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      Universal Fr4 Electronic Computer Monitor PCB Design and Automation Production

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-999 Pieces US$0.31

      1,000-4,999 Pieces US$0.28

      5,000-9,999 Pieces US$0.24

      10,000+ Pieces US$0.20

      Sepcifications

      • Structure Multilayer Rigid PCB
      • Dielectric FR-4
      • Material Polyester Glass Fiber Mat Laminate
      • Application Communication
      • Flame Retardant Properties V0
      • Processing Technology Electrolytic Foil
      • Production Process Subtractive Process
      • Base Material Fr4
      • Insulation Materials Epoxy Resin
      • Transport Package Vacuum+Carton Packing
      • Specification RoHS, ISO9001, UL, SGS
      • Trademark FL
      • Origin Shenzhen, China
      • Board Thickness 1.6mm
      • Board Layer 2 Layers
      • Copper Thickness 1 Oz
      • Solder Mask Green
      • Silksreen White
      • Surface Finihsing OSP
      • Lead Time 6-8 Working Days
      • PCB Design Custom Design Product
      • Min. Line Space 0.1mm
      • Min.Hole Size 0.15mm

      Product Description

      Universal FR4 Electronic Computer Monitor PCB Design and Automation Production Fastline could produce 1-26 layers PCB board for electronic products.providing PCB design, PCB fabrication,PCB clone and PCB assembly services. and we have got the UL, ISO, SGS certifications. Pls see our pcb ...

      Learn More

      Home Automation Relay PCB Comparison
      Transaction Info
      Price US$0.20-0.31 / Piece US$0.10 / Piece US$0.10 / Piece US$0.10 / Piece US$0.10 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
      Quality Control
      Product Certification - RoHS, UL, SGS, Ect RoHS, UL, SGS, Ect RoHS, UL, SGS, Ect RoHS, UL, SGS, Ect
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model - - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Communication;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Fr4;
      Insulation Materials: Epoxy Resin;
      Board Thickness: 1.6mm;
      Board Layer: 2 Layers;
      Copper Thickness: 1 Oz;
      Solder Mask: Green;
      Silksreen: White;
      Surface Finihsing: OSP;
      Lead Time: 6-8 Working Days;
      PCB Design: Custom Design Product;
      Min. Line Space: 0.1mm;
      Min.Hole Size: 0.15mm;
      Structure: Metal Base Rigid PCB;
      Dielectric: Al;
      Material: Aluminum;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Surface Finishing: Lf-Hal;
      Copper Thickness: 1oz;
      Board Thickness: 1.6mm;
      Min. Hole Size: 0.25mm;
      Min. Line Wigth: 0.15mm;
      Min. Line Spacing: 0.15mm;
      Color: Green;
      Size: 60*1.6mm;
      Package: Vacuum;
      Structure: Metal Base Rigid PCB;
      Dielectric: FR-4;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Surface Finishing: Lf-Hal;
      Copper Thickness: 1oz;
      Board Thickness: 1.6mm;
      Min. Hole Size: 0.25mm;
      Min. Line Wigth: 0.15mm;
      Min. Line Spacing: 0.15mm;
      Color: Green;
      Size: 35*45mm;
      Package: Vacuum;
      Structure: Metal Base Rigid PCB;
      Dielectric: Al;
      Material: Al;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Aluminum;
      Insulation Materials: Epoxy Resin;
      Surface Finishing: Lf-Hal;
      Copper Thickness: 1oz;
      Board Thickness: 1.6mm;
      Min. Hole Size: 0.25mm;
      Min. Line Wigth: 0.15mm;
      Min. Line Spacing: 0.15mm;
      Color: Green;
      Size: 45*1.6mm;
      Package: Vacuum;
      Structure: Metal Base Rigid PCB;
      Dielectric: FR-4;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Subtractive Process;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Surface Finishing: Lf-Hal;
      Copper Thickness: 1oz;
      Board Thickness: 1.6mm;
      Min. Hole Size: 0.25mm;
      Min. Line Wigth: 0.15mm;
      Min. Line Spacing: 0.15mm;
      Color: White;
      Size: 66*56mm;
      Package: Vacuum;
      Supplier Name

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Shenzhen Xinjiaye Electronics Technology Co., Ltd.

      Gold Member Audited Supplier

      Shenzhen Xinjiaye Electronics Technology Co., Ltd.

      Gold Member Audited Supplier

      Shenzhen Xinjiaye Electronics Technology Co., Ltd.

      Gold Member Audited Supplier

      Shenzhen Xinjiaye Electronics Technology Co., Ltd.

      Gold Member Audited Supplier

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