| Specification |
Dielectric: Fr4 and Polyimide;
Board Material: Fr4 and Polyimide;
Board Layer: 2 Layer Rigide and 2 Layer Flex;
Copper Thickness: 1 Oz;
Min. Line Space: 0.05mm (2mil);
Min Conductor Width: 0.05mm(2mil);
Min.Hole Size: 0.075mm (3mil);
Solder Mask: Any Color;
Silkscreen: Any Color;
Surface Finishing: Enig, Immersion Tin, Immersion Gold. OSP;
Lead Time: 5-6 Working Days;
PCB Design: Customer Provided;
Board Thickness: 0.1mm;
Min Pad: +/-0.1mm (4mil);
Outline Machining Accuracy: +/-0.1mm (4mil);
MOQ: 1 PCS;
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Dielectric: Aln, Ausn, Ni, Cu;
Material: Alumina Nitride;
Metal Material: Au, Sn, Ni, Cu and So on;
Package: Plastic Box;
Thermal Conductivity: High;
Encapsulation: CPU/GPU;
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Dielectric: Aln, Ausn, Ni, Cu;
Material: Alumina Nitride;
Metal Material: Au, Sn, Ni, Cu and So on;
Package: Plastic Box;
Thermal Conductivity: High;
Encapsulation: CPU/GPU;
|
Dielectric: Aln, Ausn, Ni, Cu;
Material: Alumina Nitride;
Metal Material: Au, Sn, Ni, Cu and So on;
Package: Plastic Box;
Thermal Conductivity: High;
Encapsulation: CPU/GPU;
|
Dielectric: Aln, Ausn, Ni, Cu;
Material: Alumina Nitride;
Metal Material: Au, Sn, Ni, Cu and So on;
Package: Plastic Box;
Thermal Conductivity: High;
Encapsulation: CPU/GPU;
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