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      PCBA
      US$9.668-9.67 / Piece
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      What is PCBA Circuit Board Power Bank PCBA

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-999 Pieces US$9.67

      1,000+ Pieces US$9.668

      Sepcifications

      • Metal Coating Copper
      • Mode of Production SMT
      • Layers Multilayer
      • Base Material FR-4
      • Certification RoHS, ISO, UL
      • Customized Customized
      • Condition New
      • Transport Package Vacuum+Carton Packing
      • Specification RoHS, ISO9001, UL, SGS
      • Trademark FL
      • Origin Shenzhen, China
      • Board Material Fr4
      • Board Layer 4
      • Board Thickness 1.6mm
      • Copper Thickness 1 Oz
      • Min. Line Width/Space 0.1mm
      • Min. Hole Size 0.2mm
      • Solder Mask Green/Blue/Red
      • Silkscreen White/ Black
      • Surface Finishing HASL-Lf
      • Lead Time 8-10 Working Days

      Product Description

      PCB electronic board Assembly Factory and PCB quickly demand Fastline could produce 1-26 layers PCB board for electronic products.providing PCB design, PCB fabrication,PCB clone and PCB assembly services. and we have got the UL, ISO, SGS certifications. Please see our pcb catalog below: ...

      Learn More

      PCBA Comparison
      Transaction Info
      Price US$9.668-9.67 / Piece US$0.98-5.00 / Piece US$0.65-5.00 / Piece US$0.67-5.00 / Piece US$0.67-5.00 / Piece
      Min Order 1 Piece 10 Pieces 10 Pieces 10 Pieces 10 Pieces
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T T/T T/T T/T
      Quality Control
      Product Certification RoHS, ISO, UL RoHS, ISO ISO RoHS, ISO RoHS, ISO
      Management System Certification - ISO9001:2015 ISO9001:2015 ISO9001:2015 ISO9001:2015
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast Domestic Domestic Domestic Domestic
      Annual Export Revenue - - - - -
      Business Model - ODM, OEM ODM, OEM ODM, OEM ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Product Attributes
      Specification
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      Board Material: Fr4;
      Board Layer: 4;
      Board Thickness: 1.6mm;
      Copper Thickness: 1 Oz;
      Min. Line Width/Space: 0.1mm;
      Min. Hole Size: 0.2mm;
      Solder Mask: Green/Blue/Red;
      Silkscreen: White/ Black;
      Surface Finishing: HASL-Lf;
      Lead Time: 8-10 Working Days;
      Metal Coating: Tin;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      PCBA-Testing: X-ray, Aoi;
      Processing: Electrolytic Foil;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Min. Space of BGA: +/- 0.3mm;
      Min.Pin Space of IC: 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      Surface Finishing: Lead-Free HASL;
      Number of Layers: 4-10 Layer;
      Board Thickness: 1.6mm;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-6;
      Customized: Customized;
      Condition: New;
      PCBA-Testing: X-ray, Aoi;
      Processing: Electrolytic Foil;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Min. Space of BGA: +/- 0.3mm;
      Min.Pin Space of IC: 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      Surface Finishing: Lead-Free HASL;
      Number of Layers: 4-10 Layer;
      Board Thickness: 1.6mm;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-6;
      Customized: Non-Customized;
      Condition: New;
      PCBA-Testing: X-ray, Aoi;
      Processing: Electrolytic Foil;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Min. Space of BGA: +/- 0.3mm;
      Min.Pin Space of IC: 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      Surface Finishing: Lead-Free HASL;
      Number of Layers: 4-10 Layer;
      Board Thickness: 1.6mm;
      Metal Coating: Copper;
      Mode of Production: SMT;
      Layers: Multilayer;
      Base Material: FR-4;
      Customized: Customized;
      Condition: New;
      PCBA-Testing: X-ray, Aoi;
      Processing: Electrolytic Foil;
      SMT Capacity: >2 Million Points/Day;
      DIP Capacity: >100K Parts/Day;
      Min. Space of BGA: +/- 0.3mm;
      Min.Pin Space of IC: 0.3mm;
      Max.Precision of IC Assembly: 0.03mm;
      Surface Finishing: Lead-Free HASL;
      Number of Layers: 4-10 Layer;
      Board Thickness: 1.6mm;
      Supplier Name

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Hongzhou Smart Technology Co., Ltd.

      Diamond Member Audited Supplier

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