Gold Finger PCB Board with High Tg Fr4 Material

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Price

Purchase Qty. Reference FOB Price

1-999 Pieces US$0.26

1,000-4,999 Pieces US$0.23

5,000-9,999 Pieces US$0.19

10,000+ Pieces US$0.16

Sepcifications

Structure Multilayer Rigid PCB
Dielectric FR-4
Material Fiberglass Epoxy, Polyester Glass Fiber Mat Laminate
Application Medical Instruments, Consumer Electronics
Flame Retardant Properties V0
Processing Technology Delay Pressure Foil, Electrolytic Foil
Production Process Subtractive Process
Base Material Fr4, Copper
Insulation Materials Epoxy Resin, Organic Resin
Transport Package Vacuum+Carton Packing
Specification RoHS, ISO9001, UL, SGS
Trademark Fastline
Origin Shenzhen, China
Type Combining Rigid Circuit Board
Mechanical Rigid Rigid
Board Thickness 1.6mm
Board Layer 4 Layers
Copper Thickness 1 Oz
Solder Mask Green
Silksreen White
Surface Finihsing Enig
Lead Time 6-8 Working Days

Product Description

-------------------------------------------------------------------------------------------------------------------------------------------- Product Description PCB Capability: Fastline Circuits Co.,Limited PCB Manufacturing Capability Item Manufacture Capability Layers 1-50 Layers ...

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Fastline Circuits Co., Limited

Diamond Member Since 2013

Audited Supplier

Main Products Print Circuit Board, Aluminum PCB, Flexible PCB, Rigid PCB, PCB Prototype, PCB Assembly, ...
Year of Establishment 2006-09-21
Address 3/F, Building B3, Fuqiao No. 4, Fuhai Subdistrict, Baoan District, Shenzhen, Guangdong, China
Plant Area 580 square meters
Registered Capital 1,000,000 RMB
Main Markets North America, South America, Europe, Southeast Asia/ Mideast

High Tg Fr4 PCB Comparison

	Gold Finger PCB Board with High Tg Fr4 Material Contact Now	Quick View 20 Layer Rigid -Flex PCB for Medical Equipment Contact Now	Quick View Big Size 8 Layer Rigid-Flex PCB with High Quality Contact Now	Quick View Black Soldmask Rigid-Flex PCB for Printer Contact Now	Quick View 4 Layer Golden Fingers Rigid-Flex PCB Contact Now

Transaction Info
	Gold Finger PCB Board with High Tg Fr4 Material Contact Now	Quick View 20 Layer Rigid -Flex PCB for Medical Equipment Contact Now	Quick View Big Size 8 Layer Rigid-Flex PCB with High Quality Contact Now	Quick View Black Soldmask Rigid-Flex PCB for Printer Contact Now	Quick View 4 Layer Golden Fingers Rigid-Flex PCB Contact Now
Price	US$0.16-0.26 / Piece	US$1.00 / Piece	US$1.10-1.70 / Piece	US$2.80-3.60 / Piece	US$2.00-3.50 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union	LC, T/T, D/P, PayPal, Western Union	LC, T/T, D/P, PayPal, Western Union	LC, T/T, D/P, PayPal, Western Union
Quality Control
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe	North America, South America, Eastern Europe, Southeast Asia, Oceania, Western Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	-	-	-	-
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays
Product Attributes
Specification	Structure: Multilayer Rigid PCB; Dielectric: FR-4; Material: Fiberglass Epoxy, Polyester Glass Fiber Mat Laminate; Application: Medical Instruments, Consumer Electronics; Flame Retardant Properties: V0; Processing Technology: Delay Pressure Foil, Electrolytic Foil; Production Process: Subtractive Process; Base Material: Fr4, Copper; Insulation Materials: Epoxy Resin, Organic Resin; Type: Combining Rigid Circuit Board; Mechanical Rigid: Rigid; Board Thickness: 1.6mm; Board Layer: 4 Layers; Copper Thickness: 1 Oz; Solder Mask: Green; Silksreen: White; Surface Finihsing: Enig; Lead Time: 6-8 Working Days;	Structure: Rigid-Flex; Dielectric: Polyimide&Fr4; Material: Polyester Glass Fiber Mat Laminate; Application: Computer; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Polyimide&Fr4; Insulation Materials: Epoxy Resin; Brand: UC; Layer: 20; Thickness: 3.0mm; Min Hole: 0.45mm; Surface: Enig;	Structure: Rigid-Flex; Dielectric: Polyimide&Fr4; Material: Polyester Glass Fiber Mat Laminate; Application: Computer; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Polyimide&Fr4; Insulation Materials: Epoxy Resin; Brand: Uc; Layer: 8; Thickness: 2.0mm; Hole: 03mm; Surface: Enig;	Structure: Rigid-Flex; Dielectric: Polyimide&Fr4; Material: Polyester Glass Fiber Mat Laminate; Application: Computer; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Polyimide&Fr4; Insulation Materials: Epoxy Resin; Brand: Uc; Layer: 4; Thickness: 0.55mm; Hole: 0.3mm; Surface: Enig;	Structure: Rigid-Flex; Dielectric: Polyimide&Fr4; Material: Polyester Glass Fiber Mat Laminate; Application: Computer; Flame Retardant Properties: V0; Processing Technology: Electrolytic Foil; Production Process: Subtractive Process; Base Material: Polyimide&Fr4; Insulation Materials: Epoxy Resin; Brand: UC; Layer: 4; Thickness: 0.4mm; Surface: Enig; Space: 0.12mm;
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