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      Multilayer PCB
      US$0.16-0.26 / Piece
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      What is Prototype PCB Single/Double/Multilayer PCB Board Electronic PCB Board

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-999 Pieces US$0.26

      1,000-4,999 Pieces US$0.23

      5,000-9,999 Pieces US$0.19

      10,000+ Pieces US$0.16

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Application Communication
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Fr4
      • Insulation Materials Epoxy Resin
      • Transport Package Vacuum+Carton Packing
      • Specification RoHS, ISO9001, UL, SGS
      • Trademark FL
      • Origin Shenzhen, China
      • Board Material Fr4 Tg150
      • Board Layer 2
      • Board Thickness 1.6mm
      • Copper Thickness 1 Oz
      • Max PCB Size 650*650mm
      • Min Hole 0.15mm
      • Min Trace 0.15mm
      • Surface Finishing Enig
      • Solder Mask Any
      • Lead Time 4-5 Working Days

      Product Description

      -------------------------------------------------------------------------------------------------------------------------------------------- Product Description PCB Capability: Fastline Circuits Co.,Limited PCB Manufacturing Capability Item Manufacture Capability Layers 1-50 Layers ...

      Learn More

      Multilayer PCB Comparison
      Transaction Info
      Price US$0.16-0.26 / Piece US$0.10-1.00 / Piece US$0.10-1.00 / Piece US$0.90-2.60 / Piece US$5.60 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 500 Pieces
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T T/T LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union
      Quality Control
      Product Certification - ISO9001,ISO14001,ISO13485,Ts-16949,etc ISO9001,ISO14001,ISO13485,Ts-16949,etc - -
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Southeast Asia
      Annual Export Revenue - - - - -
      Business Model - - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: 1-3 months
      Off Season Lead Time: 3-6 months
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Communication;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Fr4;
      Insulation Materials: Epoxy Resin;
      Board Material: Fr4 Tg150;
      Board Layer: 2;
      Board Thickness: 1.6mm;
      Copper Thickness: 1 Oz;
      Max PCB Size: 650*650mm;
      Min Hole: 0.15mm;
      Min Trace: 0.15mm;
      Surface Finishing: Enig;
      Solder Mask: Any;
      Lead Time: 4-5 Working Days;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Kevis;
      Products Name: PCBA Assembly PCB Electronic Motherboard;
      Layer: Single / Double Sided / Multilayer;
      Service: PCB/PCBA/PCB Assembly/Electronic Parts;
      Other Service: Layout Design,Engineering Support,Testing;
      Specialised: Medical,Industrial,Communication,Controlboard,LED;
      PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
      Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
      Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
      Min.Hole Size: 0.1mm (4 Mil);
      Board Thickness: 0.2mm-7mm;
      Min.Line Spacing: 0.1mm (4 Mil);
      Solder Color: Green, Red, White, Black,Yellow,Blue;
      SMT Assembly Line: 10 Lines;
      Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Kevis;
      Products Name: PCBA Assembly PCB Electronic Motherboard;
      Layer: Single / Double Sided / Multilayer;
      Service: PCB/PCBA/PCB Assembly/Electronic Parts;
      Other Service: Layout Design,Engineering Support,Testing;
      Specialised: Medical,Industrial,Communication,Controlboard,LED;
      PCBA QC: X-ray, Aoi Test, Function Test(100% Test),40X Om;
      Surface Finishing: HASL, Enig, OSP, Lmmersion Au, AG,Sn;
      Copper Thickness: 0.5oz/1oz/2oz/3oz/4oz;
      Min.Hole Size: 0.1mm (4 Mil);
      Board Thickness: 0.2mm-7mm;
      Min.Line Spacing: 0.1mm (4 Mil);
      Solder Color: Green, Red, White, Black,Yellow,Blue;
      SMT Assembly Line: 10 Lines;
      Delivery: PCB: 1-5 Days; PCB Assembly: 1-10 Days;
      Type: 94V-0 Multilayer PCB;
      Dielectric: FR-4;
      Material: Customized;
      Application: All;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid, Fexible, Rigid and Fexible;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper, FPC , Ceramic, Aluminum-Based, High Freque;
      Insulation Materials: Organic Resin;
      Service: PCB+Assembly+Components;
      Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
      Testing Service: Electrical Testing,Flying Probe Tester,Functional;
      Min. Hole Size: 0.15mm;
      Min. Line Spacing: 0.075---0.09mm;
      Surface Finishing: Asl\OSP\Immersion Gold;
      Type: Combining Rigid Circuit Board;
      Dielectric: CEM-3;
      Material: Complex;
      Application: Communication;
      Flame Retardant Properties: HB;
      Mechanical Rigid: Fexible;
      Processing Technology: Delay Pressure Foil;
      Base Material: Copper;
      Insulation Materials: Metal Composite Materials;
      Brand: Cookermore;
      Weight(Kg): 0.16;
      Supplier Name

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Guangzhou Kevis Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Guangzhou Kevis Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      JS Technology Co., Ltd.

      Diamond Member Audited Supplier

      Guangdong Cookermore CO., Ltd

      Diamond Member Audited Supplier

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