Multilayer PCB Board for Solar Panel

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Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$0.26

1,000-4,999 Pieces US$0.23

5,000-9,999 Pieces US$0.19

10,000+ Pieces US$0.16

Sepcifications

Type Combining Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Medical Instruments
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Delay Pressure Foil
Base Material Fr4
Insulation Materials Epoxy Resin
Transport Package Vacuum+Carton Packing
Specification RoHS, ISO9001, UL, SGS
Trademark FL
Origin Shenzhen, China
Board Thickness 1.6mm
Board Layer 6 Layers
Copper Thickness 1 Oz
Solder Mask Green
Silksreen White
Surface Finihsing OSP
Lead Time 6-8 Working Days

Product Description

-------------------------------------------------------------------------------------------------------------------------------------------- Product Description PCB Capability: Fastline Circuits Co.,Limited PCB Manufacturing Capability Item Manufacture Capability Layers 1-50 Layers ...

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Fastline Circuits Co., Limited

Diamond Member Since 2013

Audited Supplier

Main Products Print Circuit Board, Aluminum PCB, Flexible PCB, Rigid PCB, PCB Prototype, PCB Assembly, ...
Year of Establishment 2006-09-21
Address 3/F, Building B3, Fuqiao No. 4, Fuhai Subdistrict, Baoan District, Shenzhen, Guangdong, China
Plant Area 580 square meters
Registered Capital 1,000,000 RMB
Main Markets North America, South America, Europe, Southeast Asia/ Mideast

Solar Panel PCB Comparison

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Transaction Info
	Multilayer PCB Board for Solar Panel Contact Now	Quick View Immersion Silver/Tin PCB Assembly Component SMT with ISO, UL Contact Now	Quick View Rigid Fr4 PCB Tg170-180 Immersion Gold/Tin/OSP Surface Treatment PCB Board Contact Now	Quick View OEM Fr4 Circuit Board 6 Layer PCB Board for Electric Baby Car Contact Now	Quick View Circuits Board PCBA Hot Swap Wireless Mechanical Keyboard PCB Contact Now
Price	US$0.16-0.26 / Piece	US$0.01-150.00 / Piece	US$0.01-150.00 / Piece	US$0.01-150.00 / Piece	US$0.01-150.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union	LC, T/T, PayPal, Western Union
Quality Control
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	-	-	-	-
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Type: Combining Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Delay Pressure Foil; Base Material: Fr4; Insulation Materials: Epoxy Resin; Board Thickness: 1.6mm; Board Layer: 6 Layers; Copper Thickness: 1 Oz; Solder Mask: Green; Silksreen: White; Surface Finihsing: OSP; Lead Time: 6-8 Working Days;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Remark: PCB Board; Layer: 4; Surface Finish: HASL; Materials: Fr4, High Tg Fr4, PTFE, Alu, Cu Base, Rogers; Board Thickness: 0.20mm-8.00mm; Min Line: 0.075mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Remark: PCB Board; Layer: 6; Surface Finish: HASL; Materials: Fr4, High Tg Fr4, PTFE, Alu, Cu Base, Rogers; Board Thickness: 0.20mm-8.00mm; Min Line: 0.075mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Remark: PCB Board; Layer: 6; Surface Finish: HASL; Materials: Fr4, High Tg Fr4, PTFE, Alu, Cu Base, Rogers; Board Thickness: 0.20mm-8.00mm; Min Line: 0.075mm;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Epoxy Resin; Remark: PCB Board; Layer: 8; Surface Finish: HASL; Materials: Fr4, High Tg Fr4, PTFE, Alu, Cu Base, Rogers; Board Thickness: 0.20mm-8.00mm; Min Line: 0.075mm;
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