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      Multilayer PCB Board / Circuit Board with OSP Finished Prototype

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-999 Pieces US$0.31

      1,000-4,999 Pieces US$0.28

      5,000-9,999 Pieces US$0.24

      10,000+ Pieces US$0.20

      Sepcifications

      • Structure Multilayer Rigid PCB
      • Dielectric FR-4
      • Material Polyester Glass Fiber Mat Laminate
      • Application Communication
      • Flame Retardant Properties V0
      • Processing Technology Electrolytic Foil
      • Production Process Subtractive Process
      • Base Material Fr4
      • Insulation Materials Epoxy Resin
      • Transport Package Vacuum+Carton Packing
      • Specification RoHS, ISO9001, UL, SGS
      • Trademark FL
      • Origin Shenzhen, China
      • Board Thickness 1.6mm
      • Board Layer 2 Layers
      • Copper Thickness 2 Oz
      • Solder Mask Green
      • Silksreen White
      • Surface Finihsing OSP
      • Lead Time 6-8 Working Days
      • Shipping Type DHL.TNT, EMS, FedEx, UPS etc
      • PCB Design Custom Design Product
      • Test Fly Probe Testing
      • Min Hole Size 0.075mm/3mil
      • Min Conductor Width 0.05mm/2mil
      • Min Conductor Spacing 0.05mm/2mil
      • Outline Machining Accuracy +/-0.10mm(4mil)
      • Service One Stop

      Product Description

      Multilayer PCB Board / circuit Board with OSP Finished Prototype Fastline could produce 1-26 layers PCB board for electronic products.providing PCB design, PCB fabrication,PCB clone and PCB assembly services. and we have got the UL, ISO, SGS certifications. Pls see our pcb catalog below: 1. ...

      Learn More

      Multi Layer PCB Comparison
      Transaction Info
      Price US$0.20-0.31 / Piece US$2.00-4.50 / Piece US$1.50-4.50 / Piece US$2.00-4.50 / Piece US$2.00-4.50 / Piece
      Min Order 1 Piece 10 Pieces 10 Pieces 10 Pieces 10 Pieces
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, PayPal, Western Union, Small-amount payment, Money Gram
      Quality Control
      Management System Certification - Others Others Others Others
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe North America, Eastern Europe, Africa, Mid East, Western Europe
      Annual Export Revenue - - - - -
      Business Model - Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM Own Brand, ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Communication;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Fr4;
      Insulation Materials: Epoxy Resin;
      Board Thickness: 1.6mm;
      Board Layer: 2 Layers;
      Copper Thickness: 2 Oz;
      Solder Mask: Green;
      Silksreen: White;
      Surface Finihsing: OSP;
      Lead Time: 6-8 Working Days;
      Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
      PCB Design: Custom Design Product;
      Test: Fly Probe Testing;
      Min Hole Size: 0.075mm/3mil;
      Min Conductor Width: 0.05mm/2mil;
      Min Conductor Spacing: 0.05mm/2mil;
      Outline Machining Accuracy: +/-0.10mm(4mil);
      Service: One Stop;
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Epoxide Woven Glass Fabric Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: HB;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Aluminum;
      Insulation Materials: Epoxy Resin;
      Brand: Jxpcba;
      Layer: 1-32 Layers;
      Board Thickness: 0.2-8.0mm;
      PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
      PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
      Qualified: Ipc-a-610cclass 2 Standard;
      Thick Copper: 18um-140um(4oz);
      Service: OEM/ODM, EMS;
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Epoxide Woven Glass Fabric Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: HB;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Aluminum;
      Insulation Materials: Epoxy Resin;
      Brand: Jxpcba;
      Layer: 1-32 Layers;
      Board Thickness: 0.2-8.0mm;
      PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
      PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
      Qualified: Ipc-a-610cclass 2 Standard;
      Thick Copper: 18um-140um(4oz);
      Service: OEM/ODM, EMS;
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Epoxide Woven Glass Fabric Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: HB;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Aluminum;
      Insulation Materials: Epoxy Resin;
      Brand: Jxpcba;
      Layer: 1-32 Layers;
      Board Thickness: 0.2-8.0mm;
      PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
      PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
      Qualified: Ipc-a-610cclass 2 Standard;
      Thick Copper: 18um-140um(4oz);
      Service: OEM/ODM, EMS;
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Epoxide Woven Glass Fabric Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: HB;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Aluminum;
      Insulation Materials: Epoxy Resin;
      Brand: Jxpcba;
      Layer: 1-32 Layers;
      Board Thickness: 0.2-8.0mm;
      PCBA Testing: PCB: Ict Testing and Flying Probe Testing, PCBA: a;
      PCBA Packaging: Static Packaging, Shockproof Packaging, Anti-Drop;
      Qualified: Ipc-a-610cclass 2 Standard;
      Thick Copper: 18um-140um(4oz);
      Service: OEM/ODM, EMS;
      Supplier Name

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Shenzhen Jingxin Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Jingxin Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Jingxin Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Jingxin Electronic Technology Co., Ltd.

      Diamond Member Audited Supplier

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