| Specification |
Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Phenolic Paper Laminate;
Application: Aerospace;
Flame Retardant Properties: V2;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Fr4;
Insulation Materials: Organic Resin;
Brand: Fastline;
Board Thickness: 1.6mm;
Copper Thickness: 1oz;
Material Type: Fr4;
Surface Treatment: HASL Lead Free;
Solder Mask: Green, Red, Blue, Black;
Silk Screen Color: White;
Board Layer: 6 Layer;
Shipping Type: DHL, UPS, TNT, EMS, FedEx etc;
Packing Type: Carton + Vacuum;
Lead Time: 5-7 Days;
MOQ: 1 PCS;
Testing: 100%;
Service: One-Stop;
Supply: Fast;
File: PCB File;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-6;
Material: Phenolic Paper Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Additive Process;
Base Material: Aluminum;
Insulation Materials: Organic Resin;
Brand: Gt;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Medical Instruments;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: Gt;
PCBA-Testing: X-ray, Aoi;
Small Order: Acceptable;
Type: Rigid Circuit Board;
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Structure: Multilayer Rigid PCB;
Dielectric: FR-4;
Material: Fr4;
Application: Consumer Electronics, Medical Device;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Tg: Tg130-Tg180;
Inner Copper: 1 Oz;
Finish Copper: 2 Oz;
Solder Mask: Green;
Silk: White;
Surface Finish: HASL;
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Structure: Double-Sided Rigid PCB;
Dielectric: FR-4;
Material: Polyester Glass Fiber Mat Laminate;
Application: Consumer Electronics;
Flame Retardant Properties: V0;
Processing Technology: Electrolytic Foil;
Production Process: Subtractive Process;
Base Material: Copper;
Insulation Materials: Organic Resin;
Brand: OEM PCB;
Surface Finishing: HASL, Enig, OSP, Immersion Au, AG, Sn;
Layer: 1-18 Layer;
Copper Thickness: 0.5oz-6oz;
Board Thickness: 0.2mm-4mm;
Min.Hole Size: 0.1mm (4 Mil);
Min.Line Spacing: 0.1mm (4 Mil);
PCBA QC: X-ray, Aoi Test, Function Test(100% Test);
Specialised: LED, Medical, Industrial, Control Board;
Delivery: PCB, 7-10 Days;PCBA, 2-3weeks;
Service: Printed Circuit Board, PCB, PCBA, SMT, Tht, Test;
Other Service: PCBA Layout and Design, Engineering Support;
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