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      Rigid PCB
      US$0.28-0.36 / piece
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      What is Shenzhen Rigid Custom Electronic PCB SMT/DIP Assembly PCBA Manufacturer

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-99 piece US$0.36

      100+ piece US$0.28

      Sepcifications

      • Structure Double-Sided Rigid PCB, Multilayer Rigid PCB
      • Dielectric Fr-3, FR-4
      • Material Phenolic Paper Laminate, Polyester Glass Fiber Mat Laminate
      • Application Computer, Consumer Electronics
      • Flame Retardant Properties V0
      • Processing Technology Electrolytic Foil
      • Production Process Semi-Additive Process, Subtractive Process
      • Base Material Fr4, Copper
      • Insulation Materials Organic Resin
      • Brand Fastline
      • Transport Package Vacuum Packing
      • Specification IP class -2
      • Trademark Fastline
      • Origin Shenzhen, China
      • Board Material Fr4
      • Layers 1 to 30 Layers
      • Board Thickness 1.6mm
      • Copper Thickness 1oz
      • Solder Mask Green
      • Silk Screen White
      • Surface Treatment HASL Lead Free
      • Test 100%
      • Lead Time 6-8 Working Days
      • Min. Line Width 0.075mm

      Product Description

      Shenzhen Rigid Custom Electronic PCB SMT/DIP Assembly PCBA Manufacturer Product Description Fastline PCB's aim Customer Satisfaction is Always Our First Priority! *Quality Policy *Top Quality and ...

      Learn More

      Rigid PCB Comparison
      Transaction Info
      Price US$0.28-0.36 / piece US$99.00-199.00 / Piece US$99.00-199.00 / Piece US$65.00-75.00 / Piece US$99.00-199.00 / Piece
      Min Order 1 piece 10 Pieces 10 Pieces 1 Piece 10 Pieces
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union, Small-amount payment
      Quality Control
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia, Domestic
      Annual Export Revenue - - - - -
      Business Model - ODM, OEM ODM, OEM ODM, OEM ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Structure: Double-Sided Rigid PCB, Multilayer Rigid PCB;
      Dielectric: Fr-3, FR-4;
      Material: Phenolic Paper Laminate, Polyester Glass Fiber Mat Laminate;
      Application: Computer, Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Semi-Additive Process, Subtractive Process;
      Base Material: Fr4, Copper;
      Insulation Materials: Organic Resin;
      Brand: Fastline;
      Board Material: Fr4;
      Layers: 1 to 30 Layers;
      Board Thickness: 1.6mm;
      Copper Thickness: 1oz;
      Solder Mask: Green;
      Silk Screen: White;
      Surface Treatment: HASL Lead Free;
      Test: 100%;
      Lead Time: 6-8 Working Days;
      Min. Line Width: 0.075mm;
      Structure: Metal Base Rigid PCB;
      Dielectric: FR-1;
      Material: Epoxy Paper Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V2;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Aluminum;
      Insulation Materials: Metal Composite Materials;
      Brand: Head Sun;
      Machine No. 1: Hds Live 7;
      Machine No. 2: Hds Live 9;
      Machine No. 3: Hds Live 12;
      Machine No. 4: Hds Live 16;
      Machine No. 5: Hds PRO 16;
      Machine No. 6: Hds-7 Carbon;
      Machine No. 7: Hds-9 Carbon;
      Machine No. 8: Hds-12 Carbon;
      Machine No. 9: Hds-16 Carbon;
      Machine No. 10: Hds 9 Gen 2 Touch;
      Machine No. 11: Hds 9 Gen 3 Touch;
      Machine No. 12: Hds 12 Gen 2 Touch;
      Machine No. 13: Hds 12 Gen 3 Touch;
      Machine No. 14: Hds 8 Insight USA;
      Machine No. 15: Hds-8;
      Structure: Metal Base Rigid PCB;
      Dielectric: FR-1;
      Material: Epoxy Paper Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V2;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Aluminum;
      Insulation Materials: Metal Composite Materials;
      Brand: Head Sun;
      Machine No. 1: Hds Live 7;
      Machine No. 2: Hds Live 9;
      Machine No. 3: Hds Live 12;
      Machine No. 4: Hds Live 16;
      Machine No. 5: Hds PRO 16;
      Machine No. 6: Hds-7 Carbon;
      Machine No. 7: Hds-9 Carbon;
      Machine No. 8: Hds-12 Carbon;
      Machine No. 9: Hds-16 Carbon;
      Machine No. 10: Hds 9 Gen 2 Touch;
      Machine No. 11: Hds 9 Gen 3 Touch;
      Machine No. 12: Hds 12 Gen 2 Touch;
      Machine No. 13: Hds 12 Gen 3 Touch;
      Machine No. 14: Hds 8 Insight USA;
      Machine No. 15: Hds-8;
      Structure: Metal Base Rigid PCB;
      Dielectric: FR-1;
      Material: Epoxy Paper Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V2;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Aluminum;
      Insulation Materials: Metal Composite Materials;
      Brand: Head Sun;
      Machine No. 1: Life Fitness Treadmill Machines;
      Machine No. 2: Life Fitness Jogging Machines;
      Machine No. 3: 98-0003-4020-2;
      Machine No. 4: 98-0003-3583-0;
      Machine No. 5: 98-0003-4019-4;
      Machine No. 6: Precor Treadmill P62;
      Machine No. 7: Precor Treadmill P80;
      Machine No. 8: Precor Treadmill P82;
      Machine No. 9: 98-0003-3490-8;
      Machine No. 10: 98-0003-3189-6;
      Machine No. 11: 98-0003-3986-5;
      Machine No. 12: 98-0003-3988- 1;
      Machine No. 13: 98-0003-2514-6;
      Machine No. 14: Sct3250 Fitness Machines;
      Machine No. 15: Sct3250 Slot Gaming Machines;
      Structure: Metal Base Rigid PCB;
      Dielectric: FR-1;
      Material: Epoxy Paper Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V2;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Aluminum;
      Insulation Materials: Metal Composite Materials;
      Brand: Head Sun;
      Machine No. 1: Hds Live 7;
      Machine No. 2: Hds Live 9;
      Machine No. 3: Hds Live 12;
      Machine No. 4: Hds Live 16;
      Machine No. 5: Hds PRO 16;
      Machine No. 6: Hds-7 Carbon;
      Machine No. 7: Hds-9 Carbon;
      Machine No. 8: Hds-12 Carbon;
      Machine No. 9: Hds-16 Carbon;
      Machine No. 10: Hds 9 Gen 2 Touch;
      Machine No. 11: Hds 9 Gen 3 Touch;
      Machine No. 12: Hds 12 Gen 2 Touch;
      Machine No. 13: Hds 12 Gen 3 Touch;
      Machine No. 14: Hds 8 Insight USA;
      Machine No. 15: Hds-8;
      Supplier Name

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Head Sun Co., Ltd.

      Diamond Member Audited Supplier

      Head Sun Co., Ltd.

      Diamond Member Audited Supplier

      Head Sun Co., Ltd.

      Diamond Member Audited Supplier

      Head Sun Co., Ltd.

      Diamond Member Audited Supplier

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