94V0 Fr4 Circuit Board

US$0.60-0.90 / Piece

PCB Circuits Board Reverse Engineering Without IC pictures & photos

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What is PCB Circuits Board Reverse Engineering Without IC

Name: PCB Circuits Board Reverse Engineering Without IC
Uploaded: 2025-12-23T01:23:19+08:00
Description: PCB Circuits Board Reverse Engineering Without IC Fastline could produce 1-26 layers PCB board for electronic products. providing PCB design, PCB fabrication, PCB clone, and PCB assembly services. a

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Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$0.90

1,000-1,999 Pieces US$0.82

2,000-9,999,999 Pieces US$0.71

10,000,000+ Pieces US$0.60

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Polyester Glass Fiber Mat Laminate
Application Consumer Electronics
Flame Retardant Properties V0
Processing Technology Electrolytic Foil
Production Process Subtractive Process
Base Material Fr4
Insulation Materials Epoxy Resin
Brand Ca
Transport Package Vacuum+Carton Packing
Specification RoHS, ISO9001, UL, SGS
Trademark FL
Origin Shenzhen, China
Board Thickness 1.6mm
Board Layer 2 Layers
Copper Thickness 1 Oz
Solder Mask Blue
Silksreen White
Min Pad +/- 0.1mm (4mil)
Surface Finihsing HASL-Lf
Lead Time 6-8 Working Days
Shipping Type DHL, UPS, TNT, EMS, FedEx etc
Packing Type Carton + Vacuum
Test Fly Probe Testing
Min Board Thickness 0.1mm Only for Single and Double Sided
Min. Line Width/Space 0.05mm (2mil)
Outline Machining Accuracy +/- 0.1mm (4mil)
MOQ 1 PCS

Product Description

PCB Circuits Board Reverse Engineering Without IC Fastline could produce 1-26 layers PCB board for electronic products. providing PCB design, PCB fabrication, PCB clone, and PCB assembly services. and we have got the UL, ISO, SGS certifications. Pls see our pcb catalog below: 1. single side ...

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Fastline Circuits Co., Limited

Diamond Member Since 2013

Audited Supplier

Main Products Print Circuit Board, Aluminum PCB, Flexible PCB, Rigid PCB, PCB Prototype, PCB Assembly, ...
Year of Establishment 2006-09-21
Address 3/F, Building B3, Fuqiao No. 4, Fuhai Subdistrict, Baoan District, Shenzhen, Guangdong, China
Plant Area 580 square meters
Registered Capital 1,000,000 RMB
Main Markets North America, South America, Europe, Southeast Asia/ Mideast

94V0 Fr4 Circuit Board Comparison

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Transaction Info
	PCB Circuits Board Reverse Engineering Without IC Contact Now	Quick View Mini USB Fan PCB Board Contact Now	Quick View Power Bank Printed Circuit Board Contact Now	Quick View High Quality Power Bank PCB Board Contact Now	Quick View Xjypcb Multilayer Printed Circuit Board Contact Now
Price	US$0.60-0.90 / Piece	US$0.10 / Piece	US$0.10 / Piece	US$0.10 / Piece	US$0.10 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram	LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram	LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram	LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram
Quality Control
Product Certification	-	RoHS, UL, SGS, Ect	RoHS, UL, SGS, Ect	RoHS, UL, SGS, Ect	RoHS, UL, SGS, Ect
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	-	-	-	-
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Fr4; Insulation Materials: Epoxy Resin; Brand: Ca; Board Thickness: 1.6mm; Board Layer: 2 Layers; Copper Thickness: 1 Oz; Solder Mask: Blue; Silksreen: White; Min Pad: +/- 0.1mm (4mil); Surface Finihsing: HASL-Lf; Lead Time: 6-8 Working Days; Shipping Type: DHL, UPS, TNT, EMS, FedEx etc; Packing Type: Carton + Vacuum; Test: Fly Probe Testing; Min Board Thickness: 0.1mm Only for Single and Double Sided; Min. Line Width/Space: 0.05mm (2mil); Outline Machining Accuracy: +/- 0.1mm (4mil); MOQ: 1 PCS;	Structure: Metal Base Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Finishing: Lf-Hal; Copper Thickness: 1oz; Board Thickness: 1.6mm; Min. Hole Size: 0.25mm; Min. Line Wigth: 0.15mm; Min. Line Spacing: 0.15mm; Color: Green; Size: 3545mm;* Package: Vacuum;	Structure: Metal Base Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Finishing: Lf-Hal; Copper Thickness: 1oz; Board Thickness: 1.6mm; Min. Hole Size: 0.25mm; Min. Line Wigth: 0.15mm; Min. Line Spacing: 0.15mm; Color: Green; Size: 3545mm;* Package: Vacuum;	Structure: Metal Base Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Finishing: Lf-Hal; Copper Thickness: 1oz; Board Thickness: 1.6mm; Min. Hole Size: 0.25mm; Min. Line Wigth: 0.15mm; Min. Line Spacing: 0.15mm; Color: Green; Size: 3545mm;* Package: Vacuum;	Structure: Metal Base Rigid PCB; Dielectric: FR-4; Material: Polyester Glass Fiber Mat Laminate; Application: Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Copper; Insulation Materials: Epoxy Resin; Surface Finishing: Lf-Hal; Copper Thickness: 1oz; Board Thickness: 1.6mm; Min. Hole Size: 0.25mm; Min. Line Wigth: 0.15mm; Min. Line Spacing: 0.15mm; Color: Green; Size: 3545mm;* Package: Vacuum;
Supplier Name	Fastline Circuits Co., Limited	Shenzhen Xinjiaye Electronics Technology Co., Ltd.	Shenzhen Xinjiaye Electronics Technology Co., Ltd.	Shenzhen Xinjiaye Electronics Technology Co., Ltd.	Shenzhen Xinjiaye Electronics Technology Co., Ltd.
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