rigid PCB, PCB Prototype, PCB Assembly, ...
Year of Establishment 2006-09-21
Address 3/F, Building B3, Fuqiao No. 4, Fuhai Subdistrict, Baoan District, Shenzhen, Guangdong, China
Plant Area 580 square meters
Registered Capital 1,000,000 RMB
Main Markets North America, South America, Europe, Southeast Asia/ Mideast

Flexible PCB Comparison

	PCB Material Flexible PCB Stiffener Flexible PCB Circuit Board Contact Now	Quick View FPC Design and Manufacturing Flexible PCB Medical Equipment Hair Treatment Device China Factory Contact Now	Quick View Customized Medical Beauty FPC Wire Accessories Flexible Circuit Board Contact Now	Quick View Shenzhen Manufacturers Customized FPC Flexible Printed Circuit Board Contact Now	Quick View Premium FPC for Mobile Phone Displays and Modules Contact Now

Transaction Info
	PCB Material Flexible PCB Stiffener Flexible PCB Circuit Board Contact Now	Quick View FPC Design and Manufacturing Flexible PCB Medical Equipment Hair Treatment Device China Factory Contact Now	Quick View Customized Medical Beauty FPC Wire Accessories Flexible Circuit Board Contact Now	Quick View Shenzhen Manufacturers Customized FPC Flexible Printed Circuit Board Contact Now	Quick View Premium FPC for Mobile Phone Displays and Modules Contact Now
Price	US$0.36-0.78 / Piece	US$2.89 / Piece	US$2.89 / Piece	US$2.89 / Piece	US$1.00-5.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, Western Union, PayPal, Small-amount payment	LC, T/T, D/P, Western Union, PayPal, Small-amount payment	LC, T/T, D/P, Western Union, PayPal, Small-amount payment	LC, T/T, D/P, Western Union, PayPal, Small-amount payment
Quality Control
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast	Southeast Asia/ Mideast	Southeast Asia/ Mideast	Southeast Asia/ Mideast	Southeast Asia/ Mideast
Annual Export Revenue	-	-	-	-	-
Business Model	-	Own Brand	Own Brand	Own Brand	Own Brand
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Multilayer FPC; Material: Fiberglass Epoxy, Polyester Film; Combination Mode: Adhesive Flexible Plate; Application: Aviation and Aerospace, Consumer Electronics; Conductive Adhesive: Conductive Silver Paste; Flame Retardant Properties: V2, V0; Processing Technology: Delay Pressure Foil, Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Type: Rigid Circuit Board; Mechanical Rigid: Rigid; Dielectric: Fr4 and Polyimide, Fr-4; Board Material: Fr2 and Polyimide; Board Layer: 2 Layer Rigide and 2 Layer Flex; Copper Thickness: 1 Oz; Min. Line Space: 0.05mm (2mil); Min Conductor Width: 0.05mm(2mil); Min.Hole Size: 0.075mm (3mil); Solder Mask: Any Color; Silkscreen: Any Color; Surface Finishing: Enig, Immersion Tin, Immersion Gold. OSP; Lead Time: 5-6 Working Days; PCB Design: Customer Provided; Board Thickness: 0.1mm; Min Pad: +/-0.1mm (4mil); Outline Machining Accuracy: +/-0.1mm (4mil); MOQ: 1 PCS;	Structure: Multilayer FPC; Material: Pi; Combination Mode: Adhesive Flexible Plate; Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace; Conductive Adhesive: Conductive Silver Paste; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Cry;	Structure: Multilayer FPC; Material: Pi; Combination Mode: Adhesive Flexible Plate; Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace; Conductive Adhesive: Conductive Silver Paste; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Cry;	Structure: Multilayer FPC; Material: Pi; Combination Mode: Adhesive Flexible Plate; Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace; Conductive Adhesive: Conductive Silver Paste; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Cry;	Structure: Double-Sided FPC; Material: Polyimide; Combination Mode: Without Adhesive Flexible Plate; Application: Beauty Mask FPC; Conductive Adhesive: Anisotropic Conductive Adhesive; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: Cry; Assembly Type: FPC, Rigid-Flex PCB; HASL/OSP/AG/Enig/Enepig/Silver/Tin Impre: ± 0.03 mm; Through-Hole Tolerance: ± 0.05 mm; Etching Tolerance: ± 0.02 mm; Solder Accuracy Tolerances: ± 0.05 mm;
Supplier Name	Fastline Circuits Co., Limited	Shenzhen Chengruyuan Technology Co., Ltd.	Shenzhen Chengruyuan Technology Co., Ltd.	Shenzhen Chengruyuan Technology Co., Ltd.	Shenzhen Chengruyuan Technology Co., Ltd.
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