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      PCB Circuit Board
      US$16.50-19.50 / Piece
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      What is High Precision Multilayer HDI Fr4 PCB Fab, PCBA Gerber Design SMT Assembly LED Electronic Printed Circuit Board Impedance Control Samples Manufacture

      About this Item
      Details
      Company Profile

      Price

      Purchase Qty. Reference FOB Price

      1-99 Pieces US$19.50

      100-999 Pieces US$18.50

      1,000-9,999 Pieces US$17.50

      10,000+ Pieces US$16.50

      Sepcifications

      • Type Rigid Circuit Board
      • Dielectric FR-4
      • Material Complex
      • Application Communication
      • Flame Retardant Properties V2
      • Mechanical Rigid Rigid
      • Processing Technology Electrolytic Foil
      • Base Material Copper
      • Insulation Materials Organic Resin
      • Brand Customized
      • Transport Package Vacuum + Carton Packing
      • Specification PCB PCBA
      • Trademark Fastline
      • Origin Shenzhen, China
      • Board Thickness 0.5-3 mm
      • Copper Thickness 0.5-8 Oz
      • Material Type Fr-4
      • Surface Finish HASL/OSP/Enig/Enepig/Imsn/Imag
      • Solder Mask Colors Green/White/Blue/Black/Red
      • Silk Screen Colors White / Black
      • Board Layer 1-50 Layers
      • Lead Time 5-15 Days
      • Service OEM/ODM
      • Min Hole 0.1mm
      • Min Trace 3/3mil

      Product Description

      High Precision Multilayer HDI Fr4 PCB Fab, PCBA Gerber Design SMT Assembly LED Electronic Printed Circuit Board Impedance Control Samples Manufacture Product Parameters Product Parameters Model NO. CK-PCB Material Fiberglass Epoxy Application Consumer Electronics Flame Retardant Properties ...

      Learn More

      PCB Circuit Board Comparison
      Transaction Info
      Price US$16.50-19.50 / Piece US$0.90-2.60 / Piece US$1.00-30.00 / Piece US$1.00-2.30 / Piece US$0.20-2.00 / Piece
      Min Order 1 Piece 1 Piece 1 Piece 2 Pieces 1 Piece
      Payment Terms LC, T/T, D/P, PayPal, Western Union, Small-amount payment LC, T/T, PayPal, Western Union, Small-amount payment T/T T/T, PayPal, Western Union T/T, PayPal, Western Union
      Quality Control
      Product Certification - - RoHS, UL / ISO9001, ISO13485, IATF16949 - -
      Management System Certification - - - - -
      Trade Capacity
      Export Markets North America, South America, Europe, Southeast Asia/ Mideast North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Eastern Europe, Southeast Asia, Africa, Mid East, Eastern Asia, Western Europe North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia North America, South America, Europe, Southeast Asia/ Mideast, Africa, East Asia(Japan/ South Korea), Australia
      Annual Export Revenue - - - - -
      Business Model - ODM, OEM - ODM, OEM ODM, OEM
      Average Lead Time Peak Season Lead Time: within 15 workdays
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: within 15 workdays, one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: one month
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Peak Season Lead Time: one month
      Off Season Lead Time: within 15 workdays
      Product Attributes
      Specification
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Complex;
      Application: Communication;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Customized;
      Board Thickness: 0.5-3 mm;
      Copper Thickness: 0.5-8 Oz;
      Material Type: Fr-4;
      Surface Finish: HASL/OSP/Enig/Enepig/Imsn/Imag;
      Solder Mask Colors: Green/White/Blue/Black/Red;
      Silk Screen Colors: White / Black;
      Board Layer: 1-50 Layers;
      Lead Time: 5-15 Days;
      Service: OEM/ODM;
      Min Hole: 0.1mm;
      Min Trace: 3/3mil;
      Type: 94V-0 Multilayer PCB;
      Dielectric: FR-4;
      Material: Customized;
      Application: All;
      Flame Retardant Properties: Customized;
      Mechanical Rigid: Rigid, Fexible, Rigid and Fexible;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper, FPC, Ceramic, Aluminum-Based, High Freque;
      Insulation Materials: Organic Resin;
      Service: PCB+Assembly+Components;
      Solder Mask Color: White.Black.Yellow.Green.Red.Blue;
      Min. Hole Size: 0.15mm;
      Min. Line Spacing: 0.075---0.09mm;
      Surface Finishing: Asl\OSP\Immersion Gold;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Paper Phenolic Copper Foil Substrate;
      Application: Consumer Electronics, Communications, Aerospace;
      Flame Retardant Properties: V0;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Organic Resin;
      Brand: Customized;
      Basic Material: Fr-4;
      PCBA Testing: X-ray, Aoi Test, Function Test;
      PCBA Min. BGA Pitch: 0.2mm;
      Other Service: ODM, OEM, Final Product Assembling;
      PCB Surface Treatment: HASL Lead Free, OPS, Immersion Tin/Gold, etc;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy;
      Application: Communication;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: New Chip;
      Layer: 1-32 Layers;
      Service: OEM/ODM;
      OEM/ODM: Available;
      Test: 100%E-Testing;
      Layer Count: 1-20 Layers;
      Shipping: DHL/UPS/FedEx/Air/Sea;
      Surface Treatmen: OSP, Enig, HASL, AG Immersion;
      Certificate Gurantee: Yes;
      Type: Rigid Circuit Board;
      Dielectric: FR-4;
      Material: Fiberglass Epoxy Resin + Polyimide Resin;
      Application: Consumer Electronics;
      Flame Retardant Properties: V2;
      Mechanical Rigid: Rigid;
      Processing Technology: Electrolytic Foil;
      Base Material: Copper;
      Insulation Materials: Epoxy Resin;
      Brand: New Chip;
      Capacity: 1000000;
      OEM/ODM: Available;
      Sample: Available;
      Surface Treatment: OSP, Enig, HASL, AG Immersion;
      Certificate Gurantee: Yes;
      Test: 100%E-Testing;
      Min Bonding Pad Diameter: 10mil;
      Min Thickness of Soldermask: 10um;
      Color of Silk-Screen: White, Yellow, Black;
      Data File Format: Gerber File and Drilling File, Protel Series, ...;
      Material for PCB: Fr-4, High Tg Fr$, Halogen Free,;
      Layer Count: 1-20 Layers;
      Shipping: DHL/UPS/FedEx/Air/Sea;
      Supplier Name

      Fastline Circuits Co., Limited

      Diamond Member Audited Supplier

      JS Technology Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen Grandtop Electronics Co., Ltd.

      Diamond Member Audited Supplier

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier

      Shenzhen New Chip international Ltd

      Gold Member Audited Supplier