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US$0.50-6.65 / Piece

PCB Assembly 6 Layer 3oz High Density Interconnect Multilayer HDI PCB Circuit Board pictures & photos

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What is PCB Assembly 6 Layer 3oz High Density Interconnect Multilayer HDI PCB Circuit Board

Name: PCB Assembly 6 Layer 3oz High Density Interconnect Multilayer HDI PCB Circuit Board
Uploaded: 2025-12-20T13:04:54+08:00
Description: PCB Parameters: PCB SIZE 170 x 64 BOARD TYPE Double sided PCB Number of Layers 2 layers Surface Mount Components YES Through Hole Components no LAYER STACKUP copper ------- 18um(0.5oz)+plate TOP la

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Price

Purchase Qty. Reference FOB Price

1-9,999 Pieces US$6.65

10,000+ Pieces US$0.50

Sepcifications

Type Rigid Circuit Board
Dielectric FR-4
Material Fiberglass Epoxy
Application Communication
Flame Retardant Properties V0
Mechanical Rigid Rigid
Processing Technology Electrolytic Foil
Base Material Copper
Insulation Materials Metal Composite Materials
Brand FL
Transport Package Vacuum Packing
Specification Certificates: UL, ROHS
Trademark FL
Origin China
Board Material Fr-4 (Tg 135 )
Board Thickness 1.6 mm
Copper Thickness 3 Oz (35um)
Surface Treatment HASL Lead Free / Enig
Solder Mask Blue
Silk Screen White
Flying Probe Test Yes
Product Name 12 Layer High Density Interconnect PCB HDI PCB
MOQ 1PCS

Product Description

PCB Parameters: PCB SIZE 170 x 64 BOARD TYPE Double sided PCB Number of Layers 2 layers Surface Mount Components YES Through Hole Components no LAYER STACKUP copper ------- 18um(0.5oz)+plate TOP layer FR-4 0.7 mm copper ------- 18um(0.5oz)+plate BOT layer TECHNOLOGY Minimum ...

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Fastline Circuits Co., Limited

Diamond Member Since 2013

Audited Supplier

Main Products Print Circuit Board, Aluminum PCB, Flexible PCB, Rigid PCB, PCB Prototype, PCB Assembly, ...
Year of Establishment 2006-09-21
Address 3/F, Building B3, Fuqiao No. 4, Fuhai Subdistrict, Baoan District, Shenzhen, Guangdong, China
Plant Area 580 square meters
Registered Capital 1,000,000 RMB
Main Markets North America, South America, Europe, Southeast Asia/ Mideast

PCB Comparison

	PCB Assembly 6 Layer 3oz High Density Interconnect Multilayer HDI PCB Circuit Board Contact Now	Quick View Shenzhen OEM Multilayer PCB Circuit Board Fabrication and Assembly New Energy Solar Inverter PCBA Board Contact Now	Quick View Mu Star Automotive Electronic Circuit Board OEM Customized PCB Manufacture Assembly PCBA Contact Now	Quick View OEM Customized Automotive Electronic PCB Circuit Board Assembly Components Sourcing Bom Service PCBA Contact Now	Quick View OEM Customized Automotive Electronic PCB Circuit Board Assembly Components Sourcing Bom List PCBA Service Contact Now

Transaction Info
	PCB Assembly 6 Layer 3oz High Density Interconnect Multilayer HDI PCB Circuit Board Contact Now	Quick View Shenzhen OEM Multilayer PCB Circuit Board Fabrication and Assembly New Energy Solar Inverter PCBA Board Contact Now	Quick View Mu Star Automotive Electronic Circuit Board OEM Customized PCB Manufacture Assembly PCBA Contact Now	Quick View OEM Customized Automotive Electronic PCB Circuit Board Assembly Components Sourcing Bom Service PCBA Contact Now	Quick View OEM Customized Automotive Electronic PCB Circuit Board Assembly Components Sourcing Bom List PCBA Service Contact Now
Price	US$0.50-6.65 / Piece	US$5.00-30.00 / Piece	US$5.00-30.00 / Piece	US$5.00-30.00 / Piece	US$5.00-30.00 / Piece
Min Order	1 Piece	1 Piece	1 Piece	1 Piece	1 Piece
Payment Terms	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment	LC, T/T, D/P, PayPal, Western Union, Small-amount payment
Quality Control
Product Certification	-	ISO9001/ISO14001/ISO13485/Ts16949/CE/RoHS	ISO9001/ISO14001/ISO13485/Ts16949/CE/RoHS	ISO9001/ISO14001/ISO13485/Ts16949/CE/RoHS	ISO9001/ISO14001/ISO13485/Ts16949/CE/RoHS
Management System Certification	-	-	-	-	-
Trade Capacity
Export Markets	North America, South America, Europe, Southeast Asia/ Mideast	Europe	Europe	Europe	Europe
Annual Export Revenue	-	-	-	-	-
Business Model	-	ODM, OEM	ODM, OEM	ODM, OEM	ODM, OEM
Average Lead Time	Peak Season Lead Time: within 15 workdays Off Season Lead Time: within 15 workdays	Peak Season Lead Time: within 15 workdays, one month Off Season Lead Time: within 15 workdays, one month	Peak Season Lead Time: within 15 workdays, one month Off Season Lead Time: within 15 workdays, one month	Peak Season Lead Time: within 15 workdays, one month Off Season Lead Time: within 15 workdays, one month	Peak Season Lead Time: within 15 workdays, one month Off Season Lead Time: within 15 workdays, one month
Product Attributes
Specification	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy; Application: Communication; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Metal Composite Materials; Brand: FL; Board Material: Fr-4 (Tg 135 ); Board Thickness: 1.6 mm; Copper Thickness: 3 Oz (35um); Surface Treatment: HASL Lead Free / Enig; Solder Mask: Blue; Silk Screen: White; Flying Probe Test: Yes; Product Name: 12 Layer High Density Interconnect PCB HDI PCB; MOQ: 1PCS;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Mu Star; Product Name: PCB Circuit Board PCBA; MOQ: 1PCS; Layers: 1-64 Layers; Board Thickness: 0.4mm-10.0mm; Copper Thickness: 1-10oz; Solder Mask Color: White.Black.Yellow.Green.Red.Blue; Surface Finishing: HASL(Lead-Free), Enig, Immersion Gold, Immersion T; Service: PCB, Components, PCBA, SMT, DIP, Testing Service;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Mu Star; Product Name: PCB Circuit Board PCBA; MOQ: 1PCS; Layers: 1-64 Layers; Board Thickness: 0.4mm-10.0mm; Copper Thickness: 1-10oz; Solder Mask Color: White.Black.Yellow.Green.Red.Blue; Surface Finishing: HASL(Lead-Free), Enig, Immersion Gold, Immersion T; Service: PCB, Components, PCBA, SMT, DIP, Testing Service;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Mu Star; Product Name: PCB Circuit Board PCBA; MOQ: 1PCS; Layers: 1-64 Layers; Board Thickness: 0.4mm-10.0mm; Copper Thickness: 1-10oz; Solder Mask Color: White.Black.Yellow.Green.Red.Blue; Surface Finishing: HASL(Lead-Free), Enig, Immersion Gold, Immersion T; Service: PCB, Components, PCBA, SMT, DIP, Testing Service;	Type: Rigid Circuit Board; Dielectric: FR-4; Material: Fiberglass Epoxy Resin + Polyimide Resin; Application: Medical Instruments; Flame Retardant Properties: V0; Mechanical Rigid: Rigid; Processing Technology: Electrolytic Foil; Base Material: Copper; Insulation Materials: Organic Resin; Brand: Mu Star; Product Name: PCB Circuit Board PCBA; MOQ: 1PCS; Layers: 1-64 Layers; Board Thickness: 0.4mm-10.0mm; Copper Thickness: 1-10oz; Solder Mask Color: White.Black.Yellow.Green.Red.Blue; Surface Finishing: HASL(Lead-Free), Enig, Immersion Gold, Immersion T; Service: PCB, Components, PCBA, SMT, DIP, Testing Service;
Supplier Name	Fastline Circuits Co., Limited	Mu Star (Shenzhen) Industry Co., Ltd.	Mu Star (Shenzhen) Industry Co., Ltd.	Mu Star (Shenzhen) Industry Co., Ltd.	Mu Star (Shenzhen) Industry Co., Ltd.
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