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      Fr4 PCB
      US$4.89-6.75 / Piece
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      What is Bluetooth Audio Amplifier Board PCB Circuit Board PCB Assembly for Electronic

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece US$4.89-6.75 / Piece

      Sepcifications

      • Structure Double-Sided Rigid PCB
      • Dielectric FR-3
      • Material Phenolic Paper Laminate
      • Application Computer
      • Flame Retardant Properties V0
      • Processing Technology Electrolytic Foil
      • Production Process Semi-Additive Process
      • Base Material Fr4
      • Insulation Materials Organic Resin
      • Brand Fastline
      • Transport Package Vacuum Packing
      • Specification IP class -2
      • Trademark Fastline
      • Origin Shenzhen, China
      • Board Material Fr4
      • Layers 1 to 30 Layers
      • Board Thickness 1.6mm
      • Copper Thickness 1oz
      • Solder Mask Green
      • Silk Screen White
      • Surface Treatment HASL Lead Free
      • Test 100%
      • Lead Time 6-8 Working Days
      • Min. Line Width 0.075mm

      Product Description

      Bluetooth Audio Amplifier Board pcb circuit board pcb Assembly for electronic Product Description Fastline PCB's aim Customer Satisfaction is Always Our First Priority! *Quality Policy *Top ...

      Learn More

      Fr4 PCB Comparison
      Transaction Info
      Price US$4.89-6.75 / Piece US$0.01-150.00 / Piece US$0.01-150.00 / Piece US$0.01-20.00 / Piece US$0.10-20.00 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
      Quality Control
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model - - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Structure: Double-Sided Rigid PCB;
      Dielectric: FR-3;
      Material: Phenolic Paper Laminate;
      Application: Computer;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Semi-Additive Process;
      Base Material: Fr4;
      Insulation Materials: Organic Resin;
      Brand: Fastline;
      Board Material: Fr4;
      Layers: 1 to 30 Layers;
      Board Thickness: 1.6mm;
      Copper Thickness: 1oz;
      Solder Mask: Green;
      Silk Screen: White;
      Surface Treatment: HASL Lead Free;
      Test: 100%;
      Lead Time: 6-8 Working Days;
      Min. Line Width: 0.075mm;
      Structure: Double-Sided Rigid PCB;
      Dielectric: FR-4;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Kb;
      Cooper Thickness: 1oz;
      Surface Finishing: HASL;
      Solder Mask Color: Green;
      Silkscreen: White;
      Min Line Width/Space: 0.2mm/0.2mm;
      Min Hole Diameter: 0.2mm;
      Finished Board Thickness: 1.6 mm;
      Layer: 6 Layer;
      Structure: Double-Sided Rigid PCB;
      Dielectric: FR-4;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Kb;
      Cooper Thickness: 1oz;
      Surface Finishing: HASL;
      Solder Mask Color: Green;
      Silkscreen: White;
      Min Line Width/Space: 0.2mm/0.2mm;
      Min Hole Diameter: 0.2mm;
      Finished Board Thickness: 1.6 mm;
      Layer: 2 Layer;
      Structure: Double-Sided Rigid PCB;
      Dielectric: FR-4;
      Material: Polyester Glass Fiber Mat Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Kb;
      Cooper Thickness: 1oz;
      Surface Finishing: HASL;
      Solder Mask Color: Green;
      Silkscreen: White;
      Min Line Width/Space: 0.2mm/0.2mm;
      Min Hole Diameter: 0.2mm;
      Finished Board Thickness: 1.6 mm;
      Layer: 2 Layer;
      Structure: Multilayer Rigid PCB;
      Dielectric: FR-4;
      Material: Epoxy Paper Laminate;
      Application: Consumer Electronics;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Production Process: Semi-Additive Process;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Supplier Name

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

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