Polyimide FPC

US$1.26-2.81 / Piece

Enig FPC Flexible FPCB Circuit Board with Customized Layers pictures & photos

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What is Enig FPC Flexible FPCB Circuit Board with Customized Layers

Name: Enig FPC Flexible FPCB Circuit Board with Customized Layers
Uploaded: 2025-12-22T23:35:39+08:00
Description: Enig FPC flexible FPCB circuit board with customized layers Fastline Circuits is capable of providing full turnkey and partial turnkey printed circuit board assembly services. For full turnkey, we ta

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Price

Min. Order Reference FOB Price

1 Piece US$1.26-2.81 / Piece

Sepcifications

Structure Double-Sided FPC
Material Polyimide
Combination Mode Adhesive Flexible Plate
Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
Conductive Adhesive Conductive Silver Paste
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Base Material Polyimide
Insulation Materials Epoxy Resin
Transport Package Vacuum +Carton Packing
Specification RoHS, ISO9001, UL, SGS
Trademark FL
Origin Shenzhen, China
Board Material Polyimide
Board Layer 4
Board Thickness 0.2 mm
Copper Thickness 1 Oz
Solser Mask Yellow
Silkscreen White
Surface Finishing Enig
Lead Time 4-5 Working Days
Shipping Type DHL.TNT, EMS, FedEx, UPS etc
PCB Design Custom Design Product

Product Description

Enig FPC flexible FPCB circuit board with customized layers Fastline Circuits is capable of providing full turnkey and partial turnkey printed circuit board assembly services. For full turnkey, we take care of the entire process, including preparatio n of Printed Circuit Boards, procurement of ...

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Fastline Circuits Co., Limited

Diamond Member Since 2013

Audited Supplier

Main Products Print Circuit Board, Aluminum PCB, Flexible PCB, Rigid PCB, PCB Prototype, PCB Assembly, ...
Year of Establishment 2006-09-21
Address 3/F, Building B3, Fuqiao No. 4, Fuhai Subdistrict, Baoan District, Shenzhen, Guangdong, China
Plant Area 580 square meters
Registered Capital 1,000,000 RMB
Main Markets North America, South America, Europe, Southeast Asia/ Mideast

Polyimide FPC Comparison

	Enig FPC Flexible FPCB Circuit Board with Customized Layers Contact Now	Quick View Fr4 High Tg Flex Rigid Printed Circuit Board Applied Antenna FPC Board Contact Now	Quick View LED Strip Flexible PCB FPCB Printed Circuit Board Flex Rigid PCBA Contact Now	Quick View Flex Printed Circuit Board Multilayer FPC Fr4 Flexible PCB Contact Now	0.15 mm Thickness Electronics Enig Flexible PCB Contact Now

Transaction Info
	Enig FPC Flexible FPCB Circuit Board with Customized Layers Contact Now	Quick View Fr4 High Tg Flex Rigid Printed Circuit Board Applied Antenna FPC Board Contact Now	Quick View LED Strip Flexible PCB FPCB Printed Circuit Board Flex Rigid PCBA Contact Now	Quick View Flex Printed Circuit Board Multilayer FPC Fr4 Flexible PCB Contact Now	0.15 mm Thickness Electronics Enig Flexible PCB Contact Now
Price	US$1.26-2.81 / Piece	US$0.01-150.00 / Piece	US$0.01-150.00 / Piece	US$0.10-100.00 / Piece	US$0.10-20.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union
Quality Control
Product Certification	-	-	-	UL,ISO9001&ISO14001,SGS,RoHS,Ts16949	-
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	-	-	-	-
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Double-Sided FPC; Material: Polyimide; Combination Mode: Adhesive Flexible Plate; Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace; Conductive Adhesive: Conductive Silver Paste; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Base Material: Polyimide; Insulation Materials: Epoxy Resin; Board Material: Polyimide; Board Layer: 4; Board Thickness: 0.2 mm; Copper Thickness: 1 Oz; Solser Mask: Yellow; Silkscreen: White; Surface Finishing: Enig; Lead Time: 4-5 Working Days; Shipping Type: DHL.TNT, EMS, FedEx, UPS etc; PCB Design: Custom Design Product;	Structure: Single-Sided FPC; Material: Polyimide; Combination Mode: Adhesive Flexible Plate; Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Insulation Materials: Organic Resin; Finished Board Trhickness: 0.25mm; Special Requirement: FPCB with 0.8mm Stefinner; Surface Finish: Immersion Gold; Stefinner Material: Fr4;	Structure: Single-Sided FPC; Material: Polyimide; Combination Mode: Adhesive Flexible Plate; Application: Computer with LCD Screen; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Insulation Materials: Organic Resin; PCB Material: Fr4 Tg180; Thickness: 1.5mm; Copper: 35um; Impedance Control: No;	Structure: Multilayer FPC; Material: Polyimide; Combination Mode: Adhesive Flexible Plate; Application: Digital Products, Computer with LCD Screen, Mobile Phone; Conductive Adhesive: Conductive Silver Paste; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Base Material: Kb; Insulation Materials: Epoxy Resin; Brand: Abis; Special Process: Stiffeners etc; Holes Specification: Buried/Blind Vias, Via in Pads, Counter Sink Hole; Enig Thickness: 1-3u''; Copper Thickness: 0.5-8oz; Hard Gold Thickness: 5-50u'';	Structure: Multilayer FPC; Material: Polyimide; Combination Mode: Adhesive Flexible Plate; Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace; Conductive Adhesive: Conductive Silver Paste; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Base Material: Polymide; Insulation Materials: Epoxy Resin;
Supplier Name	Fastline Circuits Co., Limited	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.	Abis Circuits Co., Ltd.
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