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      Flexible PCB
      US$0.43-0.57 / Piece
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      What is Customer Length Flexible PCB Board for LED with Immersion Tin

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-999 Pieces US$0.57

      1,000-4,999 Pieces US$0.52

      5,000+ Pieces US$0.43

      Sepcifications

      • Structure Double-Sided FPC
      • Material Polyimide
      • Combination Mode Adhesive Flexible Plate
      • Application Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace
      • Conductive Adhesive Conductive Silver Paste
      • Flame Retardant Properties V0
      • Processing Technology Electrolytic Foil
      • Base Material Polyimide
      • Insulation Materials Epoxy Resin
      • Transport Package Vacuum +Carton Packing
      • Specification RoHS, ISO9001, UL, SGS
      • Trademark FL
      • Origin Shenzhen, China
      • Board Material Polyimide
      • Board Layer 2
      • Board Thickness 0.1 Mm
      • Copper Thickness 1 Oz
      • Solser Mask Yellow
      • Silkscreen White
      • Surface Finishing Enig
      • Lead Time 4-5 Working Days
      • Shipping Type DHL.TNT, EMS, FedEx, UPS etc
      • PCB Design Custom Design Product

      Product Description

      Customer Length Flexible PCB Board for LED with Immersion Tin Fastline could produce 1-26 layers PCB board for electronic products.providing PCB design, PCB fabrication,PCB clone and PCB assembly services. and we have got the UL, ISO, SGS certifications. Pls see our pcb catalog below: 1. ...

      Learn More

      Flexible PCB Comparison
      Transaction Info
      Price US$0.43-0.57 / Piece US$0.01-20.00 / pcs US$0.01-10.00 / Piece US$0.01-50.00 / Piece US$0.01-50.00 / Piece
      Min Order 1 Piece 1 pcs 1 Piece 1 Piece 1 Piece
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union LC, T/T, PayPal, Western Union
      Quality Control
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe North America, South America, Eastern Europe, Southeast Asia, Africa, Oceania, Mid East, Eastern Asia, Western Europe
      Annual Export Revenue - - - - -
      Business Model - - - - -
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Structure: Double-Sided FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Polyimide;
      Insulation Materials: Epoxy Resin;
      Board Material: Polyimide;
      Board Layer: 2;
      Board Thickness: 0.1 Mm;
      Copper Thickness: 1 Oz;
      Solser Mask: Yellow;
      Silkscreen: White;
      Surface Finishing: Enig;
      Lead Time: 4-5 Working Days;
      Shipping Type: DHL.TNT, EMS, FedEx, UPS etc;
      PCB Design: Custom Design Product;
      Structure: Multilayer FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Abis;
      Board Thickness: 0.2mm;
      Copper Thickness: 35um;
      Surface Finish: Immersion Gold;
      Solder Mask: Coverlay;
      Legend: Without;
      Structure: Double-Sided FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Abis;
      Board Thickness: 0.1mm;
      Copper Thickness: 35 Um;
      Surface Finish: Enig;
      Outline: Module Punch;
      Structure: 1-8 Layers FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Abis;
      Layer: 1-8 Layers;
      Raw Material: Aluminum Base, Copper Base;
      Min Hole Size: 12mil(0.3mm);
      Min Line Width/Space: 3mil(0.075mm);
      Impedance Control Tolerance: +/-10%;
      Surface Finishing: HASL-Lf, Immersion Gold(Enig), Immersion Sliver,;
      Structure: Single-Sided FPC;
      Material: Polyimide;
      Combination Mode: Adhesive Flexible Plate;
      Application: Digital Products, Computer with LCD Screen, Mobile Phone, Aviation and Aerospace;
      Conductive Adhesive: Conductive Silver Paste;
      Flame Retardant Properties: V0;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: Abis;
      Layer: 1-8 Layers;
      Raw Material: Aluminum Base, Copper Base;
      Min Hole Size: 12mil(0.3mm);
      Min Line Width/Space: 3mil(0.075mm);
      Impedance Control Tolerance: +/-10%;
      Surface Finishing: HASL-Lf, Immersion Gold(Enig), Immersion Sliver,;
      Supplier Name

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

      Abis Circuits Co., Ltd.

      Diamond Member Audited Supplier

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