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      HDI Multi Layer Octa Core Android 14 Linux PCBA
      US$0.98-2.00 / Piece
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      What is HDI Multi Layer Octa Core Android 14 Linux Fast Prototype PCB PCBA Rk3576 Industrial Control WiFi 4/5g CPU 2.2GHz 3576 Soc Industrial Embedded Core Motherboard

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-999 Pieces US$2.00

      1,000-9,999 Pieces US$1.86

      10,000+ Pieces US$0.98

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Fiberglass Epoxy
      • Application Consumer Electronics
      • Flame Retardant Properties V0
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Organic Resin
      • Transport Package Vacuum Packing
      • Specification IP class -2
      • Trademark Fastline
      • Origin Shenzhen, China
      • Board Material Fr4
      • Board Thickness 1.6mm
      • Copper Thickness 1oz
      • Solder Mask Green
      • Silk Screen White
      • Surface Treatment HASL Lead Free
      • Test 100%
      • Lead Time 6-8 Working Days
      • Min. Line Width 0.075mm
      • Layer 1-50layers
      • Supply Fast
      • Min Hole 0.1mm
      • MOQ 1PCS
      • Service One-Stop
      • File PCB File

      Product Description

      Company Profile Welcome to Fastline Fastline Circuits Co., Limited, a leading PCB/PCBA contract manufacturer in China since 2006, specializes in delivering tailored manufacturing solutions to global electronics clients. We serve over 40 countries across telecom, industrial control, medical ...

      Learn More

      HDI Multi Layer Octa Core Android 14 Linux PCBA Comparison
      Transaction Info
      Price US$0.98-2.00 / Piece US$0.90-2.60 / Piece US$0.90-2.60 / Piece US$0.90-2.60 / Piece US$0.90-2.60 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment
      Quality Control
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model - - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Board Material: Fr4;
      Board Thickness: 1.6mm;
      Copper Thickness: 1oz;
      Solder Mask: Green;
      Silk Screen: White;
      Surface Treatment: HASL Lead Free;
      Test: 100%;
      Lead Time: 6-8 Working Days;
      Min. Line Width: 0.075mm;
      Layer: 1-50layers;
      Supply: Fast;
      Min Hole: 0.1mm;
      MOQ: 1PCS;
      Service: One-Stop;
      File: PCB File;
      Type: 94V-0 Multilayer PCB;
      Dielectric: FR-4;
      Material: Customized;
      Application: All;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid, Fexible, Rigid and Fexible;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper, FPC, Ceramic, Aluminum-Based, High Freque;
      Insulation Materials: Organic Resin;
      Service: PCB+Assembly+Components;
      Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
      Min. Hole Size: 0.15mm;
      Min. Line Spacing: 0.075---0.09mm;
      Surface Finishing: Asl\OSP\Immersion Gold;
      Type: 94V-0 Multilayer PCB;
      Dielectric: FR-4;
      Material: Customized;
      Application: All;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid, Fexible, Rigid and Fexible;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper, FPC , Ceramic, Aluminum-Based, High Freque;
      Insulation Materials: Organic Resin;
      Service: PCB+Assembly+Components;
      Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
      Testing Service: Electrical Testing,Flying Probe Tester,Functional;
      Min. Hole Size: 0.15mm;
      Min. Line Spacing: 0.075---0.09mm;
      Surface Finishing: Asl\OSP\Immersion Gold;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Application: Consumer Electronics;
      Processing Technology: Electrolytic Foil;
      Insulation Materials: Organic Resin;
      Service: PCB+Assembly+Components;
      Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
      Testing Service: Electrical Testing,Flying Probe Tester,Functional;
      Min. Hole Size: 0.15mm;
      Min. Line Spacing: 0.075---0.09mm;
      Surface Finishing: Asl\OSP\Immersion Gold;
      Type: 94V-0 Multilayer PCB;
      Dielectric: FR-4;
      Material: Customized;
      Application: All;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid, Fexible, Rigid and Fexible;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper, FPC, Ceramic, Aluminum-Based, High Freque;
      Insulation Materials: Organic Resin;
      Service: PCB+Assembly+Components;
      Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
      Testing Service: Electrical Testing, Functional Testing;
      Min. Hole Size: 0.15mm;
      Min. Line Spacing: 0.075---0.09mm;
      Surface Finishing: Asl\OSP\Immersion Gold;
      Supplier Name

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      JS Technology Co., Ltd.

      Diamond Member Audited Supplier

      JS Technology Co., Ltd.

      Diamond Member Audited Supplier

      JS Technology Co., Ltd.

      Diamond Member Audited Supplier

      JS Technology Co., Ltd.

      Diamond Member Audited Supplier

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