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      Flex PCB Custom Made
      Negotiable
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      What is Quick Rigid Flex PCB Hole Rigid -Flexible Board Custom Made

      About this Item
      Details
      Company Profile

      Price

      Min. Order Reference FOB Price

      1 Piece Negotiable

      Sepcifications

      • Conductive Type Unipolar Integrated Circuit
      • Integration ULSI
      • Operating Temperature -55℃ - 125℃
      • Shape Any Shape
      • Technics Thick Film IC
      • Transport Package Vacuum+Carton Packing
      • Specification RoHS, ISO9001, UL, SGS
      • Trademark FL
      • Origin Shenzhen, China
      • Regular Board Thickness 1.6mm
      • Board Material Fr4, Bt HDI Material
      • Board Layer 4 Layers
      • Surface Finihsing HASL-Lf, Enig, Immersion Gold, Immersion Tin, OSP
      • Copper Thickness 1 Oz
      • Thickness of Copper Foil Wire 8-240 Um(4oz)
      • Min. Hole Size 0.075mm(3mil)
      • Min Pad +/- 0.1mm (4mil)
      • Min Board Thickness 0.1mm Only for Single and Double Sided
      • Min. Line Width/Space 0.05mm (2mil)
      • Outline Machining Accuracy +/- 0.1mm (4mil)
      • Lead Time 6-8 Working Days
      • Silksreen Any You Like
      • Solder Mask Any You Like
      • MOQ 1PCS

      Product Description

      Quick Rigid Flex PCB 0.2 mm Hole PCB Rigid -Flexible PCB Board Fastline could produce 1-26 layers PCB board for electronic products. providing PCB design, PCB fabrication,PCB clone and PCB assembly services. and we have got the UL, ISO, SGS certifications. Pls see our pcb catalog below: 1. ...

      Learn More

      Flex PCB Custom Made Comparison
      Transaction Info
      Price Negotiable US$0.90-9,999.00 / Piece US$0.39-2.50 / Piece US$0.20-2.00 / Piece US$0.10-2.00 / Piece
      Min Order 1 Piece 1 Piece 2 Pieces 2 Pieces 2 Pieces
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment T/T, PayPal, Western Union T/T, PayPal, Western Union T/T, PayPal, Western Union T/T, PayPal, Western Union
      Quality Control
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, Eastern Europe, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
      Annual Export Revenue - - - - -
      Business Model - - ODM, OEM ODM, OEM ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: 1-3 months
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Conductive Type: Unipolar Integrated Circuit;
      Integration: ULSI;
      Operating Temperature: -55℃ - 125℃;
      Shape: Any Shape;
      Technics: Thick Film IC;
      Regular Board Thickness: 1.6mm;
      Board Material: Fr4, Bt HDI Material;
      Board Layer: 4 Layers;
      Surface Finihsing: HASL-Lf, Enig, Immersion Gold, Immersion Tin, OSP;
      Copper Thickness: 1 Oz;
      Thickness of Copper Foil Wire: 8-240 Um(4oz);
      Min. Hole Size: 0.075mm(3mil);
      Min Pad: +/- 0.1mm (4mil);
      Min Board Thickness: 0.1mm Only for Single and Double Sided;
      Min. Line Width/Space: 0.05mm (2mil);
      Outline Machining Accuracy: +/- 0.1mm (4mil);
      Lead Time: 6-8 Working Days;
      Silksreen: Any You Like;
      Solder Mask: Any You Like;
      MOQ: 1PCS;
      Technics: Semiconductor IC;
      Conductive Type: Unipolar Integrated Circuit;
      Integration: GSI;
      Technics: Semiconductor IC;
      Layer: 1-32 Layers;
      Service: OEM/ODM;
      OEM/ODM: Available;
      Test: 100%E-Testing;
      Layer Count: 1-20 Layers;
      Shipping: DHL/UPS/FedEx/Air/Sea;
      Surface Treatmen: OSP, Enig, HASL, AG Immersion;
      Certificate Gurantee: Yes;
      shape: DIP;
      Conductive Type: Unipolar Integrated Circuit;
      Integration: GSI;
      Technics: Semiconductor IC;
      Layer: 1-32 Layers;
      Service: OEM/ODM;
      OEM/ODM: Available;
      Test: 100%E-Testing;
      Layer Count: 1-20 Layers;
      Shipping: DHL/UPS/FedEx/Air/Sea;
      Surface Treatmen: OSP, Enig, HASL, AG Immersion;
      Certificate Gurantee: Yes;
      shape: DIP;
      Conductive Type: Unipolar Integrated Circuit;
      Integration: GSI;
      Technics: Semiconductor IC;
      Layer: 1-32 Layers;
      Service: OEM/ODM;
      OEM/ODM: Available;
      Test: 100%E-Testing;
      Layer Count: 1-20 Layers;
      Shipping: DHL/UPS/FedEx/Air/Sea;
      Surface Treatmen: OSP, Enig, HASL, AG Immersion;
      Certificate Gurantee: Yes;
      shape: DIP;
      Supplier Name

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      Emi International (Hk) Co. Ltd

      Diamond Member Audited Supplier

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

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