Solar Optimizer PCB

US$0.86-2.12 / Piece

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What is Solar Optimizer PCB High-Voltage Isolation Design 1-16 Layers Fr4 UL Recognized for Photovoltaic Module-Level Power Electronics

Name: Solar Optimizer PCB High-Voltage Isolation Design 1-16 Layers Fr4 UL Recognized for Photovoltaic Module-Level Power Electronics
Uploaded: 2026-01-13T09:10:09+08:00
Description: 1 -26 Layer pcb for Electronic Products Fastline pcb is a Leading PCB manufacturer in China. It was found in 2003, serving customers in over 40 Countries from various electronic industries, Over 70%

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Price

Min. Order Reference FOB Price

1 Piece US$0.86-2.12 / Piece

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Medical Instruments
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Organic Resin
Brand Fastline
Transport Package Vacuum+Carton Packing
Specification UL, SGS, ROHS
Trademark Fastline
Origin China
Board Material Fr4
Board Thickness 1.6mm
Copper Thickness 1oz
Surface Treatment Immersion Gold
Layers 1-50layers
Soldermask Green, Blue, White, Red, Black, etc.
Silkscreen Green, Blue, White, Red, Black, etc.
Mini Holes 0.1mm
Mini Trace 3 Mil/ 3 Mil
MOQ 1PCS
Test 100%
Service One-Stop
Supply Fast
File PCB File
Lead Time 5-6 Days

Product Description

1 -26 Layer pcb for Electronic Products Fastline pcb is a Leading PCB manufacturer in China. It was found in 2003, serving customers in over 40 Countries from various electronic industries, Over 70% Of pcb products are exported to America, Europe and other Asia Pacific countries. PCB board ...

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Fastline Circuits Co., Limited

Diamond Member Since 2013

Audited Supplier

Main Products Print Circuit Board, Aluminum PCB, Flexible PCB, Rigid PCB, PCB Prototype, PCB Assembly, ...
Year of Establishment 2006-09-21
Address 3/F, Building B3, Fuqiao No. 4, Fuhai Subdistrict, Baoan District, Shenzhen, Guangdong, China
Plant Area 580 square meters
Registered Capital 1,000,000 RMB
Main Markets North America, South America, Europe, Southeast Asia/ Mideast

Solar Optimizer PCB Comparison

	Solar Optimizer PCB High-Voltage Isolation Design 1-16 Layers Fr4 UL Recognized for Photovoltaic Module-Level Power Electronics Contact Now	Quick View Multi-Layer High-Frequency MCPCB High Tg Thick Copper Plane Winding Mixed Medium Rigid-Flex Combination PCB Contact Now	Quick View Blind and Buried Holes Metal Core HDI High Tg/ Thick Copper Rigid-Flex Ceramic IC Test Flexible PCB Contact Now	Quick View PCB Assembly Company PCBA Factory Contact Now	Intel Chipset - Socket P LGA-3647-1 X Retail Pack Computer Motherboard OEM Manufacturing PCBA Contact Now

Transaction Info
	Solar Optimizer PCB High-Voltage Isolation Design 1-16 Layers Fr4 UL Recognized for Photovoltaic Module-Level Power Electronics Contact Now	Quick View Multi-Layer High-Frequency MCPCB High Tg Thick Copper Plane Winding Mixed Medium Rigid-Flex Combination PCB Contact Now	Quick View Blind and Buried Holes Metal Core HDI High Tg/ Thick Copper Rigid-Flex Ceramic IC Test Flexible PCB Contact Now	Quick View PCB Assembly Company PCBA Factory Contact Now	Intel Chipset - Socket P LGA-3647-1 X Retail Pack Computer Motherboard OEM Manufacturing PCBA Contact Now
Price	US$0.86-2.12 / Piece	US$0.01-0.41 / Piece	US$0.01-0.41 / Piece	US$0.05-3.00 / Piece	US$0.03-10.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	2 Pieces	1 Piece
Payment Terms	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram	LC, T/T, D/P, PayPal, Western Union, Small-amount payment, Money Gram	T/T, PayPal, Western Union	T/T, PayPal, Western Union
Quality Control
Product Certification	-	ISO9001, ISO14000, Ts16949.UL.RoHS	ISO9001, ISO14000, Ts16949.UL.RoHS	-	-
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia	North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
Annual Export Revenue	-	-	-	-	-
Business Model	-	-	-	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays	Peak Season Lead Time: one month Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Fastline; Board Material: Fr4; Board Thickness: 1.6mm; Copper Thickness: 1oz; Surface Treatment: Immersion Gold; Layers: 1-50layers; Soldermask: Green, Blue, White, Red, Black, etc.; Silkscreen: Green, Blue, White, Red, Black, etc.; Mini Holes: 0.1mm; Mini Trace: 3 Mil/ 3 Mil; MOQ: 1PCS; Test: 100%; Service: One-Stop; Supply: Fast; File: PCB File; Lead Time: 5-6 Days;	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Communication; Flame Retardant Properties: V2; Mechanical Rigid: Fexible; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: Okey; Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg; Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG; Layer: 1-60 Layers; Service: Turnkey Assembly PCB Service; Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui; Min Hole Size: Mechanical Hole: 0.15mm, Laser Hole: 0.1mm; Outline Profile: Rout/ V-Cut/ Bridge/ Stamp Hole; Order Qty: No Limited; Controlling Range: -40c~125c; Solder Resist Color: Green;Red;Yellow;Black;White; Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask; Trade Mark: OEM, ODM; Min. Line Width: 4mil; Max Production Size: 600800mm;*	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Medical Instruments; Flame Retardant Properties: V2; Mechanical Rigid: Fexible; Processing Technology: Delay Pressure Foil; Base Material: Aluminum; Insulation Materials: Metal Composite Materials; Brand: Okey; Shape: Retangular, Round, Slots, Cutouts, Complex, Irreg; Surface Finishing: OSP, Immersion Gold, Immersion Tin, Immersion AG; Layer: 1-60 Layers; Service: Turnkey Assembly PCB Service; Other Capabilities: Repair/Rework Services Mechanical Assembly Box Bui; Min Hole Size: Mechanical Hole: 0.15mm, Laser Hole: 0.1mm; Outline Profile: Rout/ V-Cut/ Bridge/ Stamp Hole; Order Qty: No Limited; Controlling Range: -40c~125c; Solder Resist Color: Green;Red;Yellow;Black;White; Surface Finished: HASL, Gold Finger, OSP, Enig, Peelable Mask; Trade Mark: OEM, ODM; Min. Line Width: 4mil; Max Production Size: 600800mm;*	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: New Chip; Layer: 1-32 Layers; Service: OEM/ODM; OEM/ODM: Available; Test: 100%E-Testing; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea; Surface Treatmen: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Consumer Electronics; Flame Retardant Properties: V2; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Brand: New Chip; Capacity: 1000000; OEM/ODM: Available; Sample: Available; Surface Treatment: OSP, Enig, HASL, AG Immersion; Certificate Gurantee: Yes; Test: 100%E-Testing; Min Bonding Pad Diameter: 10mil; Min Thickness of Soldermask: 10um; Color of Silk-Screen: White, Yellow, Black; Data File Format: Gerber File and Drilling File, Protel Series,...; Material for PCB: Fr-4, High Tg Fr$, Halogen Free,Rogers, Cem-1, Ari; Layer Count: 1-20 Layers; Shipping: DHL/UPS/FedEx/Air/Sea;
Supplier Name	Fastline Circuits Co., Limited	Shenzhen Okey Circuit Co., Ltd.	Shenzhen Okey Circuit Co., Ltd.	Shenzhen New Chip international Ltd	Shenzhen New Chip international Ltd
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